封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | TSSOP |
| Pkg. Code: | pkg_8309 |
| Lead Count (#): | 8 |
| Pkg. Dimensions (mm): | 2.9 x 2.8 x 1.03 |
| Pitch (mm): | 0.65 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.33.0001 |
| RoHS (READ2303GSN#GC0) | 英语日文 |
产品属性
| Lead Count (#) | 8 |
| Carrier Type | Embossed Tape |
| Moisture Sensitivity Level (MSL) | 1 |
| Pkg. Dimensions (mm) | 3 x 3 x 1.03 |
| Pb (Lead) Free | Yes |
| Country of Assembly | JAPAN |
| Country of Wafer Fabrication | JAPAN |
| Bandwidth (MHz) | 0.55 |
| CMRR (dB) | 80 |
| Channels (#) | 2 |
| Common Mode Input Voltage Range (V) | 1.8 - 5.5 |
| Enable | - |
| Family Name | General-purpose Op Amps |
| Function | Low Voltage CMOS Dual Operational AmplifierUltra-Small Low Voltage Drive, Input Output Full Range |
| Gain Min | 80dB |
| IBIAS (nA) | 0.001 |
| IS (mA) | 0.08 |
| IS per Amp (mA) | 0.04 |
| Input Offset Voltage Vio (Max) (mV (±)) | 6 |
| Lead Compliant | No |
| Length (mm) | 3 |
| Longevity | 2027 12月 |
| MOQ | 5000 |
| Min Operating Temperature (°C) | -40 |
| Offset Voltage (Max) (mV) | 6 |
| Output Voltage Swing Range (V) | VSS+0.1 - VDD-0.1 |
| Pb Free Category | Yes |
| Pitch (mm) | 0.65 |
| Pkg. Type | TSSOP |
| Price (USD) | $0.96108 |
| Process | CMOS |
| Qty. per Reel (#) | 5000 |
| Qualification Level | Standard |
| Rail-to-Rail Input | Yes |
| Rail-to-Rail Output | Yes |
| Remarks | Input/Output full swing |
| Simulation Model Available | SPICE |
| Single Supply Voltage Range (V) | 1.8 - 5.5 |
| Slew Rate (V/µs) | 0.35 |
| Supply Current Icc/Idd (Max) (mA) | 0.04 |
| Supply Voltage Vcc Range | 1.8 - 5.5 |
| Tape & Reel | No |
| Temp. Range (°C) | -40 to +105 |
| Thermal Shutdown | No |
| Thickness (mm) | 1.03 |
| Topology [Rail 1] | - |
| VS (Max) (V) | 5.5 |
| VS (Min) (V) | 1.8 |
| Width (mm) | 3 |
有关 READ2303G 的资源
描述
READ2303G 是一款输入和输出全范围双通道 CMOS 运算放大器，可实现低电压和低电流消耗工作。 该 IC 可在 1.8V 的最小工作电源电压和 -40 °C 至 +105 °C 的宽环境温度范围下使用。
READ2303G采用超小型 8 引脚 TSSOP 和 MSOP 封装。