封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEW |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Pkg. Type | WAFER |
| Lead Count (#) | 0 |
| Carrier Type | WFP |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -5 to 95°C |
| Country of Wafer Fabrication | UNITED STATES |
| Application | 800G coherent systems with 128Gbaud QAM modulation format |
| Channels (#) | 2 |
| Data Rate Max (Gbps) | 128 |
| Function | Linear TIA |
| MOQ | 70 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Price (USD) | $220.40029 |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| 已发布 | No |
有关 RG8G3122A 的资源
描述
The RG8G3122A is a dual-channel 128Gbaud linear transimpedance amplifier (TIA) for 800G and beyond integrated coherent receivers (ICRs).
The RG8G3122A integrates two TIA signal paths for I and Q channels. The high-performance, low power, and compact design of the RG8G3122A also enable optical subassembly such as u-ICR and IC-TROSA used for small form factor integrated optical modules.