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750V – 300A – IGBT Chip

封装信息

CAD 模型:View CAD Model
Pkg. Type:Sawn Wafer
Pkg. Code:
Lead Count (#):
Pkg. Dimensions (mm):
Pitch (mm):

环境和出口类别

Pb (Lead) FreeNo
Moisture Sensitivity Level (MSL)
ECCN (US)
HTS (US)

产品属性

Pkg. TypeSawn Wafer
Pb (Lead) FreeNo
ApplicationInverter
Channels (#)1
IC (A)300
Ic (Peak) (A)900
Lead CompliantNo
MOQ1
Nch/PchNch
Qualification LevelAutomotive
Simulation Model AvailableYes
Tape & ReelNo
TechnologyAE4
Tj (°C)175
VCE (sat) (V)1.4
VCES (V)750
VGE (Off) (V)6.5
tf (Typical) (µs)0.122
tsc (μs)6

描述

Renesas' AE4 IGBTs for automotive applications use a unique trench gate configuration in its process structure. These devices achieve low saturation voltage without sacrificing robustness and also have low switching losses. This 750 V/300 A IGBT is optimized for high-power applications such as hybrid and electric vehicle drive inverters.