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瑞萨电子 (Renesas Electronics Corporation)
高能效多核架构微处理器,具备面向物联网边缘应用的先进连接能力

封装信息

CAD 模型:View CAD Model
Pkg. Type:LFBGA
Pkg. Code:pkg_20168
Lead Count (#):368
Pkg. Dimensions (mm):17 x 17 x 1.4
Pitch (mm):0.65

环境和出口类别

Moisture Sensitivity Level (MSL)3
RoHS (R9A08G045SE8GBG#BC0)英语日文
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

产品属性

Carrier TypeFull Carton (Tray)
Family NameRZ
Series NameRZ/G
Group NameG3SE
CPU ArchitectureArm
Main CPUCortex-A55 x 4 + Cortex-M33 x 1
Sub CPUCortex-M33
Floating Point UnitDouble
Bit Length64
Program Memory (KB)0
Data Flash (KB)0
RAM (KB)512
ECC SRAMYes
Lead Count (#)368
Pkg. TypeLFBGA
Pitch (mm)0.65
Pkg. Dimensions (mm)17 x 17 x 1.4
Number of Supply Voltage(s) (#)7
Supply Voltage (V)3 - 3.6
I/O Ports113
DMAC or DTCDMAC
DMA (ch)32
Temperature Sensor (ch) (#)1
Power-On ResetNo
Watchdog Timer (ch)3
External Memory Bus (bit)16
DRAM I/FLPDDR4-2133/DDR4-2133 (16-bit)
NPUNo
3D GPUNo
AcceleratorNo
MOQ672
Temp. Range (°C)Tj = -40 to +125
External Interrupt Pins (#)16
LVD or PVDNo
Operating Freq (Max) (MHz)1200
Operating Freq of Sub CPU (Max)200
Sub-clock (32.768 kHz)No
On-chip OscillatorNo
Ethernet speed10M/100M/1G
Ethernet (ch)2
EtherCat (ch) (#)0
USB Ports (#)2
USB FS (host ch/device ch)( 2 / 2 )
USB HS (host ch/device ch)( 2 / 2 )
USB SS (host ch/device ch)( 0 / 0 )
PCI Express (generation and ch)PCIe (Gen2.0 1Lane) x 1 ch
SCI or UART (ch)10
SPI (ch)3
QSPI (ch)1
OSPI (ch)1
I2C (#)4
I3C (ch)1
CAN (ch)3
CAN-FD (ch)3
WirelessNo
IrDANo
LIN (#)0
SDHI (ch)3
High Resolution Output TimerNo
PWM Output (pin#)17
32-Bit Timer (ch)9
16-Bit Timer (ch) (#)8
8-Bit Timer (ch)0
Standby operable timerNo
Asynchronous General Purpose Timer / Interval Timer (ch)0
RTCYes
16-Bit A/D Converter (ch)0
14-Bit A/D Converter (ch)0
12-Bit A/D Converter (ch)8
10-Bit A/D Converter (ch)0
24-Bit Sigma-Delta A/D Converter (ch)0
16-Bit D/A Converter (ch)0
12-Bit D/A Converter (ch)0
10-Bit D/A Converter (ch) (#)0
8-Bit D/A Converter (ch)0
Analog Comparator (ch)0
OPAMP (ch) (#)0
PGA (ch)0
Capacitive Touch Sensing Unit (ch)0
Graphics LCD ControllerNo
MIPI Interfaces (DSI) (ch)1
MIPI Interfaces (CSI) (ch)1
Camera I/F (Parallel)No
Image CodecNo
2D Drawing EngineNo
Segment LCD ControllerNo
SSI (ch)4
Security & EncryptionAES, RSA, ECC, SHA-1, SHA-224/SHA-256, GHASH, TRNG
Debug InterfaceJTAG/SWD
Moisture Sensitivity Level (MSL)3
Assembly LocationTAIWAN
Wafer Fab LocationTAIWAN
CPUCortex-A55 x 4 + Cortex-M33 x 1
Family NameRZ
Group NameG3SE
Lead CompliantYes
Length (mm)17
Pb (Lead) FreeYes
Suggested KitsRZ/G3L-EVKIT
Tape & ReelNo
Thickness (mm)1.4
Width (mm)17

描述

RZ/G3SE 是一款专为物联网设备设计的微处理器(MPU),在单芯片上集成了四核 CPU、微控制器内核、PCIe 接口以及支持 TSN 的千兆以太网。 凭借低功耗待机能力和先进的安全功能,RZ/G3SE 可降低系统功耗,并提高物联网设备和边缘计算应用的可靠性。 强大的硬件安全功能可保护物联网终端免受网络攻击。 内置的显示器接口非常适合需要显示功能的应用。 RZ/G3SE 与 RZ/G3L 的引脚完全兼容,使用户能够复用相同的 PCB 设计,并高效地将开发工作扩展至各类应用领域,从带显示功能的 HMI 设备到无显示功能的物联网设备,均可覆盖。