封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | TQFN |
| Pkg. Code: | |
| Lead Count (#): | 20 |
| Pkg. Dimensions (mm): | 2.0 x 3.0 |
| Pitch (mm): |
环境和出口类别
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
| Moisture Sensitivity Level (MSL) |
产品属性
| Pkg. Type | TQFN |
| Lead Count (#) | 20 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +105°C |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | TAIWAN |
| # of Programable Delays (#) | 1 |
| ACMP Channels (#) | 4 |
| Additional Features | Supported in Go Configure™ Software Hub |
| CNT/DLY (Max) (#) | 7 |
| Carrier Type | Tape & Reel |
| DFF (Max) (#) | 8 |
| GPIOs (#) | 18 |
| Interface | I2C |
| LUTs (Max) (#) | 17 |
| Longevity | 2032 9月 |
| Look-up Table (LUTs) | 17 |
| Memory Type | OTP |
| Oscillator Type | Conf. OSC, RC OSC |
| Pattern Generator | 1 |
| Pipe Delay | 16-stage |
| Pkg. Dimensions (mm) | 2.0 x 3.0 |
| Special Features | ASM (8 states) |
| Temperature Sensor (ch) (#) | 1 |
有关 SLG46537-E 的资源
描述
SLG46537-EV 提供一个体积小、低功耗元件，来实现常用的混合信号功能。 用户通过对非易失性存储器 (NVM) 进行编程来创建电路设计、以配置 SLG46537-EV 的互连逻辑、IO 引脚和宏单元。 这种高度通用的器件允许在非常細小而低功耗的单个集成电路中设计出各种混合信号功能。