封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | MSTQFN |
| Pkg. Code: | |
| Lead Count (#): | 22 |
| Pkg. Dimensions (mm): | 2.0 x 2.2 |
| Pitch (mm): | 0.4 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
产品属性
| Lead Count (#) | 22 |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Pkg. Dimensions (mm) | 2.0 x 2.2 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +85°C |
| Country of Assembly | CHINA, TAIWAN |
| Country of Wafer Fabrication | TAIWAN |
| Additional Features | Supported in Go Configure™ Software Hub |
| MOQ | 3000 |
| Nominal VDD | 1.71 - 5.5 |
| Pattern Generator | 1 |
| Pitch (mm) | 0.4 |
| Pkg. Type | MSTQFN |
| Qty. per Reel (#) | 3000 |
| Special Features | ASM (8 states) |
有关 SLG46537 的资源
描述
SLG46537V/M 提供一个小型低功耗元件来实现常用的混合信号功能。 用户通过对一次性可编程 (OTP) 非易失性存储器 (NVM) 进行编程来配置 SLG46537V/M 的互连逻辑、IO 引脚和宏单元，从而进行电路设计。 这款高灵活性的器件能在超小尺寸、超低功耗的单个集成电路中实现丰富多样的混合信号功能设计。