封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | MSTQFN |
| Pkg. Code: | |
| Lead Count (#): | 22 |
| Pkg. Dimensions (mm): | 2.0 x 2.2 |
| Pitch (mm): | 0.4 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
产品属性
| Lead Count (#) | 22 |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Pkg. Dimensions (mm) | 2.0 x 2.2 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +85°C |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | TAIWAN |
| Additional Features | Supported in Go Configure™ Software Hub |
| MOQ | 3000 |
| Pattern Generator | 1 |
| Pitch (mm) | 0.4 |
| Pkg. Type | MSTQFN |
| Qty. per Reel (#) | 3000 |
| Special Features | ASM (8 states) |
有关 SLG46537 的资源
描述
The SLG46537V/M provides a small, low-power component for commonly used mixed-signal functions. The user creates their circuit design by programming the one-time programmable (OTP) non-volatile memory (NVM) to configure the interconnect logic, the I/O pins, and the macrocells of the SLG46537V/M. This highly versatile device allows for a wide variety of mixed-signal functions to be designed within a very small, low-power single integrated circuit.