封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | TQFN |
| Pkg. Code: | |
| Lead Count (#): | 20 |
| Pkg. Dimensions (mm): | 2.0 x 3.0 |
| Pitch (mm): |
环境和出口类别
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
产品属性
| Lead Count (#) | 20 |
| Carrier Type | Tape & Reel |
| Temp. Range (°C) | -40 to +85°C |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | TAIWAN |
| # of Programable Delays (#) | 1 |
| ACMP Channels (#) | 4 |
| Additional Features | Supported in Go Configure™ Software Hub |
| CNT/DLY (Max) (#) | 5 |
| DFF (Max) (#) | 9 |
| GPIOs (#) | 9 |
| Interface | I2C |
| LUTs (Max) (#) | 15 |
| Memory Type | OTP |
| Moisture Sensitivity Level (MSL) | 1 |
| Oscillator Type | Conf. OSC, LF OSC |
| Pb (Lead) Free | Yes |
| Pipe Delay | 16-stage |
| Pkg. Dimensions (mm) | 2.0 x 3.0 |
| Pkg. Type | TQFN |
| Special Features | 2x LDO, ASM (8 states), RTC |
| Temperature Sensor (ch) (#) | 1 |
有关 SLG46582 的资源
描述
The SLG46582 is a small, low-power component commonly used to integrate mixed-signal functions under the control of an asynchronous state machine. The user creates the circuit design by programming the one-time programmable (OTP) non-volatile memory (NVM) to configure the interconnect logic, the I/O pins, and the macrocells of the SLG46582. This highly versatile device allows for a wide variety of functions and control logic to be designed within a very small, low-power monolithic integrated circuit.