封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | TQFN |
| Pkg. Code: | |
| Lead Count (#): | 20 |
| Pkg. Dimensions (mm): | 2.0 x 3.0 |
| Pitch (mm): | 0.4 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
产品属性
| Lead Count (#) | 20 |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| ACMP Channels (#) | 4 |
| Pitch (mm) | 0.4 |
| Pkg. Dimensions (mm) | 2.0 x 3.0 |
| Qty. per Reel (#) | 3000 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +85°C |
| Country of Assembly | CHINA, TAIWAN |
| Country of Wafer Fabrication | TAIWAN |
| # of Programable Delays (#) | 1 |
| Additional Features | Supported in Go Configure™ Software Hub |
| CNT/DLY (Max) (#) | 8 |
| D Flip-flops (DFFs) (#) | 17 |
| DCMP | - |
| GPIOs (#) | 17 |
| Interface | I2C |
| LUTs (Max) (#) | 19 |
| Longevity | 2038 五月 |
| MOQ | 3000 |
| Memory Type | MTP |
| Nominal VDD | 2.3 - 5.5 |
| Oscillator Type | RC OSC, LF OSC, Ring OSC |
| Pattern Generator | 1 |
| Pipe Delay | 16-stage |
| Pkg. Type | TQFN |
| Price (USD) | $0.92298 |
| Temperature Sensor (ch) (#) | 1 |
| VDD2 (V) | 1.71 - 5.5 |
有关 SLG46826 的资源
描述
SLG46826 可编程混合信号矩阵 IC 支持系统内编程，提供了一个小型低功耗组件来实现常用的混合信号功能。 用户通过对多时间可编程非易失性存储器 (NVM) 进行编程来配置 SLG46826 的互连逻辑、IO 和宏单元，从而进行电路设计。 这款高灵活性的器件能在超小尺寸、超低功耗的单个集成电路中实现丰富多样的混合信号功能设计。