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特性

  • Digital compensation of sensor offset, sensitivity, temperature drift and non-linearity
  • Accommodates differential sensor signal spans from 3 mV/V to 105 mV/V
  • ZACwire™ one-wire interface (OWI)
  • Internal temperature compensation and detection via bandgap PTAT (proportional to absolute temperature)
  • Optional sequential output of both temperature and bridge readings on ZACwire™ digital output
  • Output options: ratiometric analog voltage, absolute analog voltage, digital one-wire-interface
  • Supply voltage 2.7V to 5.5 V, with external JFET 5.5V to 30 V
  • Current consumption, depending on adjusted sample rate, 0.25 mA to 1 mA
  • Wide operational range -50°C to +150°C
  • Fast response time 1 ms
  • High voltage protection up to 30V with external JFET
  • Buffered and chopper-stabilized output DAC

描述

The ZSC31010 is a CMOS integrated circuit, which enables easy and precise calibration of resistive bridge sensors via EEPROM. When mated to a resistive bridge sensor, it will digitally calibrate offset and gain with the option to calibrate offset and gain coefficients and linearity over temperature. A second-order compensation can be enabled for temperature coefficients of gain or offset or bridge linearity. ZSC31010 communicates via IDT's ZACwire™ serial interface to the host computer and is easily mass calibrated in a Windows™ environment. Once calibrated, the output SIG™ pin can provide selectable 0 to 1 V absolute analog output; rail-to-rail ratiometric analog output; or digital serial output of bridge data with optional temperature data.

产品参数

属性
Function Resistive SSC
Automotive Qual. No
Supply Voltage (V) -
Input Type Single-bridge
Interface Ratiometric Voltage, Absolute Voltage, ZACwire™
Adj. Analog Gain - , - , - , -
Resolution (bits) 14
Sample Rate Max (KHz) 1
Temp. Range (°C) -40 to 85°C, -50 to 150°C

封装选项

Pkg. Type Pkg. Dimensions (mm) Lead Count (#) Pitch (mm)
SOIC 4.9 x 3.9 x 1.5 8 1.27
WAFER 0.0 x 0.0 x 0.0

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A brief introduction and overview of IDT's (acquire by Renesas) sensor signal conditioner evaluation kits. Evaluation kits generally consist of three parts: a communication interface board, a device board, and a sensor simulator board - all connected together. A sophisticated software GUI accompanies the kit, enabling an engineer to learn how to use the part rapidly, do quick prototyping, and practice calibrations.

Presented by David Grice, applications engineer at IDT. For more information about IDT's sensor signal conditioner products, visit the Sensor Signal Conditioner page.