Wireless Connectivity

Adding Bluetooth® Low Energy (LE) capabilities to a system can be a challenging task for users new to the technology. From component selection to RF layouts and regulatory certifications, there are many jobs to be done to create an end product with the necessary wireless performance and approvals.

Using a certified module can help tremendously in this task. All of Renesas' Bluetooth LE modules come certified to regulatory compliance, Bluetooth qualification and external circuitry so customers no longer have to integrate into their product by themselves. Products marked "available" in the built-in antenna and external antenna columns of the parametric search table are provided as modular products. Renesas also provides a guideline for acquiring Bluetooth qualification for final products.

Success Stories

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产品选型表

    Processing table
    Application
    Wireless Standard
    Proprietary 2G4 protocol
    CPU
    Flash Memory (KB)
    ROM (KB)
    Memory Size (OTP) (KB)
    RAM (KB)
    GPIOs (#)
    Supply Voltage Vcc Range
    Integrated DCDC
    Integrated Battery Charger
    External Rails and Load Capacity
    Tx Current (mA)
    Rx current (mA)
    Output Power Range (dBm)
    Sensitivity (dBm) (dBm)
    Clock Rate (MHz)
    Flexible System Clock
    Execute from FLASH
    Hardware Crypto Engine
    QSPI Interface (#)
    SPI (#)
    I2C (#)
    UART (#)
    ADC
    USB Ports (#)
    LE Data Length Extensions
    2Mbps
    LE Coded PHY (Long Range)
    Advertising Extensions
    Periodic Advertising
    AoA
    AoD
    GATT Caching
    Bluetooth® Mesh
    Pkg. Type
    器件号
    DA14701
    超高集成度的蓝牙™ 5.2单芯片解决方案    		 Rechargeables, HMI, Wearables, Smart Home, E-bike, Consoles BLE 5.2 Core specification + optional features Yes M33F 0 32 4 1536 79 2.9-4.75 Yes, Low-IQ SIMO Buck & 4.5-5V Boost Yes, 720mA JEITA compliant charger 2 x 1.8V @ 100mA each 3 1.85 6 -97 160 是的 是的 是的 3 3 4 3 11 ENOB, 16Ksps with PGA 1 Supported Supported No CABGA
    DA14705
    超高集成度的蓝牙™ 5.2单芯片解决方案    		 Rechargeables, HMI, Wearables, Smart Home, E-bike, Consoles BLE 5.2 Core specification + optional features Yes M33F 0 32 4 1536 79 2.9-4.75 Yes, Low-IQ SIMO Buck & 4.5-5V Boost Yes, 720mA JEITA compliant charger 2 x 1.8V @ 100mA each 3 1.85 6 -97 160 是的 是的 是的 3 3 4 3 11 ENOB, 16Ksps with PGA 1 Supported Supported No CABGA
    DA14706
    超高集成度的蓝牙™ 5.2单芯片解决方案    		 Rechargeables, HMI, Wearables, Smart Home, E-bike, Consoles BLE 5.2 Core specification + optional features Yes M33F 0 32 4 1536 79 2.9-4.75 Yes, Low-IQ SIMO Buck & 4.5-5V Boost Yes, 720mA JEITA compliant charger 2 x 1.8V @ 100mA each 3 1.85 6 -97 160 是的 是的 是的 3 3 4 3 11 ENOB, 16Ksps with PGA 1 Supported Supported No CABGA
    DA14708
    超高集成度的蓝牙™ 5.2单芯片解决方案    		 Rechargeables, HMI, Wearables, Smart Home, E-bike, Consoles BLE 5.2 Core specification + optional features Yes M33F 0 32 4 1536 79 2.9-4.75 Yes, Low-IQ SIMO Buck & 4.5-5V Boost Yes, 720mA JEITA compliant charger 2 x 1.8V @ 100mA each 3 1.85 6 -97 160 是的 是的 是的 3 3 4 3 11 ENOB, 16Ksps with PGA 1 Supported Supported No CABGA
    DA14530
    SmartBond™ Low Power Bluetooth 5.1 System-on-Chip    		 Low cost BLE connectivity front-end and data pipe BLE 5.1 Core specification No M0+ 0 144 32 48 12 1.8-3.3 N/A No 3.5 2.2 2.5 -94 16 是的 否 是的 1 1 2 4ch 10b 0 Supported FCGQFN
    DA14531
    SmartBond™ Ultra-Low Power Bluetooth® 5.1 System-on-Chip    		 Asset tracking, Beacons, Connected health, Disposables, RCU BLE 5.1 Core specification No M0+ 0 144 32 48 12 1.1-3.6 Integrated Buck/Boost DC-DC converter No 3.5 2.2 2.5 -94 16 是的 否 是的 1 1 2 4ch 10b 0 Supported FCGQFN, WLCSP
    DA14531MOD
    SmartBond TINY™ Bluetooth® Low Energy Module    		 Asset tracking, Beacons, Connected health, Disposables, RCU BLE 5.1 Core specification No M0+ 0 144 32 48 12 1.1-3.6 Integrated Buck DC-DC converter No 3.5 2.2 2.2 -94 16 是的 否 是的 1 1 2 4ch 10b 0 Supported MODULE
    DA14585
    SmartBond™ Bluetooth 5.0 SoC with Audio Interface    		 Beacons, Proximity Tags, Human Interface Devices, RCU BLE 5.0 Core specification No M0 0 128 64 96 14, 25 0.9-3.5 Integrated Buck/Boost DC-DC converter No 4.8, 4.9 5.1, 5.3 -93 16 否 否 是的 1 1 2 4ch 10b 0 Supported QFN40, WLCSP34
    DA14586
    SmartBond™ Bluetooth 5.0 SoC with Audio Interface and 2Mbit Flash    		 Beacons, Proximity Tags, Human Interface Devices, RCU BLE 5.0 Core specification No M0 256 128 64 96 24 1.8-3.5 Integrated Buck DC-DC converter No 4.9 5.3 -93 16 否 否 否 1 1 2 4ch 10b 0 Supported QFN40
    DA14682
    SmartBond™ Bluetooth® Low Energy 5.0 SoC with Enhanced Security and Flash    		 Rechargeable devices, charging cases, USB-to-BLE dongles BLE 5.0 Core specification No M0 1024 128 64 128 31 1.7-4.75 SIMO Buck DC-DC converter Yes, 400mA USB charger 1.8V @ 75mA 5.2 6 -94 96 是的 是的 是的 2 2 2 8ch 10b 1 Supported On request AQFN60
    DA14683
    SmartBond™ Bluetooth® Low Energy 5.0 SoC with Enhanced Security    		 Rechargeable devices, Banking, Industrial, USB-to-BLE dongles BLE 5.0 Core specification No M0 0 128 64 128 37 1.7-4.75 SIMO Buck DC-DC converter Yes, 400mA USB charger 1.8V @ 75mA 5.2 6 -94 96 是的 是的 是的 1 2 2 2 8ch 10b 1 Supported On request AQFN60, WLCSP53
    DA14691
    Multi-Core Bluetooth® 5.2 SoC with System Power Management Unit    		 General purpose connectivity MCU BLE 5.2 Core specification + optional features Yes M33F 0 128 4 384 44 2.4-4.75 SIMO Buck DC-DC converter No 1x 3V @ 110mA, 3x 1.8V @ 50mA each 3 1.8 -97 96 否 否 否 1 2 2 3 8ch 10b, 8ch 14b 1 Supported Supported Supported Supported Supported TX Supported
    DA14695
    Multi-Core Bluetooth® 5.2 SoC with System Power Management Unit    		 Rechargeable devices, HMI BLE 5.2 Core specification + optional features Yes M33F 0 128 4 512 44 2.4-4.75 SIMO Buck DC-DC converter Yes, 560mA JEITA compliant charger 3x 1.8V @ 50mA each 3 1.8 6 -97 96 否 否 否 1 2 2 3 8ch 10b, 8ch 14b 1 Supported Supported Supported Supported Supported TX Supported VFBGA86
    DA14695MOD
    SmartBond Bluetooth® LE 5.2, High-integration (including USB Charger) Module    		 Rechargeable devices, HMI BLE 5.2 Core specification + optional features Yes M33F 32000 128 4 512 40 2.4-4.75 SIMO Buck DC-DC converter Yes, 560mA JEITA compliant charger 1x 3V @ 150mA, 3x 1.8V @ 50mA each 3 1.8 6 -96 96 否 是的 是的 1 2 2 3 4ch 10b, 4ch 14b 1 Supported Supported Not Supported Supported Supported Supported TX Supported Not Supported Not Supported MODULE
    DA14697
    Multi-Core Bluetooth® 5.2 SoC with System Power Management Unit    		 Rechargeable devices, HMI, Wearables BLE 5.2 Core specification + optional features Yes M33F 0 128 4 512 55 2.4-4.75 SIMO Buck DC-DC converter Yes, 560mA JEITA compliant charger 3x 1.8V @ 50mA each 3 1.8 6 -97 96 否 否 否 2 2 2 3 8ch 10b, 8ch 14b 1 Supported Supported Supported Supported Supported TX Supported VFBGA
    DA14699
    Multi-Core Bluetooth® 5.2 SoC with System Power Management Unit    		 Rechargeable devices, HMI, Wearables, 'Analog' Smart Watches BLE 5.2 Core specification + optional features Yes M33F 0 128 4 512 55 2.4-4.75 SIMO Buck DC-DC converter Yes, 560mA JEITA compliant charger 3x 1.8V @ 50mA each 3 1.8 6 -97 96 否 否 否 2 2 2 3 8ch 10b, 8ch 14b 1 Supported Supported Supported Supported Supported TX Supported
    RA4W1
    带有 48 MHz Bluetooth® 5.0 的低功耗单芯片 32 位微控制器    		 BLE 5.0 Core specification + optional features ARM CM4 512 96 35 1.8-3.6 4.5 3.3 4 -95 48 否 否 否 0 2 2 6 14-bit x 8-ch 1 Supported Supported Supported Not Supported Not Supported Not Supported Supported QFN
    RL78/G1D
    Bluetooth® Low Energy Microcontrollers for Smart Connectivity    		 BLE 5.0 Core specification RL78 128, 192, 256 12, 16, 20 32 1.6-3.6 4.3 3.5 -90 32 否 否 否 0 0 3 2 10-bit x 8-ch 0 Not Supported Not Supported Not Supported Not Supported Not Supported Not Supported Not Supported HWQFN
    RX23W
    32位单片机和模块产品，可在单个芯片上实现Bluetooth®5无线通信和系统控制，适用于IoT终端设备    		 BLE 5.0 Core specification + optional features RXv2 512, 384 64 44, 30 1.8-3.6 4.3 3 4 -95 54 否 否 否 0 4, 5 4, 5 3, 4 12-bit x 8-ch, 12-bit x 14-ch 1 Supported Supported Supported Not Supported Not Supported Not Supported Supported HVQFN, TFBGA, TFLGA
    RYZ012x1
    蓝牙低功耗 (LE) 模块    		 BLE 5.0 Core specification Original 32-bit 1.8-3.6 4.8 5.3 10 -96 否 否 否 0 0 Supported Supported Not Supported Not Supported Not Supported Not Supported Not Supported LGA
    Parametric Table tips

    Tips for Using This Parametric Table:

    • Hide Filters button in header: Collapse or expands filters
    • Column sort buttons in header: Sort Column alphabetically / numerically descending or ascending
    • Reset button in header: Reset all filters to the page default
    • Full Screen button in header: Expand the table to full screen view (user must close out of full screen before they can interact with rest of page)
    • Export button in header: Export the filtered results of the table to an Excel document
    • Filter parts search bar in header: Type to filter table results by part number
    • Hide column button in column headers: Select to hide columns in table
    • AND / OR toggle switches in header: Toggles the logic of this particular filter to be “AND” or “OR” logic for filtering results
    • Multiselect checkboxes at beginning of each row in table: Select these checkboxes to compare products against each other
    • Document icon next to product name in row: View the featured document for this product
    • Chip icon next to the right of the document icon in row: View the block diagram for this product
    • Cart icon to the right of the chip icon: Indicates that samples are available for this product

    文档

    文档标题
    		类型 日期
    Bluetooth LE microcomputer / module Bluetooth qualification acquisition Application Notes Rev.1.50
    PDF 1.10 MB 日文     		应用文档
    RYZ012x1 Bluetooth qualification acquisition Application Note
    PDF 1.08 MB 日文
    相关文件：
    		应用文档
    Renesas Bluetooth LE Product Portfolio
    PDF 227 KB 日文     		概览
    VAD Support on Smart Devices
    PDF 484 KB     		白皮书
    Smart Devices Enabled to Efficiently Communicate, Sense, Hear, Act and Interact with User
    PDF 716 KB     		白皮书
    5 items
    Princess Cruise Lines Uses WiRa Technology From Renesas To Deliver A Customized Passenger Experience

    Princess CEO John Padgett talks about transforming the cruise industry with the Renesas DA14695 multi-core Bluetooth® SoC with WiRa in their onboard medallion system to monitor 4,000 Wi-Fi access points, 2,000 crew devices and 8,000 sensors in real time.

    Video List
    Princess Cruise Lines Uses WiRa Technology From Renesas To Deliver A Customized Passenger Experience
    Low Power Keyword Detection on DA1470x
    Build low-power, small form factor smart IoT devices
    Wearable UI Demo on DA1470x Using LVGL on DA1470x
    RYZ012 Certified Bluetooth 5.0 LE Modules

    活动与在线研讨会

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