概述
The DA14531 SmartBond TINY™ Development Kit Pro (DA14531-00FXDEVKT-P) is the ideal way to quickly and easily get started developing applications and products using the DA14531 Bluetooth® Low Energy (LE) system-on-chip (SoC).
The DA14531-00OGDB-P is the WL-CSP daughterboard that can be ordered separately for the DA14531 SmartBond TINY™ Development Kit Pro's motherboard.
特性
- Embedded printed antenna
- RF port output (connector not included)
- DA14531 power mode configuration switch (only for backward compatibility with DA1458x DK PRO motherboard)
- Current measurement port to connect external measurement equipment
- Onboard JTAG connector
- Support for coin cell battery (battery holder not included)
试用样品与购买
DA14531-00OGDB-P
有效| MOQ: | 1 |
| SPQ: | 1 |
| Pb (Lead) Free: | Yes |
| Carrier Type: | Box |
| Assembly Location: | GERMANY |
1u | $16.00预算价格
附加硬件
与该平台兼容的附加板卡。为实现完整功能或评估特定功能，可能需要使用其中的部分板卡。
SmartBond TINY DA14531 Bluetooth Low Energy 5.1 System-on-Chip Development Kit Pro
Accelerate development of ultra-low power Bluetooth Low Energy applications using the DA14531 SmartBond TINY platform. Designed for efficient prototyping and evaluation.
