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概览

描述

This product is an evaluation kit for developing software and evaluating systems compatible with Renesas' PLC modem IC R9A06G037 and Renesas’ Sub-GHz wireless IC RAA604S00. This kit can be configured to support many configurations, PLC only R9A06G037, Hybrid (PLC + RF) R9A06G037+ RAA604S00, RF only (RX651 + RAA604S00 or R9A06G061+ RAA604S00). This kit is therefore intended as an evaluation system for G3-PLC (inc. Hybrid), PRIME1.4 (inc. MultiPHY), and Wi-SUN. This product is a complete evaluation platform that includes the analog front end and control MCU required for AC-based power line communication and Sub-GHz wireless communication.

特性

  • Supported MCU and Modem IC:
    • MCU group: RX651
    • Part number of MCU mounted on board: R5F5651EDDFP
    • PLC modem IC: R9A06G061
    • Part number of PLC modem IC mounted board: R9A06G037GNP#AA0
    • Sub-GHz RF modem IC: RAA604S00
    • Part number of RF modem IC mounted board: RAA604S002GNP
  • The kit contains the following:
    • Y-G-HYBRID-PLC-RF communication board
    • Y-G-HYBRID-PLC-RF line coupler board boxed
    • USB Micro-B cable
    • 15V, 1.2A, 18W, international plug-in power supply (optional – dependent on order code)
    • RF antenna 868MHz - 928MHz SMA male
    • Y-G-HYBRID-PLC-RF communication board to Y-G-HYBRID-PLC-RF line coupler box connector cable
    • 2-pin Euro plug to Figure 8 (C7) power cable Euro to IEC 60320 C7
  • Supported standards/frequencies:
    • G3-PLC (inc. Hybrid):
      • PLC: CENELEC A / CENELEC B / ARIB / FCC
      • RF: IEEE 802.15.4 SUN FSK
    • PRIME1.4 (inc MultiPHY):
      • PLC: CENELEC A / CENELEC B / ARIB / FCC
      • RF: IEEE 802.15.4 SUN FSK
    • Wi-SUN:
      • Wi-SUN FAN profile (IEEE 802.15.4 SUN FSK)
  • Dimensions:
    • Y-G-HYBRID-PLC-RF communication board
      • Board dimensions: 60 mm (width) x 120 mm (length) x 14 mm (thickness)
    • Y-G-HYBRID-PLC-RF line coupler board boxed
      • Box dimensions: 68 mm (width) x 123 mm (length) x 37 mm (depth)

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