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MBG (SOICN 13)

文档标题 信息
Pkg. Name
Name used to describe Renesas packages.
M13.15
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
MBG
Package Description
Descriptive text for this package.
13 LEAD SOIC (150MIL) 16ld SOIC with 3 pins missing - DUAL PADDLE
Package Status
Active
Package Type
SOICN
Package Code
The unique identifier of this package.
MBG
分类
PLASTIC
Lead Count
13
Pb (Lead) Free
Yes
长度
9.91mm
宽度
3.91mm
Thickness
Seated height or Package height
(Please check the outline drawing)
1.25mm
Pitch
1.27mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
9.91 x 3.91 x 1.25

文档

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封装外形图 PDF 178 KB
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