| 文档标题 | 信息 |
|---|---|
| Pkg. Name Name used to describe Renesas packages. | M20.3 |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger. | MDV |
| Package Description Descriptive text for this package. | Custom 20 Lead SOIC Module w/ Offset Crystal & Ground plane |
| Package Status | Active |
| Package Type | SOICW |
| 类别 | PLASTIC |
| Package Code The unique identifier of this package. | MDV |
| 分类 | PLASTIC |
| Lead Count | 20 |
| Pb (Lead) Free | Yes |
| 长度 | 12.8mm |
| 宽度 | 7.49mm |
| Thickness Seated height or Package height (Please check the outline drawing) | 0mm |
| Pitch | 1.27mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5 | 12.80 x 7.49 x 0.00 |
MDV (SOICW 20)
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