| 文档标题 | 信息 |
|---|---|
| Pkg. Name Name used to describe Renesas packages.
|
M24.3 |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
MHS |
| Package Description Descriptive text for this package.
|
24 LEAD SOIC (300MIL) |
| Package Status | Active |
| Package Type | SOICW |
| 类别 | PLASTIC |
| Package Code The unique identifier of this package.
|
MHS |
| 分类 | PLASTIC |
| Lead Count | 24 |
| Pb (Lead) Free | Yes |
| 长度 | 15.39mm |
| 宽度 | 7.52mm |
| Thickness Seated height or Package height
(Please check the outline drawing) |
0mm |
| Pitch | 1.27mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
15.39 x 7.52 x 0.00 |
MHS (SOICW 24)
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