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pkg_11597 (BGA 376)

文档标题 信息
Pkg. Name
Name used to describe Renesas packages.
PRBG0376FB-A
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
T376F1-100-KNJ
JEITA Standard
The JEITA standard to which the device is compliant.
P-BGA376-23x23-1.00
Package Status
Active
Package Type
BGA
类别
IC
Package Code
The unique identifier of this package.
pkg_11597
Lead Count
376
Pb (Lead) Free
Yes
长度
23mm
宽度
23mm
Thickness
Seated height or Package height
(Please check the outline drawing)
1.31mm
Pitch
1mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
23 x 23 x 1.31

文档

类型 文档标题 日期
封装外形图 PDF 70 KB
1 item