pkg_20026 (S-UFBGA 16)

文档标题	信息
Pkg. Name Name used to describe Renesas packages.	SUBG0016LB-A
JEITA Standard The JEITA standard to which the device is compliant.	S-UFBGA16-1.84x1.87-0.40
Package Description Descriptive text for this package.	Terminal Material - Base: Sn-Ag-Cu-Ni
Package Status	Active
Package Type	S-UFBGA
类别	IC
Package Code The unique identifier of this package.	pkg_20026
Lead Count	16
Pb (Lead) Free	Yes
长度	1.87mm
宽度	1.84mm
Thickness Seated height or Package height (Please check the outline drawing)	0.4mm
Pitch	0.4mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	1.87 x 1.84 x 0.4

文档


类型	文档标题	日期
封装外形图	Package Drawing S-UFBGA 16pin SUBG0016LB-A PDF 112 KB	2021年9月29日
1 item