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pkg_20045 (S-UFBGA 25)

文档标题 信息
Pkg. Name
Name used to describe Renesas packages.
SUBG0025LA-A
JEITA Standard
The JEITA standard to which the device is compliant.
S-UFBGA25-2.14x2.27-0.40
Package Description
Descriptive text for this package.
Terminal Material - Base: Sn-Ag-Cu
Package Status
Active
Package Type
S-UFBGA
类别
IC
Package Code
The unique identifier of this package.
pkg_20045
Lead Count
25
Pb (Lead) Free
Yes
长度
2.27mm
宽度
2.14mm
Thickness
Seated height or Package height
(Please check the outline drawing)
0.53mm
Pitch
0.4mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
2.27 x 2.14 x 0.53

文档

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封装外形图 PDF 134 KB
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