| 文档标题 | 信息 |
|---|---|
| Pkg. Name Name used to describe Renesas packages.
|
SUBG0072LB-A |
| JEITA Standard The JEITA standard to which the device is compliant.
|
S-UFBGA72-4.28x3.64-0.40 |
| Package Description Descriptive text for this package.
|
Terminal Material - Base: Sn-Ag-Cu-Ni |
| Package Status | Active |
| Package Type | CSP |
| 类别 | IC |
| Package Code The unique identifier of this package.
|
pkg_20157 |
| Lead Count | 72 |
| Pb (Lead) Free | Yes |
| 长度 | 3.644mm |
| 宽度 | 4.282mm |
| Thickness Seated height or Package height
(Please check the outline drawing) |
0.55mm |
| Pitch | 0.4mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
3.644 x 4.282 x 0.55 |
pkg_20157 (S-UFBGA 72)
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