跳转到主要内容

pkg_7576 (EFLIP(BGA) 4)

文档标题 信息
Pkg. Name
Name used to describe Renesas packages.
SXBG0004JB-A
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
P4Q1-65-211
JEITA Standard
The JEITA standard to which the device is compliant.
-
Package Status
Active
Package Type
EFLIP(BGA)
类别
Dic
Package Code
The unique identifier of this package.
pkg_7576
Lead Count
4
Pb (Lead) Free
Yes
长度
1.62mm
宽度
1.62mm
Thickness
Seated height or Package height
(Please check the outline drawing)
0.53mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
1.62 x 1.62 x 0.53

文档

类型 文档标题 日期
封装外形图 PDF 70 KB
1 item