跳转到主要内容

pkg_7785 (HBGA 824)

文档标题 信息
Pkg. Name
Name used to describe Renesas packages.
PRBG0824DB-A
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
P824F5-127-QY3
JEITA Standard
The JEITA standard to which the device is compliant.
P-HBGA824-33x42.5-1.27
Package Status
Active
Package Type
HBGA
类别
IC
Package Code
The unique identifier of this package.
pkg_7785
Lead Count
824
Pb (Lead) Free
Yes
长度
42.5mm
宽度
33mm
Thickness
Seated height or Package height
(Please check the outline drawing)
3.15mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
42.5 x 33 x 3.15

文档

类型 文档标题 日期
运输/封装 PDF 225 KB
运输/封装 PDF 202 KB
运输/封装 PDF 64 KB 日本語
封装外形图 PDF 48 KB
4 items