| 文档标题 | 信息 |
|---|---|
| Pkg. Name Name used to describe Renesas packages.
|
R64.C |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
RNY |
| Package Description Descriptive text for this package.
|
64 LD CQFP, SOLDER SEAL WITH BOTTOM HEATSINK |
| Package Status | Active |
| Package Type | CQFP |
| 类别 | HERMETIC |
| Package Code The unique identifier of this package.
|
RNY |
| 分类 | HERMETIC |
| Lead Count | 64 |
| Pb (Lead) Free | Yes |
| 长度 | 14.1mm |
| 宽度 | 14.1mm |
| Thickness Seated height or Package height
(Please check the outline drawing) |
0mm |
| Pitch | 0.64mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
14.10 x 14.10 x 0.00 |
RNY (CQFP 64)
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