WDB (WLCSP-TCURDL 64)

文档标题	信息
Pkg. Name Name used to describe Renesas packages.	W8X8.64
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.	WDB
Package Description Descriptive text for this package.	8x8 Array 64 Balls, 0.5mm Pitch, Wafer Level Chip Scale Pkg, -Amkor,Taiwan
Package Status	Active
Package Type	WLCSP-TCURDL
类别	PLASTIC
Package Code The unique identifier of this package.	WDB
分类	PLASTIC
Lead Count	64
Pb (Lead) Free	Yes
长度	4.03mm
宽度	4.03mm
Thickness Seated height or Package height (Please check the outline drawing)	0.6mm
Pitch	0.5mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	4.03 x 4.03 x 0.60