WFG (WLCSP-TCURDL 16)

文档标题	信息
Pkg. Name Name used to describe Renesas packages.	W4X4.16B
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.	WFG
Package Description Descriptive text for this package.	4x4 ARRAY 16 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Package Status	Active
Package Type	WLCSP-TCURDL
类别	PLASTIC
Package Code The unique identifier of this package.	WFG
分类	PLASTIC
Lead Count	16
Pb (Lead) Free	Yes
长度	1.66mm
宽度	1.66mm
Thickness Seated height or Package height (Please check the outline drawing)	0.5mm
Pitch	0.4mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	1.66 x 1.66 x 0.50