| 文档标题 | 信息 |
|---|---|
| Pkg. Name Name used to describe Renesas packages. | W4X5.20R |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger. | WPG |
| Package Description Descriptive text for this package. | 4x5 20 I/O, 0.4mm Pitch, Thin WLCSP w/o solder ball; ATT |
| Package Status | Active |
| Package Type | WLCSP-TKCURDL |
| 类别 | PLASTIC |
| Package Code The unique identifier of this package. | WPG |
| 分类 | PLASTIC |
| Lead Count | 20 |
| Pb (Lead) Free | Yes |
| 长度 | 2.15mm |
| 宽度 | 1.74mm |
| Thickness Seated height or Package height (Please check the outline drawing) | 0.23mm |
| Pitch | 0.4mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5 | 2.15 x 1.74 x 0.23 |