| 文档标题 | 信息 |
|---|---|
| Pkg. Name Name used to describe Renesas packages.
|
W4X5.20R |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
WPG |
| Package Description Descriptive text for this package.
|
4x5 20 I/O, 0.4mm Pitch, Thin WLCSP w/o solder ball; ATT |
| Package Status | Active |
| Package Type | WLCSP-TKCURDL |
| 类别 | PLASTIC |
| Package Code The unique identifier of this package.
|
WPG |
| 分类 | PLASTIC |
| Lead Count | 20 |
| Pb (Lead) Free | Yes |
| 长度 | 2.15mm |
| 宽度 | 1.74mm |
| Thickness Seated height or Package height
(Please check the outline drawing) |
0.23mm |
| Pitch | 0.4mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
2.15 x 1.74 x 0.23 |
WPG (WLCSP-TKCURDL 20)
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