| 文档标题 | 信息 |
|---|---|
| Pkg. Name Name used to describe Renesas packages.
|
W3X3.9H |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
WPL |
| Package Description Descriptive text for this package.
|
9 Ball 3x3 Array UltraThin Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch) |
| Package Status | Active |
| Package Type | WLCSP-BP |
| 类别 | PLASTIC |
| Package Code The unique identifier of this package.
|
WPL |
| 分类 | PLASTIC |
| Lead Count | 9 |
| Pb (Lead) Free | Yes |
| 长度 | 1.45mm |
| 宽度 | 1.45mm |
| Thickness Seated height or Package height
(Please check the outline drawing) |
0.28mm |
| Pitch | 0.4mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
1.45 x 1.45 x 0.28 |
WPL (WLCSP-BP 9)
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