WPO (WLCSP-BP 25)

文档标题	信息
Pkg. Name Name used to describe Renesas packages.	W5X5.25H
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.	WPO
Package Description Descriptive text for this package.	25 Ball 5x5 Array UltraThin Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
Package Status	Active
Package Type	WLCSP-BP
类别	PLASTIC
Package Code The unique identifier of this package.	WPO
分类	PLASTIC
Lead Count	25
Pb (Lead) Free	Yes
长度	2.07mm
宽度	2.07mm
Thickness Seated height or Package height (Please check the outline drawing)	0.28mm
Pitch	0.4mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	2.07 x 2.07 x 0.28