封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | DFN |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 2 x 3 |
| Pitch (mm): | 0.5 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Sample Catalog | Request Samples |
| Pkg. Type | DFN |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 3 |
| Country of Assembly | CHINA |
| Country of Wafer Fabrication | CHINA |
| Deep Power Down (µA) | 0.1 |
| Flash by Task | Boot Loader, Datalogging, Execute-in-Place, System Settings |
| Interface | Single, Dual, Quad SPI |
| Key Benefit | 90% energy savings |
| Longevity | 2033 1月 |
| MOQ | 15000 |
| Memory Class | Ultra-Low Energy |
| Memory Density | 1 |
| Operating Voltage Range (V) | 1.65 - 3.6 |
| Pb (Lead) Free | Yes |
| Pitch (mm) | 0.5 |
| Pkg. Dimensions (mm) | 2 x 3 |
| Qty. per Reel (#) | 5000 |
| Read Current (mA) | 1.2 |
| Speed | 85 MHz |
| Supply Voltage Vcc Range | 1.65-3.6 |
| Temp. Range (°C) | -40 to +85°C |
| 已发布 | Yes |
有关 AT25EU0011A 的资源
描述
The AT25EU001A is the lowest energy member of our System Enhancing class of code and data storage solutions designed for all system memory tasks including boot/code shadowing and small byte load updates. It is universally compatible and combines low power with faster Read performance to save more than 70% energy.