封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | 3x4 DFN |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Pkg. Type | 3x4 DFN |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 3 |
| Assembly Location | CHINA |
| Deep Power Down (µA) | 0.7 |
| Interface | Single SPI, Dual SPI, Quad SPI, QPI |
| Key Benefit | Standard features |
| Longevity | 2036 八月 |
| Memory Class | Standard Flash |
| Memory Density | 64 |
| Memory Type | Standard |
| Operating Voltage Range (V) | 2.7 - 3.6 |
| Pb (Lead) Free | Yes |
| Qty. per Reel (#) | 5000 |
| Read Current (mA) | 5 |
| Speed | 133 MHz |
| Supply Voltage Vcc (V) | 2.7 - 3.6 |
| Temp. Range (°C) | -40 to +85°C |
| Vcc (V) | 2.7 - 3.6 |
有关 AT25SF0641C 的资源
描述
AT25SF0641C 是一款 64Mbit 串行外设接口（SPI）闪存器件，专为各种大批量生产的工业、消费类及互联设备而设计。 该器件可用于存储程序代码，这些代码可在系统启动期间从闪存复制到嵌入式或外部 RAM 中。 此外，该器件还支持通过就地执行（XiP）操作直接从闪存执行代码。
