特性
- This Circuit is Processed in Accordance to MIL-STD- 883 and is Fully Conformant Under the Provisions of Paragraph 1.2.1.
- Converter or Repeater Mode
- Independent Manchester Encoder and Decoder Operation
- Static to One Megabit/Sec Data Rate Guaranteed
- Low Bit Error Rate
- Digital PLL Clock Recovery
- On Chip Oscillator
- Low Operating Power: 50mW Typical at +5V
- Available in 20 Lead Dual-In-Line and 20 Pad LCC Package
描述
The HD-6409/883 Manchester Encoder-Decoder (MED) is a High-Speed, low power device manufactured using self-aligned silicon gate technology. The device is intended for use in serial data communication, and can be operated in either of two modes. In the converter mode, the MED converts Nonreturn-to-Zero code (NRZ) into Manchester code and decodes Manchester code into Nonreturn-to-Zero code. For serial data communication, Manchester code does not have some of the deficiencies inherent in Nonreturn-to-Zero code. For instance, use of the MED on a serial line eliminates DC components, provides clock recovery, and gives a relatively high degree of noise immunity. Because the MED converts the most commonly used code (NRZ) to Manchester code, the advantages of using Manchester code are easily realized in a serial data link. In the Repeater mode, the MED accepts Manchester code input and reconstructs it with a recovered clock. This minimizes the effects of noise on a serial data link. A digital phase lock loop generates the recovered clock. A maximum data rate of 1MHz requires only 50mW of power. Manchester code is used in magnetic tape recording and in fiber optic communication, and generally is used where data accuracy is imperative. Because it frames blocks of data, the HD-6409/883 easily interfaces to protocol controllers.
产品参数
| 属性 | 值 |
|---|---|
| Rating | MIL-STD-883 |
| Data Frame Length | Complete Variable |
| Temp. Range (°C) | -55 to +125°C |
| Flow | Harsh Environment & MIL-STD-883 |
| Qualification Level | Class Q |
| Die Sale Availability? | No |
| PROTO Availability? | No |
封装选项
| Pkg. Type | Pkg. Dimensions (mm) | Lead Count (#) | Pitch (mm) |
|---|---|---|---|
| CERDIP | 24.6 x 7.3 x 0.00 | 20 | 2.5 |
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | MOQ | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 5962-9088801MRA | Active | Available | In Stock | CERDIP | 20# | Tube | Not Applicable | No | Hot Solder Dip | 171 | -55 to +125°C |
| HD1-6409/883 | Active | Available | In Stock | CERDIP | 20# | Tube | Not Applicable | No | Hot Solder Dip | 114 | -55 to +125°C |
- 产品变更通告英语PDF 323 KB PCN15064 2015年12月22日
- 产品变更通告英语PDF 174 KB PCN14017 2014年4月21日
- 产品变更通告英语PDF 151 KB PCN11040 2011年4月07日
- 应用说明英语PDF 224 KB an9654 1999年5月05日AI 生成的摘要: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
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- 应用说明英语PDF 224 KB an9654 1999年5月05日AI 生成的摘要: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
应用说明和白皮书 (1)
- 产品变更通告英语PDF 323 KB PCN15064 2015年12月22日
- 产品变更通告英语PDF 174 KB PCN14017 2014年4月21日
- 产品变更通告英语PDF 151 KB PCN11040 2011年4月07日
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