Pkg. Code | pkg_11617 |
Lead Count (#) | 32 |
Pkg. Type | sTSOP(32) |
Pkg. Dimensions (mm) | 11.8 x 8 x 1.2 |
Moisture Sensitivity Level (MSL) | 3 |
ECCN (US) | EAR99 |
HTS (US) | 8542.32.0041 |
RoHS (R1LV0208BSA-5SI#S1) | 英语日文 |
Pb (Lead) Free | Yes |
Carrier Type | Embossed Tape |
Moisture Sensitivity Level (MSL) | 3 |
Country of Assembly | Malaysia, Taiwan |
Country of Wafer Fabrication | Japan |
Price (USD) | 1ku | 2.17186 |
Access Time (ns) | 55 |
Density (Kb) | 2000 |
Lead Compliant | Yes |
Lead Count (#) | 32 |
Length (mm) | 12 |
Longevity | 2032 12月 |
MOQ | 1000 |
Memory Capacity (kbit) | 2000 |
Memory Density | 2M |
Organization | 256K x 8 |
Organization (bit) | x 8 |
Organization (kword) | 256 |
Pb (Lead) Free | Yes |
Pkg. Dimensions (mm) | 12 x 8 x 1.2 |
Pkg. Type | sTSOP(32) |
Remarks | Dual Chip Select (CS1#, CS2) |
Replacement Remark | consolidation of part-names and/or assembly material change |
Supply Voltage (V) | 2.7 - 3.6 |
Tape & Reel | No |
Temp. Range | -40 to +85°C |
Thickness (mm) | 1.2 |
Width (mm) | 8 |
The R1LV0208BSA is a low-voltage, 2-Mbit static RAM organized as 262, 144-word by 8-bit, fabricated by Renesas' high-performance 0.15µm CMOS and TFT technologies. The R1LV0208BSA realizes higher density, higher performance, and low-power consumption. The device is suitable for memory applications where simple interfacing, battery operation, and battery backup are the important design objectives. The R1LV0208BSA is packaged in a 32-pin sTSOP.