| CAD 模型: | View CAD Model |
| Pkg. Type: | TSOP(2) |
| Pkg. Code: | pkg_470 |
| Lead Count (#): | 44 |
| Pkg. Dimensions (mm): | 18.41 x 10.16 x 1.2 |
| Pitch (mm): |
| Moisture Sensitivity Level (MSL) | 2 |
| RoHS (R1RW0416DSB-2PI#S0) | 英语日文 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
| Carrier Type | Embossed Tape |
| Moisture Sensitivity Level (MSL) | 2 |
| Access Time (ns) | 12 |
| Lead Compliant | Yes |
| Lead Count (#) | 44 |
| Length (mm) | 18 |
| MOQ | 1000 |
| Memory Capacity (kbit) | 4000 |
| Organization | 256K x 16 |
| Organization (bit) | x 16 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 18 x 10 x 1.2 |
| Pkg. Type | TSOP(2) |
| Replacement Product | R1RW0416DSB-2PI#S1 |
| Supply Voltage (V) | 3 - 3.6 |
| Tape & Reel | No |
| Thickness (mm) | 1.2 |
| Width (mm) | 10 |
The R1RW0416DI is a 4Mbit high-speed static RAM organized 256-kword × 16-bit. It realizes high-speed access time by employing the CMOS process (6-transistor memory cell) and high-speed circuit design technology. It is most appropriate for applications that require high-speed, high-density memory, and a wide bit width configuration, such as cache and buffer memory in systems. The R1RW0416DI is packaged in s 400-mil 44-pin SOJ and 400-mil 44-pin plastic TSOPII for high-density surface mounting.