特性
- VDSS = 80V
- 标准栅极驱动电压: VGS（th）= 2.0V 至 4.0V
- 超低导通电阻：RDS（on）= 2.4mΩ (最大值)
- ID = 175A
- 低输入电容
- 低热阻
- 符合 AEC-Q101 标准
- 支持PPAP(生产件批准程序)
- 无铅电镀：符合 RoHS 标准
- MSL1（依据IPC/JEDEC J-STD-020）
RBA175N08EANS-4UA02 Outline
描述
RBA175N08EANS-4UA02 N 沟道功率 MOSFET 采用 REXFET-1分离栅技术, 提供 SO8-FL (5x6) 封装。 SO8-FL (5x6) 封装采用超紧凑无引脚设计和可润湿侧翼结构，可增强热性能和可靠性并提高组装的便利性。
瑞萨电子的 REXFET-1 分离栅技术非常适合需要低 RDS(on) 和重视开关能力的场景，是大功率和高频应用的理想选择。
产品参数
| 属性 | 值 |
|---|---|
| Qualification Level | Automotive |
| Nch/Pch | Nch |
| Channels (#) | 1 |
| Standard Pkg. Type | SO8-FL 5x6 BSC |
| Gate Level | Standard |
| VDSS (Max) (V) | 80 |
| ID (A) | 175 |
| RDS (ON) (Max) @10V (mohm) | 2.4 |
| Pch (W) | 165 |
| Ciss (Typical) (pF) | 6600 |
| Qg typ (nC) | 99 |
| Series Name | REXFET-1 |
封装选项
| Pkg. Type | Pkg. Dimensions (mm) | Lead Count (#) |
|---|---|---|
| SO8-FL | 5.15 x 6.10 x 1.00 | 8 |
应用
- DC/DC 车载充电
- Zone ECUs
- 电机控制
- 电池管理系统 (BMS)
- 风扇
- 泵
- 电动座椅
- 天窗
- 电动助力转向系统 (EPS)
- 电动驻车制动器 (EPB)
- 电动压缩机
- 开关
- LED照明
| 器件号 | 状态 | 样品 | 库存 | RoHS | 封装 | 预算价格（美元） | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free |
|---|---|---|---|---|---|---|---|---|---|---|
| RBA175N08EANS-4UA02#HB0 | Active | Available | 缺货 | RoHS:EN RoHS:JA | SO8-FL | 1ku | $0.792 | 8# | Embossed Tape | 1 | Yes |
加载中
- 应用说明英语PDF 599 KB R07AN0052EJ0100 Rev.1.00 2026年5月27日REXFET PLECS models enable accurate simulation of power MOSFET behavior, including electrical and thermal characteristics. The model integrates channel and body diode behavior, supports configurable simulation parameters, and provides probe functions for switching, conduction, and temperature analysis. This application note outlines installation, library integration, model configuration, and usage considerations to optimize simulation results.相关文件：
- 应用说明英语PDF 596 KB R07AN0051EJ0100 Rev.1.00 2026年4月27日Compares the thermal performance of automotive power MOSFETs in the TOLL (TO-Leadless) package and its derivatives, including the TOLT (TO-Leaded Top-side Cooling) package. The information presented in this document is intended to serve as a comprehensive guideline for designing high-power automotive systems.
- 数据手册英语RBA175N08EANS-4UA02 DatasheetRECOMMENDEDPDF 460 KB R07DS1647EJ0101 Rev.1.01 2026年4月16日The RBA175N08EANS-4UA02 N-channel power MOSFET features REXFET-1 split-gate technology and is available in an ultra-compact 5x6 SO8-FL package. This leadless package incorporates wettable flanks, enabling enhanced thermal performance, improved reliability, and simplified assembly. Renesas' split-gate technology is well-suited for applications that demand low RDS(on) and high switching performance in high-power, high-frequency environments.
- 应用说明英语PDF 936 KB R07AN0050EJ0100 Rev.1.00 2025年12月03日Measurement frequency and the influence of parasitic inductance are crucial in capacitance measurements for Power MOSFETs. Split-gate structures, with their low Crss and higher Ciss, face challenges from parasitic inductance, making high-frequency measurements difficult. In contrast, standard-gate trench structures allow relatively accurate results. The influence of parasitic inductance in actual measurements is examined from various perspectives.
- 指南英语PDF 988 KB R07ZZ0016EJ0100 Rev.1.00 2025年12月03日The diagrams in this document show the recommended mounting pad layout dimensions for Renesas Power MOSFETs. In actual PCB design, optimization should consider mounting density, mountability, dimensional tolerances, and other relevant factors.
- 白皮书英语PDF 4.45 MB R16WP0011EU0100 Rev.1.00 2025年11月04日High-power, high-efficiency systems such as electric motor drives and battery management systems continue to see rapid adoption and increasing power demands. To address these requirements, lower on-resistance and improved switching performance are needed. This paper presents an advanced split-gate trench process and next-generation MOSFETs with a 30% reduction in specific on-resistance to meet these needs.
- 应用说明英语PDF 722 KB R07AN0040EJ0100 Rev.1.00 2024年11月13日AI 生成的摘要: 48V automotive electrical systems enhance power capacity and efficiency by reducing current and cable size, enabling lighter and more compact vehicle designs. Renesas develops the REXFET-1 series MOSFETs with advanced wafer and package technologies, achieving ultra-low ON-resistance and high reliability for middle-voltage applications. The TOLL and TOLG packages optimize thermal performance, EMI behavior, and space, supporting up to 300A current. These MOSFETs meet automotive standards, improve switching efficiency, and reduce heat dissipation, facilitating the demands of electric and hybrid vehicles' powertrains and auxiliary systems.
- 应用说明英语AI 生成的摘要: Parallel connection of power MOSFETs requires careful management of current balance to prevent device damage. During conduction, differences in RDS(on) and wiring resistance cause current imbalance, which can be mitigated by selecting devices from the same lot and symmetrical layout design. During switching, variations in VGS(th) and inductance lead to transient current imbalance, necessitating similar countermeasures. Avalanche operation risks concentrating current on weaker devices. Parasitic oscillations occur more frequently in parallel configurations due to resonant circuits formed by gate and drain inductances and capacitances, which can be suppressed by adding gate resistors.
- 应用说明英语AI 生成的摘要: Absolute maximum ratings define safe operational limits for MOSFETs, including voltage, current, and temperature thresholds to prevent device damage. Electrical characteristics specify parameters like breakdown voltage, threshold voltage, on-resistance, capacitances, and switching times. Allowable channel dissipation decreases as case temperature rises, calculated by a specific formula. The safe operating area (SOA) outlines five limiting conditions: current rating, on-resistance, channel dissipation, secondary breakdown, and voltage rating, ensuring reliable MOSFET operation under various conditions.
- 应用说明英语AI 生成的摘要: The document outlines derating standards for Power MOSFETs and IGBTs, emphasizing temperature, humidity, voltage, current, and power limits to ensure device reliability. It discusses package type selection between hermetic sealed and plastic molded types, highlighting the advantages of surface-mount packages for miniaturization. It also details precautions for physical handling, including proper lead forming, cutting, and mounting techniques to prevent stress and damage during installation.
- 数据手册英语RBA175N08EANS-4UA02 DatasheetRECOMMENDEDPDF 460 KB R07DS1647EJ0101 Rev.1.01 2026年4月16日The RBA175N08EANS-4UA02 N-channel power MOSFET features REXFET-1 split-gate technology and is available in an ultra-compact 5x6 SO8-FL package. This leadless package incorporates wettable flanks, enabling enhanced thermal performance, improved reliability, and simplified assembly. Renesas' split-gate technology is well-suited for applications that demand low RDS(on) and high switching performance in high-power, high-frequency environments.
- 白皮书英语PDF 4.45 MB R16WP0011EU0100 Rev.1.00 2025年11月04日High-power, high-efficiency systems such as electric motor drives and battery management systems continue to see rapid adoption and increasing power demands. To address these requirements, lower on-resistance and improved switching performance are needed. This paper presents an advanced split-gate trench process and next-generation MOSFETs with a 30% reduction in specific on-resistance to meet these needs.
推荐文档 (2)
- 数据手册英语RBA175N08EANS-4UA02 DatasheetRECOMMENDEDPDF 460 KB R07DS1647EJ0101 Rev.1.01 2026年4月16日The RBA175N08EANS-4UA02 N-channel power MOSFET features REXFET-1 split-gate technology and is available in an ultra-compact 5x6 SO8-FL package. This leadless package incorporates wettable flanks, enabling enhanced thermal performance, improved reliability, and simplified assembly. Renesas' split-gate technology is well-suited for applications that demand low RDS(on) and high switching performance in high-power, high-frequency environments.
数据手册 (1)
- 指南英语PDF 988 KB R07ZZ0016EJ0100 Rev.1.00 2025年12月03日The diagrams in this document show the recommended mounting pad layout dimensions for Renesas Power MOSFETs. In actual PCB design, optimization should consider mounting density, mountability, dimensional tolerances, and other relevant factors.
手册和指南 (1)
- 应用说明英语PDF 599 KB R07AN0052EJ0100 Rev.1.00 2026年5月27日REXFET PLECS models enable accurate simulation of power MOSFET behavior, including electrical and thermal characteristics. The model integrates channel and body diode behavior, supports configurable simulation parameters, and provides probe functions for switching, conduction, and temperature analysis. This application note outlines installation, library integration, model configuration, and usage considerations to optimize simulation results.相关文件：
- 应用说明英语PDF 596 KB R07AN0051EJ0100 Rev.1.00 2026年4月27日Compares the thermal performance of automotive power MOSFETs in the TOLL (TO-Leadless) package and its derivatives, including the TOLT (TO-Leaded Top-side Cooling) package. The information presented in this document is intended to serve as a comprehensive guideline for designing high-power automotive systems.
- 应用说明英语PDF 936 KB R07AN0050EJ0100 Rev.1.00 2025年12月03日Measurement frequency and the influence of parasitic inductance are crucial in capacitance measurements for Power MOSFETs. Split-gate structures, with their low Crss and higher Ciss, face challenges from parasitic inductance, making high-frequency measurements difficult. In contrast, standard-gate trench structures allow relatively accurate results. The influence of parasitic inductance in actual measurements is examined from various perspectives.
- 白皮书英语PDF 4.45 MB R16WP0011EU0100 Rev.1.00 2025年11月04日High-power, high-efficiency systems such as electric motor drives and battery management systems continue to see rapid adoption and increasing power demands. To address these requirements, lower on-resistance and improved switching performance are needed. This paper presents an advanced split-gate trench process and next-generation MOSFETs with a 30% reduction in specific on-resistance to meet these needs.
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2025年10月29日
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