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瑞萨电子 (Renesas Electronics Corporation) - June is Pride Month, a month to raise awareness of the rights and the culture of the LGBTQ+ community
GreenPAK 可编程混合信号 IC,VDD 范围:1.71-5.5V,17 个 GPIO,6 个 ACMP,ADC(8 位,SAR),SPI

封装信息

CAD 模型:View CAD Model
Pkg. Type:TSSOP
Pkg. Code:
Lead Count (#):20
Pkg. Dimensions (mm):6.4 x 6.5
Pitch (mm):0.65

环境和出口类别

Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes
ECCN (US)EAR99
HTS (US)8542.39.0090

产品属性

Lead Count (#)20
Carrier TypeTape & Reel
Moisture Sensitivity Level (MSL)1
Pitch (mm)0.65
Pkg. Dimensions (mm)6.4 x 6.5
Qty. per Reel (#)4000
Pb (Lead) FreeYes
Temp. Range (°C)-40 to +85°C
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN
# of Programable Delays (#)2
ACMP Channels (#)6
Additional FeaturesSupported in Go Configure™ Software Hub
CNT/DLY (Max) (#)10
D Flip-flops (DFFs) (#)12
DCMP/PWM3
GPIOs (#)18
InterfaceSPI
LUTs (Max) (#)26
Longevity2032 十二月
MOQ4000
Memory TypeOTP
Nominal VDD1.71 - 5.5
Oscillator TypeRC OSC, LF OSC, Ring OSC
Pattern Generator1
Pipe Delay2x 16-stage
Pkg. TypeTSSOP
Price (USD)$0.85986
Special Features2x DAC, 3x PWM, ADC (8-bit SAR)

描述

SLG46620 提供一个小型低功耗组件来实现常用的混合信号功能。 用户通过对一次性可编程 (OTP) 非易失性存储器 (NVM) 进行编程来配置 SLG46620 的互连逻辑、IO 引脚和宏单元,从而进行电路设计。 这款高灵活性的器件能在超小尺寸、超低功耗的单个集成电路中实现丰富多样的混合信号功能设计。