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瑞萨电子 (Renesas Electronics Corporation) - June is Pride Month, a month to raise awareness of the rights and the culture of the LGBTQ+ community

特性

  • 逻辑和混合信号电路
  • 高度灵活的宏单元
  • 回读保护(Read Lock)
  • 1.8V (±5%) 至 5V (±10%) 电源
  • 工作温度范围:-40°C 至 85°C
  • 符合 RoHS 标准/无卤素
  • 宏单元总览
    • 8 位逐次逼近寄存器模数转换器 (SAR ADC)
    • ADC 3 位可编程增益放大器 (PGA)
    • 2 个数模转换器 (DAC)
    • 6 个模拟比较器 (ACMP)
    • 两个电压基准 (Vref)
    • 25 个组合查找表 (LUT)
      • 8 个 2 位 LUT
      • 16 个 3 位 LUT
      • 1 个 4 位 LUT
    • 1 个组合功能宏单元
      • 模式发生器或 4 位 LUT
    • 3 个数字比较器/脉宽调制器 (DCMP/PWM),具有可选的死区
    • 10 个计数器/延迟 (CNT/DLY)
      • 2 个 14 位延迟/计数器
      • 1 个 14 位延迟/计数器(唤醒睡眠控制)
      • 1 个 14 位延迟/计数器/有限状态机
      • 5 个 8 位延迟/计数器
      • 1 个 8 位延迟/计数器/有限状态机
    • 12 个 D 触发器/锁存器
    • 2 个管道延迟 – 16 级/2 路输出
    • 2 个带隙
    • 2 个具有边缘检测的可编程延迟
    • 3 个内部振荡器
      • 低频
      • 指环
      • RC 25kHz 和 2MHz
    • 上电复位 (POR)
    • 从SPI

描述

SLG46620 提供一个小型低功耗组件来实现常用的混合信号功能。 用户通过对一次性可编程 (OTP) 非易失性存储器 (NVM) 进行编程来配置 SLG46620 的互连逻辑、IO 引脚和宏单元,从而进行电路设计。 这款高灵活性的器件能在超小尺寸、超低功耗的单个集成电路中实现丰富多样的混合信号功能设计。

产品参数

属性
Special Features2x DAC, 3x PWM, ADC (8-bit SAR)
GPIOs (#)18
Nominal VDD1.71 - 5.5
ACMP Channels (#)6
DCMP/PWM3
CNT/DLY (Max) (#)10
LUTs (Max) (#)26
D Flip-flops (DFFs) (#)12
Pipe Delay2x 16-stage
# of Programable Delays (#)2
Oscillator TypeRC OSC, LF OSC, Ring OSC
InterfaceSPI
Memory TypeOTP
Temp. Range (°C)-40 to +85°C

封装选项

Pkg. TypePkg. Dimensions (mm)Lead Count (#)Pitch (mm)
TQFN2.0 x 3.0200.4
TSSOP6.4 x 6.5200.65

应用

  • 个人计算机和服务器
  • 电脑周边设备
  • 消费电子
  • 数据通信设备
  • 手持式和便携式电子产品
器件号状态样品供应期限库存封装预算价格(美元)Lead Count (#)Carrier TypeMoisture Sensitivity Level (MSL)Pitch (mm)Pkg. Dimensions (mm)Qty. per Reel (#)Pb (Lead) FreeTemp. Range (°C)Country of AssemblyCountry of Wafer Fabrication
SLG46620GActiveAvailable2032 Dec有库存TSSOP1ku | $0.56220#Tape & Reel10.65mm6.4 x 6.54000#Yes-40 to +85°CTAIWANTAIWAN
SLG46620VActiveAvailable2035 May有库存TQFN1ku | $0.44320#Tape & Reel10.4mm2.0 x 3.03000#Yes-40 to +85°CCHINA, TAIWANTAIWAN

Renesas Boards & Kits

Partner Boards & Kits

SoM/SBC

Banana PI BPI-AI2H System on Module (SoM)

Developed in collaboration with Renesas, the Banana Pi BPI-AI2H system on module (SoM) is an open-source hardware solution based on the high-performance RZ/V2H Vision AI MPU. Powered by the RZ/V2H chipset, it delivers powerful edge AI performance with advanced DRP-AI acceleration, multi-core Arm® Cortex®-A55 processing, and rich multimedia and high-speed I/O support—ideal for next-generation vision AI and edge computing applications.
Banana Pi
SoM/SBC

Banana Pi BPI-AI2N System on Module (SoM) & BPI-AI2N Carrier

Developed in collaboration with Renesas, the Banana Pi BPI-AI2N SoM module and carrier board provide an open-source hardware platform based on the RZ/V2N Vision AI MPU. Supporting 8GB LPDDR4x, 32GB eMMC, and QSPI flash in a compact SO-DIMM 260-pin form factor, the platform enables open-source development through a complete kit including SOM, carrier board, accessories, and SDK. Hardware and software customization for OEM/ODM is supported, along with Yocto and other open-source operating systems.
Banana Pi
SoM/SBC

SOMDEVICES uSMARC RZ/V2N

SMARC v2.1 system on module (SoM) based on the Renesas RZ/V2N processor, enabling high-performance image processing and dynamic control using advanced artificial intelligence with excellent power efficiency. Supports high-speed interfaces such as PCIe, USB3.2, and Gigabit Ethernet. Introduces µSMARC®, a smaller form factor that remains fully functionally compatible with the SMARC standard.
SomDevices
SoM/SBC

V2N SMARC Module

SMARC 2.2 system on module (SoM) based on RZ/V2N Renesas SoC. The RZ/V2N is a high-performance vision AI MPU powered by Renesas’ DRP-AI3 accelerator, delivering up to 15 TOPS of AI performance. It features quad Arm® Cortex®-A55 CPUs with an Arm Cortex- M33, integrated ISP, and dual-channel MIPI® CSI-2® interfaces for efficient dual-camera processing. It is ideal for applications such as driver monitoring systems, surveillance cameras, and mobile robotics.
Tessolve