概览
描述
RL78/G1D BLE 模块扩展板（RTKYRLG1D0B00000BJ）是一款具有 Pmod™ 接口的评估板，其集成了适用于 Bluetooth® Low Energy（BLE）的 RL78/G1D 模块（RY7011A0000DZ00）。 其可以连接至 RL78/G14 快速原型开发板（RTK5RLG140C00000BJ），并且可用于评估 BLE 功能。 此外，客户还可以使用 RL78/G1D 评估板，通过搭载 RL78/G1D 16 位微控制器（MCU）的蓝牙低功耗（BLE）系统，开发全新的 BLE 应用程序。 将扩展板与传感器设备组合使用即可轻松评估和开发物联网应用。
产品配置
- RL78/G1D 评估板和 BLE 控制（GUI）工具
- BLE 协议栈
- Bluetooth Developer Studio（BDS）插件
- 用于确认 BLE 操作的 GATTBrowser 智能手机应用
了解更多有关瑞萨电子低功耗蓝牙解决方案的信息。
特性
- 配备了适用于低功耗蓝牙的 RL78/G1D 模块（RY7011A0000DZ00）
- 该小型模块（8.95 mm x 13.35 mm x 1.7 mm）安装了用于低功耗蓝牙的 RL78/G1D 微控制器（具有行业出色的低耗电特性）、用于射频芯片的 32-MHz 晶体谐振器和天线。
- 该模块已取得符合日本电波法、FCC 模块相关标准、IC 规定、CE 标志要求和蓝牙 SIG 认证的证书
应用
- 通信控制
- 暖通空调（HVAC）
- 消防和安全
- 楼宇安全系统
- 照明系统
文档
相关文档
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| 类型 | 文档标题 | 日期 |
| 快速入门指南 | PDF 201 KB | |
| 手册 - 开发工具 | PDF 274 KB 日本語 | |
| 应用说明 |
PDF
1.10 MB
日本語
AI 生成的摘要:
The document explains the process to acquire Bluetooth qualification for products using Bluetooth Low Energy (LE) microcomputers or modules from Renesas. It details the Qualified Design Identification (QDID) numbers applicable to various IC groups and modules, the supported Bluetooth profiles and services, and the necessary steps for Bluetooth SIG membership registration, Declaration ID purchase, and product registration. The document also clarifies the use and limitations of specific QDIDs and provides a comprehensive list of supported profiles and services for each design.
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| 应用说明 |
PDF
1.57 MB
日本語
AI 生成的摘要:
The document details the configuration and use of a simple API for Bluetooth Low Energy (BLE) communication on the RL78/G14 platform. It covers system and software setup, development environment, program execution, and API specifications. The simple API offers nine functions to manage BLE operations such as scanning, advertising, connecting, data communication, and disconnection. It supports encrypted communication and device filtering via a whitelist. The API runs on a Host MCU controlling the RL78/G1D BLE module, enabling flexible data exchange using a general purpose communication profile.
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| 应用说明 |
PDF
1.49 MB
日本語
AI 生成的摘要:
The document details a Simple API for Bluetooth Low Energy communication using the RX113 MCU. It provides nine APIs enabling scanning, advertising, connecting as master or slave, data transmission, and disconnection. The system supports Renesas Starter Kit for RX113 as Host MCU and RL78/G1D modules as BLE MCUs. It also covers system configurations, UART communication settings, and integration with smartphones. The API facilitates bidirectional communication using a proprietary virtual UART profile with automatic encrypted connections.
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| 应用说明 |
PDF
1.60 MB
日本語
AI 生成的摘要:
The document explains the Bluetooth Low Energy protocol stack host sample for RL78/G14, detailing device and software composition, operation procedures, and software sequences. It describes the host sample running on the Renesas Starter Kit for RL78/G14, controlling the RL78/G1D BLE microcontroller via UART communication. The system supports UART 2-wire and branch connections. The host sample manages BLE communication with a smartphone, handling broadcasting, connection establishment, pairing, encryption, and ADC data transmission. It includes a simple scheduler and power-saving STOP mode.
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| 应用说明 |
PDF
1.52 MB
日本語
AI 生成的摘要:
This document provides general precautions for handling microprocessing and microcontroller units, emphasizing proper treatment of unused pins, power-on processing, prohibition of access to reserved addresses, and clock signal stability. It highlights differences between products with varying part numbers and advises system evaluation tests when switching products. Additionally, it outlines the purpose and target readers of the RL78/G1D Module Firmware manual and lists related documents and application notes for further reference.
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| 应用说明 |
PDF
1.10 MB
日本語
AI 生成的摘要:
The document details the RL78/G1D module control software, including firmware and host MCU programming. It explains the system configuration where the Host MCU controls the RL78/G1D module via serial communication using the RSCIP protocol. The Host MCU program includes user applications and BLE communication managed through the rBLE API, supporting GAP, GATT, and various profiles. The software handles command processing, event notifications, and error recovery in serial communication. The document also outlines development environments, firmware specifications, and build procedures.
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| 手册 - 开发工具 | PDF 1.94 MB 日本語 | |
| 手册 - 开发工具 | PDF 1.89 MB 日本語 | |
| 手册 - 开发工具 | PDF 1.92 MB 日本語 | |
| 手册 - 硬件 | PDF 3.13 MB 日本語 | |
| 应用说明 |
PDF
1.30 MB
日本語
AI 生成的摘要:
Sensor data from the Renesas HS3001 Humidity and Temperature Sensor transmits via Bluetooth Low Energy using the RL78/G14 Fast Prototyping Board and RL78/G1D BLE Module Expansion Board. The Host MCU program controls the BLE module through a UART 2-wire connection, managing pairing and security with the Security Library. The document details hardware and software configurations, development environment requirements, communication sequences, and step-by-step procedures for building, running, and verifying Bluetooth communication with smartphones. It also covers the BLE protocol stack API usage and includes application circuit examples.
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| 应用说明 |
PDF
1.40 MB
日本語
AI 生成的摘要:
This document details integrating Bluetooth Low Energy (BLE) and LoRaWAN communication for sensor devices. It explains setting LoRaWAN parameters via BLE from smartphones, sending sensor data to LoRaWAN Gateways, and verifying data on the LoRaWAN Network Server. The setup uses RL78/G14 Fast Prototyping Board, BLE and LoRaWAN modules connected via Pmod interfaces, and a sensor module measuring temperature, pressure, and humidity. It covers firmware updates, device diagnostics, and device management through BLE.
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| 其他 | RL78/G1D BLE Module Expansion Board BOM LIST
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| 原理图 | RL78/G1D BLE Module Expansion Board Schematic
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16 项目
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设计和开发
软件与工具
软件与工具
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Software type
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公司
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| 快速连接平台 快速连接平台通过提供兼容的硬件和软件构建模块，实现快速原型设计。
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Software and Hardware Development Tools | 瑞萨电子 |
1 项目
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样例程序
样例程序
筛选
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| 类型 | 文档标题 | 日期 日期 |
| 示例代码 | Bluetooth® Low Energy Protocol Stack Host MCU Simple API for RL78/G14 Rev.1.00 - Sample Code
应用:
工业, 消费电子产品
Compiler:
CA78K0R, CC-RL
Function:
Communication Interface
IDE:
CS+ for CA, CX, CS+ for CC, e2 studio
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| 示例代码 | Bluetooth® Low Energy Protocol Stack Host MCU Simple API for RX113 Rev.1.01 - Sample Code
应用:
工业, 消费电子产品
Compiler:
CC-RX
Function:
Communication Interface
IDE:
e2 studio
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| 示例代码 | Bluetooth® Low Energy Protocol Stack RL78/G14 Host Sample Rev.1.21 - Sample Code
应用:
工业, 消费电子产品
Compiler:
CA78K0R, CC-RL
Function:
Communication Interface
IDE:
CS+ for CA, CX, CS+ for CC, e2 studio
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| 示例代码 | RL78/G1D Module Firmware User's Manual Rev.1.02 - Sample Code
应用:
工业, 消费电子产品
Compiler:
CC-RL
Function:
Communication Interface
IDE:
e2 studio
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| 示例代码 | RL78/G1D Module Module Control Software (Including Module Firmware) Rev.1.11 - Sample Code
应用:
工业, 消费电子产品
Compiler:
CC-RL
Function:
Communication Interface
IDE:
e2 studio
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| 示例代码 | Bluetooth® Low Energy Protocol Stack Fast Prototyping Board Host Sample Rev.1.20 - Sample Code
[Software=Bluetooth® low energy Protocol Stack|Ver.1.21],[Toolchains=CC-RL|V1.03.00]
ZIP
5.55 MB
日本語
应用:
工业, 消费电子产品
Compiler:
CC-RL
Function:
Communication Interface
IDE:
CS+ for CC, e2 studio
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| 示例代码 | Bluetooth® Low Energy Protocol Stack BLE & LoRaWAN® Application Rev.1.00 - Sample Code
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7 项目
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相关评估板和套件
开发板与套件
评估
FPB-RL78G14
有效
RL78/G14 快速原型开发板
RL78/G14 快速原型开发板已配置高性能的 RL78/G14 微控制器，特别针对各种应用程序测试开发的评估板。内置E2 Lite仿真器同级别的仿真器电路，无需增设工具即可实现程序的写入/调试。标配Arduino Uno及Pmod™端口，能够通过PCB板上的通孔访问微控制器所有引脚，具备高扩展性。
样品软件可用于连接 RL78/G14 快速原型板和多种无线模块或各种传感器模块。
使用Bluetooth®，LoRa® 和 Wi-Fi 时，请遵照各国的无线电法规。 阅读详情
备有各种示例程序、应用指南
| 文档和演示软件 | 内容 | 文档编号 |
|---|---|---|
| Getting started with the RL78/G14 Fast Prototyping Board / Wi-Fi-Pmod-Expansion-Board (PDF) | This tutorial... |
产品选项
| 器件号 | 状态 | 库存 | 预算价格（美元） | Sampleable | Pb (Lead) Free |
|---|---|---|---|---|---|
| RTKYRLG1D0B00000BJ | Active | 有库存 | 1u | $19 | N/A | No |
视频和培训
支持
知识库
- 另售的 RL78/G1D BLE Module Expansion Board（P/N: RTKYRLG1D0B00000BJ）也可以使用吗？
不能使用。RL78/G1P 为 ROM:16KB、RAM:1.5KB，因此不满足控制通信协议用的软件实施推荐条件。
2020年6月17日
ROM Ordering
Embed your custom code into Renesas masked MCUs during manufacturing for tailored device functionality.
