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瑞萨电子 (Renesas Electronics Corporation)
2:1 Multiplexer Chip For PCI-Express GEN1

封装信息

CAD 模型:View CAD Model
Pkg. Type:TSSOP
Pkg. Code:PGG16
Lead Count (#):16
Pkg. Dimensions (mm):5.0 x 4.4 x 1.0
Pitch (mm):0.65

环境和出口类别

Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes
ECCN (US)EAR99
HTS (US)8542.39.0090

产品属性

Lead Count (#)16
Carrier TypeReel
Moisture Sensitivity Level (MSL)1
Qty. per Reel (#)2500
Qty. per Carrier (#)0
Pb (Lead) FreeYes
Pb Free Categorye3 Sn
Temp. Range (°C)0 to 70°C
Accepts Spread Spec InputYes
App Jitter CompliancePCIe Gen1
ArchitectureCommon
C-C Jitter Typ P-P (ps)65
Core Voltage (V)3.3
Diff. Input SignalingHCSL
Diff. Inputs2
Diff. Output SignalingHCSL
Diff. Outputs1
Diff. Termination Resistors4
FunctionMultiplexer
Input Freq (MHz)200
Input TypeHCSL
Inputs (#)2
Length (mm)5
MOQ2500
Output Banks (#)1
Output Freq Range (MHz)200
Output TypeHCSL, LVDS
Output Voltage (V)3.3
Outputs (#)1
PLLNo
Package Area (mm²)22
Pitch (mm)0.65
Pkg. Dimensions (mm)5.0 x 4.4 x 1.0
Pkg. TypeTSSOP
Power Consumption Typ (mW)132
Product CategoryClock Multiplexers, PCI Express Clocks
Prog. ClockNo
Reel Size (in)13
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Supply Voltage (V)3.3 - 3.3
Tape & ReelYes
Thickness (mm)1
Width (mm)4.4
已发布No

描述

The 557-08 is a 2:1 multiplexer chip that allows the user to select one of the two HCSL (Host Clock Signal Level) input pairs and fans out to one pair of differential HCSL or LVDS outputs. This chip is suited especially for PCI-Express applications, where there is a need to select the PCI-Express clock either locally from the PCI-E card or from the motherboard.