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特性

  • Complies to the Bluetooth 5 core specification
  • Integrated One-Time-Programmable (OTP) memory
  • 2Mb Flash
  • Extended user RAM (96kB)
  • Low operating voltage (1.8V to 3.6V)
  • I2C and pulse density modulation (PDM) audio interfaces

描述

Connected devices are constantly evolving. New generations appear that are smarter, more full featured and have longer battery lifetimes. To enable this, SmartBond has evolved too. The DA14586 offers designers all the benefits of the industry-leading DA1458x but with even greater flexibility to create more advanced applications from the smallest footprints and power budgets.

As part of the SmartBond family, the DA14586 is one of the smallest, lowest power and most integrated Bluetooth® solutions available. This versatile system-on-chip (SoC) is ideal for adding Bluetooth Low Energy (LE) to products like remote controls, proximity tags, beacons, connected medical devices, and smart home nodes. It supports all Bluetooth developments up to Bluetooth 5. Plus, with 96kB of RAM, the DA14586 has double the memory for user applications of its predecessor to take full advantage of the standard's features. It also includes an integrated microphone interface for voice support at low additional cost. The wide supply voltage range (0.9V – 3.6V) covers a larger choice of energy sources and gives full design flexibility. Large memory supports complex applications, while ultra‑low power operation delivers the longest battery life and reduced Bill of Materials (BOM) cost.

SmartBond™ DA14586 combines the benefits of the lowest power, smallest size and lowest system cost Bluetooth Low Energy SoC with an integrated Flash. Furthermore, the DA14586 is pin-to-pin compatible with the DA14585 thereby offering a unique cost down path from Flash to One-Time-Programmable (OTP) memory.

Like all SmartBond solutions, the DA14586 is easy to design-in and supports standalone as well as hosted applications. It is supported by a complete development environment and the SmartSnippets™ software that helps you optimize your software for power consumption.

产品参数

属性
Wireless StandardBLE 5.0 Core specification
Proprietary 2G4 protocolNo
CPUM0
Flash Memory (KB)256
ROM (KB)128
Memory Size (OTP) (KB)64
RAM (KB)96
GPIOs (#)24
Vcc (V)0.9-3.3
Integrated DCDCIntegrated Buck DC-DC converter
Integrated Battery ChargerNo
Tx Current (mA)3.4
Rx current (mA)3.7
Output Power Range (dBm)-20
Sensitivity (dBm) (dBm)-93
Clock Rate (MHz)16
Flexible System ClockNo
Execute from FLASHNo
Hardware Crypto EngineYes
QSPI Interface (#)0
SPI (#)1
I2C (#)1
UART (#)2
ADC10-bit x 4-ch
USB Ports (#)0
LE Data Length ExtensionsSupported
2MbpsNot Supported
LE Coded PHY (Long Range)Not Supported
Extended AdvertisingNot Supported
Periodic AdvertisingNot Supported
AoANot Supported
AoDNot Supported
GATT CachingNot Supported
Bluetooth® MeshNot Supported
Temp. Range (°C)-40 to +85°C

封装选项

Pkg. TypePkg. Dimensions (mm)Lead Count (#)Pitch (mm)
QFN5 x 5 x 0.9400.45

应用

  • Remote controls
  • Proximity tags and trackers
  • Beacons
  • Connected medical devices
  • Smart home
  • Human interface devices
  • VR controllers
  • Connected sensors
  • Wireless charging
Part NumberStatusSamplesStockRoHSPackageBudgetary Price (USD)Lead Count (#)Carrier TypeMoisture Sensitivity Level (MSL)Pb (Lead) FreeTemp. Range (°C)Country of AssemblyCountry of Wafer Fabrication
DA14586-00F02AT2ActiveN/AIn StockRoHS:EN
QFN1ku | $2.89340#Tape & Reel3Yes-40 to +85°CTAIWANTAIWAN

Renesas Boards & Kits

支持社区

  1. DA14586 Internal Flash Access

    ... that "During the boot sequence, the four SPI pins of port P2 are used to access the internal Flash memory." (p. 19 Table 1 of DA14586 datasheet). Can I write to this memory area when the DA14586 boots? I'd like to write the firmware image to the DA14586 using ...

    2018年5月1日
  2. DA14586的SPI无法访问外部的设备

    ... 的DA14583上我们使用你们的 SPI访问ADXL362都是正常的。现在在你们的DA14586上也不可以了。但是访问DA14586内部的FLASH都是正常的,示波器也 ...

    2017年11月29日
  3. da14586 的网格生产问题

    你好对话, 我有一个项目将使用大约数千甚至数百万的da14586 / da14585。 您能否确保我现在可用的网格SDK与da14586 / da14585兼容,并且支持 ...

    2018年11月3日
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