RZ/A1L

特性

CPU: Cortex-A9 core, Max. 400MHz
Power supply voltage: 3.3V/1.8V
Package: 176-pin LFBGA, 176/208 pin LFQFP
On-chip RAM: Large-capacity memory
Graphics functions: Video display controller, Capture engine unit
Connectivity: Ethernet, USB host/function x 2 channels, SD host interface x 2 channels, etc.
Others: A/D converter (12-bit resolution) x 8 channels, 32-bit OS timer x 2 channels, Serial communication interface with 16-stage FIFO (SCIF) x 5 channels, etc.

RZ/A1L Block Diagram

描述

The RZ/A1L Group MPUs feature an Arm® Cortex®-A9 core running at 400MHz and 3MB of on-chip SRAM. With 3MB on-chip SRAM, the RZ/A1L supports up to 2 Displays with WVGA (800x480) resolution or a single display with WSVGA (1024x600) resolution without the need for external memory. RZ/A1L enables very compact embedded designs without the need to worry about memory procurement and memory EOL. With RZ/A1L, you can design your embedded system like an MCU and get the performance of a 400MHz Arm® Cortex®-A9 MPU. Enabled for support with Linux, RTOS or Bare-metal, this is the ideal device for designing Intelligent IoT End Point devices with compactness and high performance. Supported in QFP and BGA packages with different sizes to support board layout flexibility and with SDRAM interface to expand up to 128MB of external memory. Get Started Using RZ/A1 MPUs.

产品参数

属性	值
CPU Architecture	Arm
Main CPU	Cortex-A9
Program Memory (KB)	0
RAM (KB)	3072
Carrier Type	Bulk (Tray), Full Carton (Tray)
Supply Voltage (V)	3 - 3.6
I/O Ports	100, 122
NPU	No
DRAM I/F	SDRAM
3D GPU	No
Temp. Range (°C)	Ta = -40 to +85
Operating Freq (Max) (MHz)	400
Ethernet speed	10M/100M
Ethernet (ch)	1
EtherCat (ch) (#)	0
USB FS (host ch/device ch)	( 0 / 0 )
USB HS (host ch/device ch)	( 2 / 2 )
USB SS (host ch/device ch)	( 0 / 0 )
PCI Express (generation and ch)	No
SCI or UART (ch)	5
SPI (ch)	3
I2C (#)	4
CAN (ch)	2
CAN-FD (ch)	0
Wireless	No
SDHI (ch)	2
High Resolution Output Timer	No
PWM Output (pin#)	16
32-Bit Timer (ch)	2
16-Bit Timer (ch) (#)	5
8-Bit Timer (ch)	0
Standby operable timer	No
Asynchronous General Purpose Timer / Interval Timer (ch)	0
16-Bit A/D Converter (ch)	0
14-Bit A/D Converter (ch)	0
12-Bit A/D Converter (ch)	8
10-Bit A/D Converter (ch)	0
24-Bit Sigma-Delta A/D Converter (ch)	0
16-Bit D/A Converter (ch)	0
12-Bit D/A Converter (ch)	0
10-Bit D/A Converter (ch) (#)	0
8-Bit D/A Converter (ch)	0
Capacitive Touch Sensing Unit (ch)	0
Graphics LCD Controller	Yes
MIPI Interfaces (DSI) (ch)	0
MIPI Interfaces (CSI) (ch)	0
Image Codec	No
Segment LCD Controller	No
Security & Encryption	No

封装选项

Pkg. Type	Pkg. Dimensions (mm)	Lead Count (#)	Pitch (mm)
LFBGA	8 x 8 x 1.4	176	0.5
LFQFP	24 x 24 x 1.7	176	0.5
LQFP	28 x 28 x 1.7	208	0.5

应用

Home Appliance
Healthcare
Security

Part Number	Status	Samples	Longevity	Stock	Package	Budgetary Price (USD)	Carrier Type	Family Name	Series Name	Group Name	CPU Architecture	Main CPU	Sub CPU	Floating Point Unit	Bit Length	RAM (KB)	ECC SRAM	Lead Count (#)	Pitch (mm)	Pkg. Dimensions (mm)	Number of Supply Voltage(s) (#)	Supply Voltage (V)	I/O Ports	DMAC or DTC	DMA (ch)	Power-On Reset	Watchdog Timer (ch)	External Memory Bus (bit)	DRAM I/F	NPU	3D GPU	Accelerator	MOQ	Temp. Range (°C)	External Interrupt Pins (#)	LVD or PVD	Operating Freq (Max) (MHz)	Sub-clock (32.768 kHz)	On-chip Oscillator	Ethernet speed	Ethernet (ch)	USB Ports (#)	USB FS (host ch/device ch)	USB HS (host ch/device ch)	USB SS (host ch/device ch)	PCI Express (generation and ch)	SCI or UART (ch)	SPI (ch)	QSPI (ch)	OSPI (ch)	I2C (#)	CAN (ch)	Wireless	IrDA	LIN (#)	SDHI (ch)	High Resolution Output Timer	PWM Output (pin#)	32-Bit Timer (ch)	16-Bit Timer (ch) (#)	Standby operable timer	RTC	12-Bit A/D Converter (ch)	Graphics LCD Controller	Camera I/F (Parallel)	Image Codec	2D Drawing Engine	Segment LCD Controller	SSI (ch)	Security & Encryption	Debug Interface	Moisture Sensitivity Level (MSL)	Country of Assembly	Country of Wafer Fabrication
R7S721020VCBG#AC1	Active	Available		In Stock	LFBGA	1ku \| $7.67	Bulk (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	176#	0.5mm	8 x 8 x 1.4	2#	3 - 3.6	100	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	108#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	JAPAN, TAIWAN
R7S721020VCBG#BC1	Active	Available	2036 Mar	Out of Stock	LFBGA	1ku \| $7.67	Full Carton (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	176#	0.5mm	8 x 8 x 1.4	2#	3 - 3.6	100	DMAC	16	Yes	1	32	SDRAM	No	No	No	2871	Ta = -40 to +85	108#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	TAIWAN
R7S721020VCFP#AA1	Active	Available		Out of Stock	LFQFP	1ku \| $8.26	Bulk (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	176#	0.5mm	24 x 24 x 1.7	2#	3 - 3.6	100	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	108#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	JAPAN, TAIWAN
R7S721020VCFP#BA1	Active	Available	2036 Mar	Out of Stock	LFQFP	1ku \| $8.26	Full Carton (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	176#	0.5mm	24 x 24 x 1.7	2#	3 - 3.6	100	DMAC	16	Yes	1	32	SDRAM	No	No	No	320	Ta = -40 to +85	108#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	TAIWAN
R7S721021VCFP#AA1	Active	Available	2036 Mar	Out of Stock	LFQFP	1ku \| $9.61	Bulk (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	208#	0.5mm	28 x 28 x 1.7	2#	3 - 3.6	122	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	130#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	JAPAN, TAIWAN
R7S721021VCFP#BA1	Active	Available		Out of Stock	LFQFP	1ku \| $9.61	Full Carton (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	208#	0.5mm	28 x 28 x 1.7	2#	3 - 3.6	122	DMAC	16	Yes	1	32	SDRAM	No	No	No	240	Ta = -40 to +85	130#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	TAIWAN
R7S721020VLFP#AA1	NRND	N/A		Out of Stock	LFQFP		Bulk (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	176#	0.5mm	24 x 24 x 1.7	2#	3 - 3.6	100	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	108#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3
R7S721021VLFP#AA1	NRND	N/A		In Stock	LFQFP	1ku \| $46.79	Bulk (Tray)	RZ	RZ/A	A1L	Arm	Cortex-A9	No	Double/Single	32	3072KB	No	208#	0.5mm	28 x 28 x 1.7	2#	3 - 3.6	122	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	130#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	5	3	1	1	4#	2	No	Yes	1#	2	No	16	2	5#	No	Yes	8	Yes	No	No	No	No	4ch	No	JTAG/SWD	3	JAPAN	JAPAN, TAIWAN

加载中

筛选

其他
英语
RZ/A1L Group, RZ/A1LU Group, RZ/A1LC Group Handbook
RECOMMENDED
PDF 276 KB R01TB0145EJ0100 Rev.1.00 2026年5月21日
Essential guidance and reference materials for product development are organized by each development phase, supporting efficient planning and execution. The handbook helps teams align processes, deliverables, and milestones throughout development of the RZ/A1L, RZ/A1LU, and RZ/A1LC.
指南
英语
RZ Family Product Part Number Guide
PDF 941 KB EP1GP-AB-24-0001-1 2026年3月12日
技术更新
英语
RZ/A Series: Note about IRQ Interrupt request register erroneous clear of Interrupt Controller.
PDF 139 KB TN-RZ*-A0151A/E 日本語 2026年1月08日
宣传手册
英语
RZ Family Brochure
PDF 17.89 MB R01CP0031EJ1200 Rev.12.00 日本語 2025年10月01日
产品变更通告
英语
Package assembly site addition for RZ/A1L (208pinLQFP) (EPPO-EX-25-0019-1)
PDF 338 KB EPPO-EX-25-0019-1(r) 日本語 2025年6月23日
产品变更通告
英语
Adding of Cu bonding wire product for RZ/A1L group (EPPO-EX-25-0016-1)
PDF 109 KB EPPO-EX-25-0016-1 日本語 2025年6月11日
数据手册
英语
RZ/A1L Group, RZ/A1LU Group, RZ/A1LC Group Datasheet
RECOMMENDED
PDF 3.71 MB R01DS0480EJ0100 Rev.1.00 2024年12月25日
产品咨询
英语
Addition of full carton packaging for MPU products (RZ/A, RZ/T, RZ/N) (PC-MCU-A032A/E)
PDF 301 KB PC-MCU-A032A/E 日本語 2024年10月24日
手册 - 硬件
英语
RZ/A1L Group, RZ/A1LU Group, RZ/A1LC Group User's Manual: Hardware
RECOMMENDED
PDF 32.08 MB R01UH0437EJ0700 Rev.7.00 日本語 2024年9月30日
The RZ/A1LU, RZ/A1L, and RZ/A1LC groups are entry- to mid-range MPUs for HMI applications, featuring an Arm® Cortex®-A9 core (400 MHz) and up to 3 MB of on-chip RAM. With functions optimized for HMI control, these devices are well suited to low-cost and compact HMI equipment. The RZ/A1LU, RZ/A1L, and RZ/A1LC groups hardware manual describes the A9 core subsystem, LCD control, JPEG codec, peripheral interfaces, and related features, providing the information required to design HMI systems that effectively utilize the on-chip RAM.
应用说明
英语
How to use IAR Systems compiler in e² studio
PDF 666 KB R20AN0733EJ0200 Rev.2.00 日本語 2024年9月13日
AI 生成的摘要: The document explains how to integrate and use IAR Systems compilers within the e² studio development environment for Renesas microcontrollers. It details the installation of IAR Embedded Workbench and IAR Eclipse plugins, project creation, build configuration, and build execution using IAR compilers. The guide focuses on the RA family with the IAR ARM compiler but applies similarly to other Renesas devices. It also recommends using standalone Flexible Software Package configurators for RA and RZ families to enhance development. The environment setup assumes Windows 10 64-bit, e² studio 2024-07, and IAR tools installed.
产品变更通告
英语
Addition of a Wafer production site for RZ/A1L group (EPMP-IMB-23-0013-1)
PDF 97 KB EPMP-IMB-23-0013-1 日本語 2023年2月02日
技术更新
英语
RZ/A Series: Notes about capture address and capture horizontal size of Capture Engine Unit
PDF 207 KB TN-RZ*-A0103A/E 日本語 2022年12月27日
传单
英语
Introduction to Renesas RZ/A Series
PDF 423 KB R01PF0230EU0100 Rev.1.00 日本語 2022年8月05日
应用说明
英语
e² studio Creating and executing build CMake project
PDF 1.11 MB R20AN0613EJ0201 Rev.2.01 日本語 2022年6月28日
AI 生成的摘要: This guide explains how to create and build CMake projects using e² studio. It covers installing necessary tools such as e² studio, CMake, and GNU Make, creating a new CMake project, and configuring the builder by disabling the default CDT Core Builder and adding CMake and Make commands. The instructions include setting up environment variables and specifying CMake command parameters to generate native build files from platform-independent CMakeLists.txt configurations.
应用说明
英语
How to automate CUnit tests in e² studio and Jenkins
PDF 2.26 MB R20AN0526EE0101 Rev.1.01 日本語 2022年6月15日
AI 生成的摘要: This document explains how to automate CUnit tests in Renesas e² studio using EGit and Jenkins. It covers creating a Git repository, pushing code changes via EGit, and setting up Jenkins to build and run CUnit tests automatically. The process includes configuring Jenkins to poll the repository, build the project, execute tests, and generate reports. It also details modifying the SampleC Unit project to link the CUnit static library and output test results to a file for automation.

数据手册 (1)

数据手册
英语
RZ/A1L Group, RZ/A1LU Group, RZ/A1LC Group Datasheet
RECOMMENDED
PDF 3.71 MB R01DS0480EJ0100 Rev.1.00 2024年12月25日

手册和指南 (2)

指南
英语
RZ Family Product Part Number Guide
PDF 941 KB EP1GP-AB-24-0001-1 2026年3月12日
手册 - 硬件
英语
RZ/A1L Group, RZ/A1LU Group, RZ/A1LC Group User's Manual: Hardware
RECOMMENDED
PDF 32.08 MB R01UH0437EJ0700 Rev.7.00 日本語 2024年9月30日
The RZ/A1LU, RZ/A1L, and RZ/A1LC groups are entry- to mid-range MPUs for HMI applications, featuring an Arm® Cortex®-A9 core (400 MHz) and up to 3 MB of on-chip RAM. With functions optimized for HMI control, these devices are well suited to low-cost and compact HMI equipment. The RZ/A1LU, RZ/A1L, and RZ/A1LC groups hardware manual describes the A9 core subsystem, LCD control, JPEG codec, peripheral interfaces, and related features, providing the information required to design HMI systems that effectively utilize the on-chip RAM.

应用说明和白皮书 (7)

应用说明
英语
How to use IAR Systems compiler in e² studio
PDF 666 KB R20AN0733EJ0200 Rev.2.00 日本語 2024年9月13日
AI 生成的摘要: The document explains how to integrate and use IAR Systems compilers within the e² studio development environment for Renesas microcontrollers. It details the installation of IAR Embedded Workbench and IAR Eclipse plugins, project creation, build configuration, and build execution using IAR compilers. The guide focuses on the RA family with the IAR ARM compiler but applies similarly to other Renesas devices. It also recommends using standalone Flexible Software Package configurators for RA and RZ families to enhance development. The environment setup assumes Windows 10 64-bit, e² studio 2024-07, and IAR tools installed.
应用说明
英语
e² studio Creating and executing build CMake project
PDF 1.11 MB R20AN0613EJ0201 Rev.2.01 日本語 2022年6月28日
AI 生成的摘要: This guide explains how to create and build CMake projects using e² studio. It covers installing necessary tools such as e² studio, CMake, and GNU Make, creating a new CMake project, and configuring the builder by disabling the default CDT Core Builder and adding CMake and Make commands. The instructions include setting up environment variables and specifying CMake command parameters to generate native build files from platform-independent CMakeLists.txt configurations.
应用说明
英语
How to automate CUnit tests in e² studio and Jenkins
PDF 2.26 MB R20AN0526EE0101 Rev.1.01 日本語 2022年6月15日
AI 生成的摘要: This document explains how to automate CUnit tests in Renesas e² studio using EGit and Jenkins. It covers creating a Git repository, pushing code changes via EGit, and setting up Jenkins to build and run CUnit tests automatically. The process includes configuring Jenkins to poll the repository, build the project, execute tests, and generate reports. It also details modifying the SampleC Unit project to link the CUnit static library and output test results to a file for automation.
应用说明
英语
Integrated Development Environment e² studio: How to use EGit in e² studio Rev.1.01
PDF 1.79 MB R20AN0523EE0101 Rev.1.01 日本語 2021年7月26日
AI 生成的摘要: This section explains how to install and configure EGit within the e² studio environment. It details selecting Git integration during e² studio installation, updating EGit via the Help menu, and adding the EGit update repository. The guide also covers setting user identification for Git commits by configuring user name and email in the preferences. Finally, it describes opening the EGit perspective to start using Git features within e² studio.
应用说明
英语
RZ/A1 Guidelines for High-Speed USB2.0 Board Design
PDF 413 KB R01AN5119EJ0120 Rev.1.20 日本語 2020年5月26日
AI 生成的摘要: Guidelines for designing High-Speed USB 2.0 circuit boards focus on ensuring signal integrity and proper impedance control for 480 Mbps communication. Key points include maintaining a differential impedance of 90 Ω ± 15%, limiting wiring length to 300 mm for host controllers and 100 mm for function controllers, and ensuring minimal length difference between D+ and D- lines (2.5 mm or less). The USB transmission lines must be routed on a single layer without vias, separated from noisy signals, and surrounded by a ground guard ring spaced at least three times the D+/D- line spacing. Power supply pins and USB module pin functions are detailed for proper hardware design. The document also covers layout recommendations such as gentle turns in wiring and ground plane requirements.

查看更多 (7)

产品通告（产品变更、EOL 等） (7)

产品变更通告
英语
Package assembly site addition for RZ/A1L (208pinLQFP) (EPPO-EX-25-0019-1)
PDF 338 KB EPPO-EX-25-0019-1(r) 日本語 2025年6月23日
产品变更通告
英语
Adding of Cu bonding wire product for RZ/A1L group (EPPO-EX-25-0016-1)
PDF 109 KB EPPO-EX-25-0016-1 日本語 2025年6月11日
产品咨询
英语
Addition of full carton packaging for MPU products (RZ/A, RZ/T, RZ/N) (PC-MCU-A032A/E)
PDF 301 KB PC-MCU-A032A/E 日本語 2024年10月24日
产品变更通告
英语
Addition of a Wafer production site for RZ/A1L group (EPMP-IMB-23-0013-1)
PDF 97 KB EPMP-IMB-23-0013-1 日本語 2023年2月02日
产品变更通告
英语
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction)
PDF 4.86 MB PC-WRP-A001C/E 日本語 2018年1月23日

查看更多 (7)

勘误表和技术更新 (16)

技术更新
英语
RZ/A Series: Note about IRQ Interrupt request register erroneous clear of Interrupt Controller.
PDF 139 KB TN-RZ*-A0151A/E 日本語 2026年1月08日
技术更新
英语
RZ/A Series: Notes about capture address and capture horizontal size of Capture Engine Unit
PDF 207 KB TN-RZ*-A0103A/E 日本語 2022年12月27日
技术更新
英语
RZ/A Series: RLIN3 Self-Test Mode constraints
PDF 177 KB TN-RZx-A0062A/E 日本語 2019年12月12日
技术更新
英语
Notes about CLUT table of Video Display Controller 4 and 5
PDF 145 KB TN-RZx-A042A/E 日本語 2017年12月14日
技术更新
英语
RZ/A Series: Notes about transition to software standby mode
PDF 373 KB TN-RZx-A041A/E 日本語 2017年12月14日

查看更多 (16)

原理图和设计文件 (1)

PCB 设计文件
英语
Circuit Diagram CAD Data for RZ/A Series (OrCAD® Version)
登录后下载 ZIP 49 KB D6003857 日本語 2019年6月10日

营销资料 (2)

宣传手册
英语
RZ Family Brochure
PDF 17.89 MB R01CP0031EJ1200 Rev.12.00 日本語 2025年10月01日
传单
英语
Introduction to Renesas RZ/A Series
PDF 423 KB R01PF0230EU0100 Rev.1.00 日本語 2022年8月05日

其他 (1)

其他
英语
RZ/A1L Group, RZ/A1LU Group, RZ/A1LC Group Handbook
RECOMMENDED
PDF 276 KB R01TB0145EJ0100 Rev.1.00 2026年5月21日
Essential guidance and reference materials for product development are organized by each development phase, supporting efficient planning and execution. The handbook helps teams align processes, deliverables, and milestones throughout development of the RZ/A1L, RZ/A1LU, and RZ/A1LC.

Partner Boards & Kits

Complementary Silicon Devices

DRAM & Flash Memory Solutions

Provides a comprehensive external memory solution for Renesas RZ and R‑Car families, supporting systems that require scalable off‑chip memory. Supported memory types include Serial NAND (Quad/Octal SPI, 512Mb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), ONFI NAND (ONFI 1.0, 1Gb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), DRAM (DDR2/3/4 from 512Mb to 32Gb and LPDDR2/3/4/4x/5/5x from 1Gb to 16Gb), and HyperRAM™ (HyperBus, 64Mb to 512Mb, 1.8V and 1.2V).

Provided By:

Winbond Electronics Corp. Japan

加载中

支持社区

RZ / A1L操作eMMC参考例程
你好：官网没找到RZ / A1L操作eMMC的例程，请问如何获取？谢谢!
2025年6月9日
- Microprocessors (CN)
- RZ/A Forum (CN)

知识库

RZ/A1 组, RZ/A2M, RZ/A3UL: APP: Adjusted Peak Performance
RZ/A1 group (RZ/A1H, M, L, LU, LC)APP=0.000120 WT RZ/A2MAPP=0.000158 WT RZ/A3ULAPP=0.001200WT
RZ/A1 Group: 时钟输入选择
... 钟通过该设置，可以分别设置系统时钟源和USB操作时钟源。 Suitable Products RZ/A1L, RZ/A1LU, RZ/A1LCRZ/A1H, RZ/A1M 查看英文版查看日文版
2023年8月8日
RZ/A1组, RZ/A2M: 用于摄像头输入和 LCD 输出的缓冲内存
不建议放在外部 RAM 中。用于摄像头输入和 LCD 输出的缓冲存储器应置于内部 RAM 中。
2023年12月4日

查看所有来自知识库的搜索结果 (6个)

支持社区

在线询问瑞萨电子工程社群的技术人员，快速获得技术支持。

获取支持

知识库

浏览我们的知识库，获取文章、常见问题解答及其他实用资源。

浏览文章

提交工单

需要咨询技术性问题或提供非公开信息吗？

提交工单

Product Selector 微控制器和微处理器

中文

RTOS MPU with 3MB of On-chip RAM

特性

描述

产品参数

封装选项

应用

筛选

当前筛选条件

推荐文档 (3)

数据手册 (1)

手册和指南 (2)

应用说明和白皮书 (7)

产品通告（产品变更、EOL 等） (7)

勘误表和技术更新 (16)

No Results Found.

原理图和设计文件 (1)

No Results Found.

No Results Found.

No Results Found.

营销资料 (2)

其他 (1)

No Results Found.

No Results Found.

Partner Boards & Kits

DRAM & Flash Memory Solutions

筛选

当前筛选条件

软件与工具

按类型筛选

按供应商筛选

样例程序

按应用筛选

按功能筛选

按编译器筛选

按 IDE 筛选

模拟模型

Partner Solutions

推荐 (1)

软件与工具 (7)

样例程序 (2)

模拟模型 (6)

Partner Solutions (69)

支持社区

知识库

支持社区

知识库

提交工单