RZ/A1M

特性

CPU: Cortex-A9 core, Max. 400MHz
Voltage: 3V to 3.6V
Package: 324-pin FBGA, 256-pin LFBGA, 256-pin LFQFP
Memory: SRAM Max. 5MB
Timer: 32-bit Timer (ch) x 2, 16-bit Timer (ch) x 5, Watchdog Timer (ch) x 1, Motor Control PWM Timer x 8
PWM: PWM Output x 16, 3-phase PWM Output Function
Analog function: 12-bit A/D Converter (ch) x 8
Others: PLL, RTC, Power-On Reset

RZ/A1M Block Diagram

描述

The RZ/A1M Group MPUs are full-featured with an Arm® Cortex®-A9 core running at 400MHz and 5MB of on-chip SRAM. With 5MB on-chip SRAM, the RZ/A1M supports up to 2 Displays with WSVGA (1024x600) resolution or a single display with WXGA (1280x800) resolution without the need for external memory. RZ/A1M enables very compact embedded designs without the need to worry about memory procurement and memory EOL. With RZ/A1M, you can design your embedded system like an MCU and get the performance of a 400MHz Arm® Cortex®-A9 MPU. Enabled for support with Linux, RTOS or Bare-metal, this is the ideal device for designing Intelligent IoT End Point devices with compactness and high performance. Supported in QFP and BGA packages with different sizes to support board layout flexibility and with SDRAM interface to expand up to 128MB of external memory. Get Started Using RZ/A1 MPUs.

产品参数

属性	值
CPU Architecture	Arm
Main CPU	Cortex-A9
Program Memory (KB)	0
RAM (KB)	5120
Carrier Type	Bulk (Tray)
Supply Voltage (V)	3 - 3.6
I/O Ports	139, 171
NPU	No
DRAM I/F	SDRAM
3D GPU	No
Temp. Range (°C)	Ta = -40 to +85
Operating Freq (Max) (MHz)	400
Ethernet speed	10M/100M
Ethernet (ch)	1
EtherCat (ch) (#)	0
USB FS (host ch/device ch)	( 0 / 0 )
USB HS (host ch/device ch)	( 2 / 2 )
USB SS (host ch/device ch)	( 0 / 0 )
PCI Express (generation and ch)	No
SCI or UART (ch)	8
SPI (ch)	5
I2C (#)	4
CAN (ch)	5
CAN-FD (ch)	0
Wireless	No
SDHI (ch)	2
High Resolution Output Timer	No
PWM Output (pin#)	32
32-Bit Timer (ch)	2
16-Bit Timer (ch) (#)	5
8-Bit Timer (ch)	0
Standby operable timer	No
Asynchronous General Purpose Timer / Interval Timer (ch)	0
16-Bit A/D Converter (ch)	0
14-Bit A/D Converter (ch)	0
12-Bit A/D Converter (ch)	8
10-Bit A/D Converter (ch)	0
24-Bit Sigma-Delta A/D Converter (ch)	0
16-Bit D/A Converter (ch)	0
12-Bit D/A Converter (ch)	0
10-Bit D/A Converter (ch) (#)	0
8-Bit D/A Converter (ch)	0
Capacitive Touch Sensing Unit (ch)	0
Graphics LCD Controller	Yes
MIPI Interfaces (DSI) (ch)	0
MIPI Interfaces (CSI) (ch)	0
Image Codec	JPEG
Segment LCD Controller	No
Security & Encryption	No

封装选项

Pkg. Type	Pkg. Dimensions (mm)	Lead Count (#)	Pitch (mm)
FBGA	19 x 19 x 2.1	324	0.8
LFBGA	11 x 11 x 1.4	256	0.5
LQFP	28 x 28 x 1.7	256	0.4

应用

Home Appliance
Healthcare
Security

Part Number	Status	Samples	Longevity	Stock	Package	Budgetary Price (USD)	Carrier Type	Family Name	Series Name	Group Name	CPU Architecture	Main CPU	Sub CPU	Floating Point Unit	Bit Length	RAM (KB)	ECC SRAM	Lead Count (#)	Pitch (mm)	Pkg. Dimensions (mm)	Number of Supply Voltage(s) (#)	Supply Voltage (V)	I/O Ports	DMAC or DTC	DMA (ch)	Power-On Reset	Watchdog Timer (ch)	External Memory Bus (bit)	DRAM I/F	NPU	3D GPU	Accelerator	MOQ	Temp. Range (°C)	External Interrupt Pins (#)	LVD or PVD	Operating Freq (Max) (MHz)	Sub-clock (32.768 kHz)	On-chip Oscillator	Ethernet speed	Ethernet (ch)	USB Ports (#)	USB FS (host ch/device ch)	USB HS (host ch/device ch)	USB SS (host ch/device ch)	PCI Express (generation and ch)	SCI or UART (ch)	SPI (ch)	QSPI (ch)	OSPI (ch)	I2C (#)	CAN (ch)	Wireless	IrDA	LIN (#)	SDHI (ch)	High Resolution Output Timer	PWM Output (pin#)	32-Bit Timer (ch)	16-Bit Timer (ch) (#)	Standby operable timer	RTC	12-Bit A/D Converter (ch)	Graphics LCD Controller	Camera I/F (Parallel)	Image Codec	2D Drawing Engine	Segment LCD Controller	SSI (ch)	Security & Encryption	Debug Interface	Moisture Sensitivity Level (MSL)	Country of Assembly	Country of Wafer Fabrication
R7S721010VCBG#AC0	Active	Available	2031 Mar	In Stock	LFBGA	1ku \| $13.44	Bulk (Tray)	RZ	RZ/A	A1M	Arm	Cortex-A9	No	Double/Single	32	5120KB	No	256#	0.5mm	11 x 11 x 1.4	2#	3 - 3.6	139	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	139#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	8	5	2	2	4#	5	No	Yes	2#	2	No	32	2	5#	No	Yes	8	Yes	24-bit	JPEG	Yes	No	6ch	No	JTAG/SWD	3	JAPAN	JAPAN
R7S721010VCFP#AA0	Active	Available	2031 Mar	In Stock	LFQFP	1ku \| $15.11	Bulk (Tray)	RZ	RZ/A	A1M	Arm	Cortex-A9	No	Double/Single	32	5120KB	No	256#	0.4mm	28 x 28 x 1.7	2#	3 - 3.6	139	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	139#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	8	5	2	2	4#	5	No	Yes	2#	2	No	32	2	5#	No	Yes	8	Yes	24-bit	JPEG	Yes	No	6ch	No	JTAG/SWD	3	JAPAN	JAPAN
R7S721011VCBG#AC0	Active	Available	2031 Mar	In Stock	FBGA	1ku \| $16.48	Bulk (Tray)	RZ	RZ/A	A1M	Arm	Cortex-A9	No	Double/Single	32	5120KB	No	324#	0.8mm	19 x 19 x 2.1	2#	3 - 3.6	171	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	171#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	8	5	2	2	4#	5	No	Yes	2#	2	No	32	2	5#	No	Yes	8	Yes	24-bit	JPEG	Yes	No	6ch	No	JTAG/SWD	3	JAPAN	JAPAN
R7S721010VLFP#AA0	NRND	N/A		In Stock	LFQFP	1ku \| $36.9	Bulk (Tray)	RZ	RZ/A	A1M	Arm	Cortex-A9	No	Double/Single	32	5120KB	No	256#	0.4mm	28 x 28 x 1.7	2#	3 - 3.6	139	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	139#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	8	5	2	2	4#	5	No	Yes	2#	2	No	32	2	5#	No	Yes	8	Yes	24-bit	JPEG	Yes	No	6ch	No	JTAG/SWD	3	JAPAN	JAPAN
R7S721011VLBG#AC0	NRND	N/A		Out of Stock	FBGA		Bulk (Tray)	RZ	RZ/A	A1M	Arm	Cortex-A9	No	Double/Single	32	5120KB	No	324#	0.8mm	19 x 19 x 2.1	2#	3 - 3.6	171	DMAC	16	Yes	1	32	SDRAM	No	No	No	1	Ta = -40 to +85	171#	No	400MHz	No	No	10M/100M	1ch	2#	( 0 / 0 )	( 2 / 2 )	( 0 / 0 )	No	8	5	2	2	4#	5	No	Yes	2#	2	No	32	2	5#	No	Yes	8	Yes	24-bit	JPEG	Yes	No	6ch	No	JTAG/SWD	3

加载中

筛选

其他
英语
RZ/A1H Group, RZ/A1M Group Handbook
RECOMMENDED
PDF 214 KB R01TB0144EJ0100 Rev.1.00 2026年4月24日
Essential guidance and reference materials for product development are organized by each development phase, supporting efficient planning and execution. The handbook helps teams align processes, deliverables, and milestones throughout development of the RZ/A1H and RZ/A1M.
指南
英语
RZ Family Product Part Number Guide
PDF 941 KB EP1GP-AB-24-0001-1 2026年3月12日
技术更新
英语
RZ/A Series: Note about IRQ Interrupt request register erroneous clear of Interrupt Controller.
PDF 139 KB TN-RZ*-A0151A/E 日本語 2026年1月08日
宣传手册
英语
RZ Family Brochure
PDF 17.89 MB R01CP0031EJ1200 Rev.12.00 日本語 2025年10月01日
数据手册
英语
RZ/A1H Group, RZ/A1M Group Datasheet
RECOMMENDED
PDF 4.46 MB R01DS0479EJ0100 Rev.1.00 2024年12月25日
产品变更通告
英语
Adding of Cu bonding wire product for RZ/A1H, RZ/A1M and RZ/A1LU group (EP1OP-AB-24-0018-1)
PDF 95 KB EP1OP-AB-24-0018-1 日本語 2024年11月26日
手册 - 硬件
英语
RZ/A1H Group, RZ/A1M Group User's Manual: Hardware
RECOMMENDED
PDF 34.98 MB R01UH0403EJ0700 Rev.7.00 日本語 2024年9月30日
RZ/A1H Group can display WXGA (1280 x 800) and RZ/A1M Group can display XGA (1024 x 768) without requiring external memory. In addition, with two LCD outputs, up to two LCD displays are possible. It enables very compact embedded designs without the need to worry about memory procurement and memory EOL. The RZ/A1H and RZ/A1LM groups hardware manual describes the A9 subsystem, VDC, CMOS camera input, and other features, and support DRAM‑less HMI design by fully leveraging the large on‑chip RAM.
应用说明
英语
How to use IAR Systems compiler in e² studio
PDF 666 KB R20AN0733EJ0200 Rev.2.00 日本語 2024年9月13日
AI 生成的摘要: The document explains how to integrate and use IAR Systems compilers within the e² studio development environment for Renesas microcontrollers. It details the installation of IAR Embedded Workbench and IAR Eclipse plugins, project creation, build configuration, and build execution using IAR compilers. The guide focuses on the RA family with the IAR ARM compiler but applies similarly to other Renesas devices. It also recommends using standalone Flexible Software Package configurators for RA and RZ families to enhance development. The environment setup assumes Windows 10 64-bit, e² studio 2024-07, and IAR tools installed.
技术更新
英语
RZ/A Series: Notes about capture address and capture horizontal size of Capture Engine Unit
PDF 207 KB TN-RZ*-A0103A/E 日本語 2022年12月27日
传单
英语
Introduction to Renesas RZ/A Series
PDF 423 KB R01PF0230EU0100 Rev.1.00 日本語 2022年8月05日
应用说明
英语
e² studio Creating and executing build CMake project
PDF 1.11 MB R20AN0613EJ0201 Rev.2.01 日本語 2022年6月28日
AI 生成的摘要: This guide explains how to create and build CMake projects using e² studio. It covers installing necessary tools such as e² studio, CMake, and GNU Make, creating a new CMake project, and configuring the builder by disabling the default CDT Core Builder and adding CMake and Make commands. The instructions include setting up environment variables and specifying CMake command parameters to generate native build files from platform-independent CMakeLists.txt configurations.
应用说明
英语
How to automate CUnit tests in e² studio and Jenkins
PDF 2.26 MB R20AN0526EE0101 Rev.1.01 日本語 2022年6月15日
AI 生成的摘要: This document explains how to automate CUnit tests in Renesas e² studio using EGit and Jenkins. It covers creating a Git repository, pushing code changes via EGit, and setting up Jenkins to build and run CUnit tests automatically. The process includes configuring Jenkins to poll the repository, build the project, execute tests, and generate reports. It also details modifying the SampleC Unit project to link the CUnit static library and output test results to a file for automation.
应用说明
英语
Integrated Development Environment e² studio: How to use EGit in e² studio Rev.1.01
PDF 1.79 MB R20AN0523EE0101 Rev.1.01 日本語 2021年7月26日
AI 生成的摘要: This section explains how to install and configure EGit within the e² studio environment. It details selecting Git integration during e² studio installation, updating EGit via the Help menu, and adding the EGit update repository. The guide also covers setting user identification for Git commits by configuring user name and email in the preferences. Finally, it describes opening the EGit perspective to start using Git features within e² studio.
应用说明
英语
RZ/A1 Guidelines for High-Speed USB2.0 Board Design
PDF 413 KB R01AN5119EJ0120 Rev.1.20 日本語 2020年5月26日
AI 生成的摘要: Guidelines for designing High-Speed USB 2.0 circuit boards focus on ensuring signal integrity and proper impedance control for 480 Mbps communication. Key points include maintaining a differential impedance of 90 Ω ± 15%, limiting wiring length to 300 mm for host controllers and 100 mm for function controllers, and ensuring minimal length difference between D+ and D- lines (2.5 mm or less). The USB transmission lines must be routed on a single layer without vias, separated from noisy signals, and surrounded by a ground guard ring spaced at least three times the D+/D- line spacing. Power supply pins and USB module pin functions are detailed for proper hardware design. The document also covers layout recommendations such as gentle turns in wiring and ground plane requirements.
应用说明
英语
RZ/A Series Hardware Design Guide
PDF 1.19 MB R01AN4813EJ0130 Rev.1.30 日本語 2020年5月26日
AI 生成的摘要: The document details hardware design guidelines for RZ/A Series LSIs, covering power supply configurations, reset sequences, oscillator circuits, operating modes, and external memory interfaces. It emphasizes separating digital and analog power supplies to minimize noise, especially for PLL power. The guide includes pin functions, boot modes, memory compatibility, debugger interfaces, pin treatments, layout, noise countermeasures, and design checklists. It supports various memory types such as NOR Flash, SDRAM, EEPROM, Serial Flash, HyperBus, Octa Memory, NAND Flash, SD Card, and eMMC. The document also provides references for high-speed USB2.0 and LVDS/MIPI board design guidelines.

数据手册 (1)

数据手册
英语
RZ/A1H Group, RZ/A1M Group Datasheet
RECOMMENDED
PDF 4.46 MB R01DS0479EJ0100 Rev.1.00 2024年12月25日

手册和指南 (2)

指南
英语
RZ Family Product Part Number Guide
PDF 941 KB EP1GP-AB-24-0001-1 2026年3月12日
手册 - 硬件
英语
RZ/A1H Group, RZ/A1M Group User's Manual: Hardware
RECOMMENDED
PDF 34.98 MB R01UH0403EJ0700 Rev.7.00 日本語 2024年9月30日
RZ/A1H Group can display WXGA (1280 x 800) and RZ/A1M Group can display XGA (1024 x 768) without requiring external memory. In addition, with two LCD outputs, up to two LCD displays are possible. It enables very compact embedded designs without the need to worry about memory procurement and memory EOL. The RZ/A1H and RZ/A1LM groups hardware manual describes the A9 subsystem, VDC, CMOS camera input, and other features, and support DRAM‑less HMI design by fully leveraging the large on‑chip RAM.

应用说明和白皮书 (8)

应用说明
英语
How to use IAR Systems compiler in e² studio
PDF 666 KB R20AN0733EJ0200 Rev.2.00 日本語 2024年9月13日
AI 生成的摘要: The document explains how to integrate and use IAR Systems compilers within the e² studio development environment for Renesas microcontrollers. It details the installation of IAR Embedded Workbench and IAR Eclipse plugins, project creation, build configuration, and build execution using IAR compilers. The guide focuses on the RA family with the IAR ARM compiler but applies similarly to other Renesas devices. It also recommends using standalone Flexible Software Package configurators for RA and RZ families to enhance development. The environment setup assumes Windows 10 64-bit, e² studio 2024-07, and IAR tools installed.
应用说明
英语
e² studio Creating and executing build CMake project
PDF 1.11 MB R20AN0613EJ0201 Rev.2.01 日本語 2022年6月28日
AI 生成的摘要: This guide explains how to create and build CMake projects using e² studio. It covers installing necessary tools such as e² studio, CMake, and GNU Make, creating a new CMake project, and configuring the builder by disabling the default CDT Core Builder and adding CMake and Make commands. The instructions include setting up environment variables and specifying CMake command parameters to generate native build files from platform-independent CMakeLists.txt configurations.
应用说明
英语
How to automate CUnit tests in e² studio and Jenkins
PDF 2.26 MB R20AN0526EE0101 Rev.1.01 日本語 2022年6月15日
AI 生成的摘要: This document explains how to automate CUnit tests in Renesas e² studio using EGit and Jenkins. It covers creating a Git repository, pushing code changes via EGit, and setting up Jenkins to build and run CUnit tests automatically. The process includes configuring Jenkins to poll the repository, build the project, execute tests, and generate reports. It also details modifying the SampleC Unit project to link the CUnit static library and output test results to a file for automation.
应用说明
英语
Integrated Development Environment e² studio: How to use EGit in e² studio Rev.1.01
PDF 1.79 MB R20AN0523EE0101 Rev.1.01 日本語 2021年7月26日
AI 生成的摘要: This section explains how to install and configure EGit within the e² studio environment. It details selecting Git integration during e² studio installation, updating EGit via the Help menu, and adding the EGit update repository. The guide also covers setting user identification for Git commits by configuring user name and email in the preferences. Finally, it describes opening the EGit perspective to start using Git features within e² studio.
应用说明
英语
RZ/A1 Guidelines for High-Speed USB2.0 Board Design
PDF 413 KB R01AN5119EJ0120 Rev.1.20 日本語 2020年5月26日
AI 生成的摘要: Guidelines for designing High-Speed USB 2.0 circuit boards focus on ensuring signal integrity and proper impedance control for 480 Mbps communication. Key points include maintaining a differential impedance of 90 Ω ± 15%, limiting wiring length to 300 mm for host controllers and 100 mm for function controllers, and ensuring minimal length difference between D+ and D- lines (2.5 mm or less). The USB transmission lines must be routed on a single layer without vias, separated from noisy signals, and surrounded by a ground guard ring spaced at least three times the D+/D- line spacing. Power supply pins and USB module pin functions are detailed for proper hardware design. The document also covers layout recommendations such as gentle turns in wiring and ground plane requirements.

查看更多 (8)

产品通告（产品变更、EOL 等） (4)

产品变更通告
英语
Adding of Cu bonding wire product for RZ/A1H, RZ/A1M and RZ/A1LU group (EP1OP-AB-24-0018-1)
PDF 95 KB EP1OP-AB-24-0018-1 日本語 2024年11月26日
产品变更通告
英语
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction)
PDF 4.86 MB PC-WRP-A001C/E 日本語 2018年1月23日
产品变更通告
英语
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001B/E )
PDF 3.74 MB PC-WRP-A001B/E 日本語 2017年3月08日
产品变更通告
英语
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001A/E )
PDF 1.46 MB PC-WRP-A001A/E 日本語 2016年7月01日

勘误表和技术更新 (15)

技术更新
英语
RZ/A Series: Note about IRQ Interrupt request register erroneous clear of Interrupt Controller.
PDF 139 KB TN-RZ*-A0151A/E 日本語 2026年1月08日
技术更新
英语
RZ/A Series: Notes about capture address and capture horizontal size of Capture Engine Unit
PDF 207 KB TN-RZ*-A0103A/E 日本語 2022年12月27日
技术更新
英语
RZ/A Series: RLIN3 Self-Test Mode constraints
PDF 177 KB TN-RZx-A0062A/E 日本語 2019年12月12日
技术更新
英语
Notes about CLUT table of Video Display Controller 4 and 5
PDF 145 KB TN-RZx-A042A/E 日本語 2017年12月14日
技术更新
英语
RZ/A Series: Notes about transition to software standby mode
PDF 373 KB TN-RZx-A041A/E 日本語 2017年12月14日

查看更多 (15)

原理图和设计文件 (1)

PCB 设计文件
英语
Circuit Diagram CAD Data for RZ/A Series (OrCAD® Version)
登录后下载 ZIP 49 KB D6003857 日本語 2019年6月10日

营销资料 (2)

宣传手册
英语
RZ Family Brochure
PDF 17.89 MB R01CP0031EJ1200 Rev.12.00 日本語 2025年10月01日
传单
英语
Introduction to Renesas RZ/A Series
PDF 423 KB R01PF0230EU0100 Rev.1.00 日本語 2022年8月05日

其他 (1)

其他
英语
RZ/A1H Group, RZ/A1M Group Handbook
RECOMMENDED
PDF 214 KB R01TB0144EJ0100 Rev.1.00 2026年4月24日
Essential guidance and reference materials for product development are organized by each development phase, supporting efficient planning and execution. The handbook helps teams align processes, deliverables, and milestones throughout development of the RZ/A1H and RZ/A1M.

Renesas Boards & Kits

RZ/A1H-Starter-Kit-Plus

Renesas Starter Kit+ for RZ/A1H

The Renesas Starter Kit+ for RZ/A1H has been developed to speed up device evaluation, code development and so reduce time to market. An Renesas Starter Kit+, as the name suggests, is a complete development kit for the Renesas RZ/A1H device family.

* In order to make a product installer active,... 阅读详情

立即订购

Partner Boards & Kits

Complementary Silicon Devices

DRAM & Flash Memory Solutions

Provides a comprehensive external memory solution for Renesas RZ and R‑Car families, supporting systems that require scalable off‑chip memory. Supported memory types include Serial NAND (Quad/Octal SPI, 512Mb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), ONFI NAND (ONFI 1.0, 1Gb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), DRAM (DDR2/3/4 from 512Mb to 32Gb and LPDDR2/3/4/4x/5/5x from 1Gb to 16Gb), and HyperRAM™ (HyperBus, 64Mb to 512Mb, 1.8V and 1.2V).

Provided By:

Winbond Electronics Corp. Japan

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RTOS MPU with 5MB of On-chip RAM

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