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瑞萨电子 (Renesas Electronics Corporation)

描述

CK-RA6M5 云套件让用户安全地连接到云并且了解基于 Cortex-M33®RA6M5 MCU 组 和云服务的功能。 该套件具有多种网络连接选项,可为大多数全球云服务提供商提供流畅的云连接体验。 该套件配备了用于以太网连接的板载以太网物理层器件(PHY),并包括用于无线连接的 DA16600 Wi-Fi-BLE combo Pmod 。 借助瑞萨电子可扩展性强的软件包(FSP)利用 FreeRTOS、Azure RTOS 等其他中间件堆栈,该套件拥有完整的软件堆栈支持,因此,它可极为高效地开发云,并可大大缩短上市时间。

查看瑞萨电子云解决方案 ,获取完整的云解决方案包。

特性

  • CK-RA6M5 v2 底板
  • 带 US159-DA16600EVZ PMOD 的 Wi-Fi
  • 以太网
  • USB 全速主机和设备
  • 传感器:
    • 湿度和温度
    • 室内空气质量指数
    • 室外空气质量指数
    • 心率、血氧饱和度(SpO2)、呼吸率
    • 气压
    • 6 轴运动跟踪
  • 2 MEMS 麦克风
  • 电池连接器,提高便携性
  • Arduino™(Uno R3)连接器
  • USB Type-C 电源连接器
  • 板载 MCU
    • RF7A6M5BH3CFC 微控制器
    • 200MHz,Arm® Cortex-M33®内核
    • 2MB 代码闪存,512KB SRAM
    • 176 引脚,LQFP 封装
  • 生态系统
    • MCU 和 Pmod 电流测量点
    • 通过 USB 或外部电源提供 5V 输入
    • USB 串行转换器
    • 板载调试(SEGGER J-Link)
    • 4 个用户 LED 灯
    • 一个用户按钮
    • 2 个 Digilent Pmod™(SPI/UART/I2C:Type-6A 和 Type-2A)连接器

应用

类型 文档标题 日期
快速入门指南 PDF 2.92 MB
快速入门指南 PDF 2.70 MB
Provides the fundamental knowledge needed to port example projects from one RA kit to another. It then demonstrates these principles by explaining how to port three example projects of varying levels of complexity from the MCK-RA4T1 to the FPB-RA4T1.
工具新闻 - 发布公告 PDF 182 KB 日本語
应用说明 PDF 402 KB
AI 生成的摘要: The document explains the two operational modes, highlighting their advantages and disadvantages, and provides practical guidance for selecting and using each mode. It also includes reference links to Renesas RA Family Application Projects that demonstrate these modes with detailed examples of the related FSP module usage.
工具新闻 - 通告 PDF 170 KB 日本語
应用说明 PDF 2.35 MB
AI 生成的摘要: This guide details the implementation of AWS IoT Core connectivity and OTA firmware updates on Renesas RA MCUs using the CK-RA6M5 v2 kit with Ethernet. It covers bootloader creation with MCUboot, MQTT/TLS setup, integration of AWS IoT Device SDK components, and secure authentication with X.509 certificates leveraging RA MCU hardware security. It also includes prerequisites, tools, and step-by-step instructions for building secure, cloud-connected applications with OTA updates.
应用说明 PDF 8.33 MB
This guide details the objectives, architecture, and scope of OTA updates using AWS IoT OTA, and provides step-by-step instructions for preparing, executing, and validating firmware updates on the CK-RA6M5 v2 board. The project integrates three core components: a secure bootloader, a cloud connectivity application with downloader functionality, and AWS OTA cloud-side configurations for image storage and update initiation.
应用说明 PDF 1.25 MB
Learn how to effectively use the FSP MQTT/TLS modules in end-product design. By following this guide, developers can add the “AWS Core MQTT,” “Mbed TLS,” and “AWS DA16xxx Wi-Fi sockets wrapper” using the Wi-Fi interface, configure them for the target application, and write code using the included example as a reference for a quick and efficient start.
快速入门指南 PDF 4.27 MB
Learn to run the AWS cloud connectivity application project on CK-RA6M5 v2 via the Wi-Fi DA16600 interface, and develop MQTT/TLS applications using Wi-Fi DA16600 modules on the Renesas RA6 MCU Series.
应用说明 PDF 3.78 MB
Learn how to run the AWS Cloud Connectivity Application Project on the CK-RA6M5 v2 using an Ethernet interface. This guide is intended for users developing applications with MQTT/TLS modules over Ethernet on the Renesas RA6 MCU Series.
应用说明 PDF 1.20 MB
Learn how to effectively use the FSP MQTT/TLS modules for end-product design. By completing this guide, developers will add the “AWS Core MQTT,” “Mbed TLS,” and “AWS TCP Sockets Wrapper” using the Ethernet interface, configure them for the target application, and write code based on the included application example code as a reference, providing an efficient starting point.
应用说明 PDF 2.55 MB
Users can follow the provided steps in this application note to recreate the bootloader and link the application projects to work with the bootloader by using the FSP Solution. This application note also includes procedures for mastering an application to work with the bootloader, and for downloading and updating a new application.
工具新闻 - 发布公告 PDF 284 KB 日本語
应用说明 PDF 4.36 MB
Learn how to use the RA FSP modules in your own design with the FSP-integrated Azure IoT SDK. Upon completing this guide, you will be able to add the FSP modules to your own design, configure them correctly with the Azure IoT SDK for the target application, and write code using the included application example code as a reference and efficient starting point.
快速入门指南 PDF 4.35 MB
Learn to run the AWS cloud connectivity application project on CK-RA6M5 v2 via the cellular interface and develop MQTT/TLS applications using cellular modules on the Renesas RA6 MCU Series.
应用说明
登录后下载 PDF 1.88 MB
Learn how to effectively use the FSP MQTT/TLS modules for end-product design. By completing this guide, developers will add the “AWS Core MQTT,” “Mbed TLS,” and “AWS Cellular Sockets Wrapper” using the cellular interface, configure them for the target application, and write code based on the included application example, providing an efficient starting point.
工具新闻 - 发布公告 PDF 170 KB 日本語
应用说明 PDF 1.19 MB 日本語
AI 生成的摘要: The document explains how to connect Renesas RA MCUs to AWS IoT Core using MQTT over TLS via cellular networks. It covers configuring AWS IoT Core, using MQTT/TLS modules, and integrating AWS Core MQTT, Mbed TLS, and cellular socket wrappers. The guide includes hardware and software requirements, cloud dashboard monitoring, device management, and security features like X.509 certificates and encryption. It targets developers building secure IoT applications with cellular connectivity on RA6M5 MCUs.
应用说明 PDF 4.03 MB
AI 生成的摘要: The document explains how to connect Renesas RA family MCUs to Microsoft Azure IoT services using MQTT over TLS with cellular connectivity. It covers the integration of RA Flexible Software Package (FSP) MQTT/TLS modules and Azure IoT SDK for Embedded C, enabling secure device provisioning, registration, and data exchange via Azure IoT Hub and Device Provisioning Service. The guide details hardware and software requirements, including development tools, cellular modules, and cloud setup. It provides step-by-step instructions for creating, building, and running a sample application on the CK-RA6M5v2 kit, focusing on secure communication and device management in IoT cloud environments.
工具新闻 - 通告 PDF 158 KB 日本語
PCB 设计文件 ZIP 77.80 MB
传单 PDF 412 KB
应用说明 PDF 5.76 MB
AI 生成的摘要: Instructions guide users to run an AWS cloud connectivity project on the CK-RA6M5 board using a Cellular interface. It covers importing, building, and loading the MQTT/TLS application with the Renesas e2 studio IDE and Flexible Software Package v5.0.0. Detailed steps include hardware setup, SIM activation, serial console connection, and AWS IoT configuration. The document emphasizes prerequisites like familiarity with MQTT/TLS, cellular modems, and Renesas development tools. It also explains programming methods, connection settings, and debugging tips to enable seamless cloud communication via LTE Cat-M1 cellular modules.
传单 PDF 614 KB 日本語
快速入门指南 PDF 2.90 MB
手册 - 开发工具 PDF 4.59 MB
快速入门指南 PDF 2.55 MB
手册 - 开发工具 PDF 1.86 MB
发行说明 PDF 189 KB
应用说明 PDF 536 KB
AI 生成的摘要: The AWS dashboard for Renesas CK-RA6M5 and CK-RX65N cloud kits enables visualization and management of sensor data via AWS IoT Core. Users register their cloud kits by creating an account, verifying email, and entering the device UUID. After accepting an AWS Single Sign-On invitation and downloading security certificates, users access the dashboard with initial credentials and then change their password. Each cloud kit receives $10 AWS credits valid for one year; accounts enter quarantine status upon credit expiration, requiring credit card activation. Additional resources and application projects are available for download on Renesas’ website.
PCB 设计文件 ZIP 60.57 MB
31 项目

软件与工具

软件与工具

Software title
Software type
公司
RA 可扩展性强的配置软件包 (FSP)
FSP 是一款增强型软件包,旨在为使用瑞萨电子 RA 系列 Arm 微控制器的嵌入式系统设计提供简单易用且可扩展性强的高质量软件。
Software Package 瑞萨电子
快速连接平台
快速连接平台通过提供兼容的硬件和软件构建模块,实现快速原型设计。
Software and Hardware Development Tools 瑞萨电子
Reality AI Utilities
用于 AI 开发和性能验证的往返工作流程,允许收集数据、优化模型并直接部署到 Renesas 硬件
Solution Toolkit 瑞萨电子
3 项目

样例程序

样例程序

筛选
类型 文档标题 日期 日期
示例代码
登录后下载 ZIP 4.82 MB
Provides the fundamental knowledge needed to port example projects from one RA kit to another. It then demonstrates these principles by explaining how to port three example projects of varying levels of complexity from the MCK-RA4T1 to the FPB-RA4T1.
示例代码
登录后下载 ZIP 10.38 MB
示例代码
登录后下载 ZIP 5.77 MB
Use this application example to add and configure the “AWS Core MQTT,” “Mbed TLS,” and “AWS DA16xxx Wi-Fi sockets wrapper” using the Wi-Fi interface in the target application.
示例代码
[Software=RA FSP|v5.0.0]
登录后下载 ZIP 4.96 MB Compiler: GNUARM-None IDE: e2 studio
Learn how to effectively use the FSP MQTT/TLS modules in end-product design. This sample code allows developers to add and configure the “AWS Core MQTT”, “Mbed TLS”, and “AWS TCP Sockets Wrapper” using the Ethernet interface for the target application.
示例代码
登录后下载 ZIP 2.54 MB
Learn how to create an application project using the MCUboot Module in Protected Mode on the Renesas EK-RA6M4 board with FSP v6.1.0. The intended audience includes product developers, product manufacturers, product support, and end users who are involved in designing application systems involving the use of a secure bootloader.
示例代码
[Software=FSP | v4.2.0],[Toolchain: GCC ARM Embedded Toolchain version 10.3.1.20210824]
登录后下载 ZIP 4.65 MB Compiler: GNUARM-None IDE: e2 studio
Learn how to use the RA FSP modules in your own design with the FSP-integrated Azure IoT SDK. This sample code demonstrates how to correctly add and configure the FSP modules for your target application using the Azure IoT SDK.
示例代码
登录后下载 ZIP 5.95 MB
Use this application example to add and configure the “AWS Core MQTT,” “Mbed TLS,” and “AWS Cellular Sockets Wrapper” using the cellular interface in the target application.
示例代码
登录后下载 ZIP 4.64 MB
示例代码
[Software=RA FSP|v4.2.0]
登录后下载 ZIP 7.74 MB Compiler: GNUARM-None IDE: e2 studio
示例代码
[Software=FSP | v4.2.0],[Toolchain: GCC ARM Embedded Toolchain version 10.3.1.20210824]
登录后下载 ZIP 12.71 MB Compiler: GNUARM-None IDE: e2 studio
示例代码
登录后下载 ZIP 4.11 MB
11 项目

相关评估板和套件

开发板与套件

器件号状态库存预算价格(美元)Remarks
RTK7CKA6M5S08002BEActive有库存1u | $60CK-RA6M5 v2 (Wi-Fi, Ethernet)
RTK7CKA6M5S04001BEObsolete有库存CK-RA6M5 v1 (Cellular LTE CAT-M1, Ethernet)

支持社区

  1. CK-RA6M5 v2开发板MAC address

    我购买了一个CK-RA6M5 v2开发板,没有mac地址的贴纸,请帮我查询一下,系列号是270313

    2024年9月14日
  2. 使用 ck-ra6m5 如何讀取內建的麥克風資料?

    我已經增加了stacks 也使用 ek-ra6m5 改 pin 但都是收不到資料是否有相關資料可以協助?

    2025年4月8日
  3. 请问一下有CPK-RA6M5开发板图片

    请问一下有CPK-RA6M5开发板图片吗?我是想作用画电路连接图的开发板图片

    2025年10月4日
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