跳转到主要内容
瑞萨电子 (Renesas Electronics Corporation)

高端多功能 HMI 平台

概述

描述

对先进人机界面(HMI)的需求在持续增长,因此需要在各个行业中支持多种显示输出(如 RGB 和 MIPI)、灵活的显示分辨率,以及多种外围设备(如麦克风、扬声器、以太网和 CAN FD)。

该多功能 HMI 平台集成了多个外围设备,包括麦克风、以太网和 CAN FD,并且可扩展以满足不同的应用需求。 该平台同时提供基于 MCU 和 MPU 的两种系统方案,MCU 方案支持最高 WXGA 分辨率的单屏显示,MPU 方案支持最高全高清(Full HD)分辨率,可灵活满足不同终端应用的需求。

系统优势:

  • 丰富的 HMI 内置功能,支持两路视频输出、一路摄像头输入、一路麦克风接口和一路音频输出,提供更强大的多媒体处理能力以及灵活的输入/输出集成能力。
  • 灵活的架构设计和强大的系统级模块(SoM)产品,可轻松集成到各种终端应用中,包括医疗 HMI、楼宇自动化显示设备等。

产品对比

应用

方框图

选择相应模块,寻找适合您设计的产品

远程测试该板卡

该板卡已上线云上实验室(Lab on the Cloud),使用我们的 PC 图形界面,无需实体板卡,便可在虚拟实验室中立即开始配置和测试设计。

全高清显示 HMI 平台(基于 MPU)

CN405-2: WEBConnector ArrowLine ArrowLine Arrow.13Line Arrow.14Line Arrow.151.8/3.3V1.8/3.3V1.8/3.3V1.8/3.3V1.8/3.3V1.8/3.3V1.2/1.8V1.2/1.8V1.2/1.8V 1.8/3.3V1.8/3.3V1.8/3.3VLine Arrow.29Line Arrow.30Line Arrow.31Line Arrow.320.8V0.8V0.8V1.1V1.1V1.1V1.8V1.8V1.8V3.3V3.3V3.3VLine Arrow.391.8V1.8V1.8V3.3V3.3V3.3VLine Bi-directionalLine Bi-directional.58Line Bi-directional.61Line Bi-directional.64SDRAMSDRAMSDRAMConnected signals arrowFlashFlashFlashCameraSheet.76Sheet.77MicrophoneSheet.81Sheet.82Speakerspeaker_8_Sheet.86Sheet.87Sheet.88Sheet.89Connector Arrow.90Line Arrow.91Line Arrow.92Bi-directionalEthernet LAN 2LANLANLine Bi-directional.102SD CardSheet.104Sheet.105Sheet.106Sheet.107Sheet.108Sheet.109Sheet.110Sheet.111Sheet.112Sheet.113LCD (TFT-LCD)Block.120TFT-LCDTFT-LCDTFT-LCDSheet.142Sheet.143Sheet.144Sheet.145Bi-directional.181Bi-directional.182Bi-directional.185Bi-directional.187Bi-directional.191Bi-directional.193Bi-directional.196Bi-directional.197Bi-directional.200Circle.205Line Bi-directional.241Line Bi-directional.243Line Bi-directional.244Line Bi-directional.246Line Bi-directional.247Connector Arrow.249Line Arrow.250Line Arrow.252Circle.253Circle.254Connected signals arrow.255Connected signals arrow.256LED+LED+LED+LED-LED-LED-Connector Arrow.259 5V5V5V 12V12V12VLine Bi-directional.263Line Bi-directional.264Line Bi-directional.265Connected signals arrow.266HMI ExtensionHMI ExtensionHMI ExtensionCN405-2CN405-2CN405-2Line Arrow.272Connector Arrow.273Connected signals arrow.2745V5V5V12V12V12VLine Arrow.278Line Bi-directional.279 3.3V3.3V3.3VLine Arrow.281 1.8V1.8V1.8VLine Arrow.283 5V5V5VLine Bi-directional.287Connector 1.160Connector Arrow.289Line Arrow.306Buck RegulatorBuck RegulatorBuck RegulatorAudio CodecAudio CodecAudio CodecAudio AmplifierAudio AmplifierAudio AmplifierClockClockClock UARTUARTUART ADCADCADCMIPIMIPIMIPILED DriverLED DriverLED DriverBarrel Jack 12VBarrel Jack 12VBarrel Jack12VCAN T/RCAN T/RCAN T/R CAN FDCAN FDCAN FDPHYPHYPHY I3CI3CI3CConnectorC o n n e c t o rCONNECTORSheet.308PMICPMICPMICLDO1LDO1LDO1LDO2LDO2LDO2LDO3LDO3LDO3LDO4LDO4LDO4Sheet.309PMICPMICPMICBuck1Buck1Buck1Buck2Buck2Buck2LDO1LDO1LDO1Buck3Buck3Buck3Buck4Buck4Buck4LDO2LDO2LDO2eMMCeMMCeMMCConnected signals arrow.313Bi-directional.314EEPROMEEPROMEEPROMBi-directional.3233.3V3.3V3.3VConnected signals arrow.325Input arrowBuck RegulatorBuck RegulatorBuck RegulatorSheet.327MPUMPUMPUVDD SDxVDD SDxVDD SDxVDD SPIVDD SPIVDD SPIVDD I3CVDD I3CVDD I3CVDD ETHVDD ETHVDD ETHVDDVDDVDDVDD DDRVDD DDRVDD DDRVDD ADCVDD ADCVDD ADCVDD33 USBVDD33 USBVDD33 USBVDD18 USBVDD18 USBVDD18 USBADCADCADCEthernetEthernetEthernetSD/MMCSD/MMCSD/MMCCANCANCANDisplay (MIPI DSI, LVDS, RGB)Display (MIPI DSI, LVDS, RGB)Display (MIPI DSI, LVDS, RGB)UARTUARTUARTAudio (I2S, SSI)Audio (I2S, SSI)Audio(I2S, SSI)SPISPISPII3CI3CI3CUSBUSBUSB I2CI2CI2CCamera (MIPI CSI-2)Camera (MIPI CSI-2)Camera (MIPI CSI-2)QSPIQSPIQSPISDRAMSDRAMSDRAMeMMCeMMCeMMC IICIICIIC
Exiting Interactive Block Diagram

WXGA 单屏显示 HMI 平台(基于 MCU)

4:3 ratioSheet.1Sheet.2Sheet.3Sheet.4CN405-1CN405-1CN405-1Sheet.46Sheet.47Sheet.48Sheet.49Sheet.50Sheet.51Sheet.52Sheet.53Sheet.54Sheet.57Sheet.60Sheet.61Sheet.62Sheet.63Sheet.64Sheet.65Sheet.66Sheet.67Sheet.68Sheet.69Sheet.70Sheet.71Sheet.72Sheet.74Sheet.75Sheet.76Sheet.77Sheet.78Sheet.79Sheet.80Sheet.81Sheet.82Sheet.83Sheet.84Sheet.85Sheet.86Sheet.87Sheet.88Sheet.89Sheet.90Sheet.91Sheet.92Sheet.93Sheet.94Sheet.95Sheet.96Sheet.97Sheet.98Sheet.99Sheet.100Sheet.101Sheet.102Sheet.103MCU BoardMCU BoardMCU BoardCarrier BoardCarrier BoardCarrier BoardNon-Renesas Component.106Non-Renesas Component.107Sheet.110Sheet.111Sheet.1123.3V/200mAmax3.3V/200mAmax3.3V/200mAmaxConnector 1.1561.8V/100mAmax1.8V/100mAmax1.8V/100mAmaxSheet.118Sheet.119Sheet.120Sheet.1215V/300mAtyp5V/300mAtyp5V/300mAtypConnector 1.156.127Connector 1.156.128Connector 1.156.129Connector 1.156.130VCOMVCOMVCOM16V16V16V10.4V10.4V10.4V-7V-7V-7VLED-LED-LED-LED+LED+LED+ DC/DCDC/DCDC/DCLED DriverLED DriverLED DriverBuck 1BuckBuckBuck 2BuckBuckSDRAMSDRAMSDRAMSPI NOR FlashSPI NOR FlashSPI NOR FlashBus DriverBus DriverBus Driver Bus DriverBus DriverBus Driver USBUSBUSB PHYPHYPHY CAN T/RCAN T/RCAN T/RAudio AmplifierAudio AmplifierAudio Amplifier Audio CodecAudio CodecAudio Codec CANFDCAN FDCAN FD SpeakSpeakSpeak MICMICMIC UARTUARTUART ADCADCADC I3CI3CI3C SD CardSD CardSD Card RJ45RJ45RJ45CameraCameraCamera MIPIMIPIMIPIRGBRGBRGBMCUMCUMCUMCUSDRAMSDRAMSDRAM ADCADCADC QSPIQSPIQSPIEthernetEthernetEthernet SPISPISPISDSDSD USBUSBUSB CANCANCANSSI/I2CSSI/I2CSSI/I2C LCDCLCDCLCDC CameraCameraCamera MIPIMIPIMIPI I3CI3CI3C UARTUARTUART
Exiting Interactive Block Diagram

合作伙伴解决方案

SoM/SBC

RZ/G3L System on Module (SoM)

RZ/G3L system on module (SoM) provides efficient processing via the RZ/G3L application processor with four Cortex®-A55 cores at 1.2 Hz and one Cortex-M33 core. Integrates Mali-G31 graphics, H.264 encode and decode at 1080p30, plus flexible display outputs through MIPI display serial interface, LVDS, or parallel RGB. Supports dual Gigabit Ethernet, PCIe Generation 2, dual USB 2.0, and MIPI camera input. Enables industrial human-machine interfaces, edge computing and multimedia workloads in a compact 82x30mm form factor.
RZ/G3L, RAA215300
Virtium
SoM/SBC

Adsmc7101: RZ/G3L SMARC Module

Provides a compact and cost-effective 82mm × 50mm SMARC SoM powered by the RZ/G3L MPU. With core functions validated at the module level, it enables faster integration into industrial systems while reducing development time and risk. Equipped with up to four Arm® Cortex®-A55 and an Arm Cortex-M33, it supports advanced image processing and real-time control. CIP (Civil Infrastructure Platform) Linux support enhances long-term security and product longevity. A development kit with an evaluation carrier board accelerates evaluation and prototyping.
RZ/G3L
Advanet Inc.
SoM/SBC

OSM Size M System-on-Module (SoM) for Industrial Applications

An open standard module compliant system-in-package based on the Renesas RZ/G3E MPU family architecture, the MSRZG3E offers high-performance dual/quad Arm® Cortex®-A55 cores combined with a Cortex-M33 core. Featuring a compact design and a wide range of functions, it delivers low-power consumption, thermal efficiency, and low cost for embedded systems. Built around two or four Cortex-A55 CPU cores with a Cortex-M33 CPU core and optional Ethos-U55 NPU.
RA8D1 OSM System on Module (SoM)
SoM/SBC

RA8D1 OSM System on Module (SoM)

The MXT OSM module for RA8D1 is a compact, high-performance platform for consumer, industrial, and vision-enabled applications. Based on the Renesas RA8D1 MCU, it delivers up to 480MHz Arm® Cortex®-M85 processing, integrated graphics, advanced connectivity, and built-in security features. Ideal for HMI, edge vision, and industrial control systems, the module is supported by MXT’s design-in expertise, customization services, and long-term availability, enabling faster development and seamless integration into next-generation embedded products.
RA8D1
MXT
RA8D2 OSM System on Module (SoM)
SoM/SBC

RA8D2 OSM System on Module (SoM)

The MXT OSM Module for RA8D2 is a compact, high-performance platform for industrial, consumer, HMI, and edge vision applications. Based on the Renesas RA8D2 MCU, it combines a 1 GHz Arm® Cortex®-M85 core with Helium technology and a 250 MHz Cortex-M33 core for advanced processing and control. The module provides integrated graphics, extensive memory support, secure connectivity, and a robust security architecture. Backed by MXT’s design-in expertise, customization services, and long-term availability, it enables fast and reliable product development.
RA8D2
MXT
SoM/SBC

RZ/G3E DX-M1 System on Module (SoM)

RZ/G3E DX-M1 system on module (SoM) combines a powerful Renesas RZ/G3E application processor with the DEEPX DX-M1 AI Booster to deliver high-performance edge and AI computing in a compact SOM form factor. Featuring quad Cortex®-A55 cores, advanced multimedia support, dual display graphics, and 25 TOPS AI acceleration, it’s ideal for industrial, vision and HMI applications requiring efficient local inference and rich connectivity like PCIe, USB3, Ethernet and high-speed camera interfaces.
Virtium
SoM/SBC

RZ/G3E OSM-L

RZ/G3E OSM‑L system on module (SoM) packs the Renesas RZ/G3E application processor into a compact OSM‑L form factor, combining quad Cortex®‑A55 and Cortex‑M33 cores with a Mali‑G52 GPU and on‑chip Ethos‑U55 NPU for efficient edge and HMI computing. It supports dual‑display graphics, 4K video encode/decode, MIPI/parallel interfaces, Gigabit Ethernet, PCIe Gen3, and USB3.2 connectivity. Designed for industrial and multimedia applications, it delivers responsive performance with rich I/O and industrial temperature options.
Virtium
RZ/G3E OSM-L System on Module (SoM)
SoM/SBC

RZ/G3E OSM-L System on Module (SoM)

The MXT OSM Module for RZ/G3E is a compact, high-performance platform for industrial IoT, edge computing, and HMI applications. Powered by the Renesas RZ/G3E MPU, it combines multi-core processing, advanced connectivity, and industrial-grade reliability in an easy-to-integrate System-on-Module format. Supported by MXT’s engineering expertise, customization services, and long-term availability, it helps accelerate product development while enabling scalable and future-ready solutions for automation, smart gateways, and connected infrastructure.
RZ/G3E
MXT
SoM/SBC

RZ/G3E System on Module (SoM)

RZ/G3E system on module (SoM) delivers robust edge computing and rich human-machine interface (HMI) capabilities in a compact SOM form factor. Powered by the Renesas RZ/G3E application processor with four Cortex®-A55 cores, Mali-G52 graphics, and an on-chip Ethos-U55 NPU, it supports dual displays, high-speed video codecs, and versatile I/O including PCIe Gen3, USB3.2, and dual Gigabit Ethernet. Ideal for industrial, multimedia and edge AI applications, it accelerates development with integrated memory, storage, and broad connectivity.
Virtium
VK-CM-RZ/G3E
SoM/SBC

VK-CM-RZ/G3E

The VK-CM-RZ/G3E system on module (SoM) leverages the RZ/G3E processor to deliver a next-generation high-performance platform for embedded and industrial applications, combining quad-core 1.8GHz Arm® Cortex®-A55 processing with scalable high-speed memory, advanced connectivity including Gigabit Ethernet and dual-band Wi-Fi® with Bluetooth® Low Energy (LE), and a design focused on enabling complex and compute-intensive system solutions.
RZ/G3E
VEKATECH

支持

支持社区

支持社区

在线询问瑞萨电子工程社群的技术人员,快速获得技术支持。
浏览文章

知识库

浏览我们的知识库,获取文章、常见问题解答及其他实用资源。
提交工单

提交工单

需要咨询技术性问题或提供非公开信息吗?