概览
描述
RZ 多操作系统软件包是一款用于开发多操作系统解决方案的软件包，由灵活软件包 (FSP) 和 OpenAMP 组成，前者是用于带有 Arm® Cortex®-M 或 Cortex-R 内核的瑞萨电子 MPU 的软件包，后者是用于处理器间通信框架的标准化 API。
特性
- 通过 OpenAMP 在基于 RTOS 的内核和基于 Linux 的内核之间实现内核间通信。
发布信息
- 2026 年 3 月 31 日: RZ 多操作系统软件包 v4.0.0
- RZ/G 系列
- 2026 年 2 月 6 日：多操作系统软件包 v3.2.0
- RZ/V 系列
- 2026 年 1 月 13 日：多操作系统软件包 v3.30
- RZ/T 系列
- 2025 年 12 月 26 日：多操作系统软件包 V3.0.0
- RZ/N 系列
- 2026 年 1 月 30 日：多操作系统软件包 V3.0.0
目标设备
下载
精选
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| 类型 | 文档标题 | 日期 |
| 软件和工具 - 软件 | RZ Multi-OS Package v4.0.0
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| 软件和工具 - 软件 | ZIP 40.93 MB | |
| 软件和工具 - 评估软件 | RZ/N Multi-OS Package v3.0.0
The Multi-OS package provides sample programs for operation across multiple OS environments. It supports various combinations of Linux, bare metal, and FreeRTOS, enabling developers to evaluate and develop with different core configurations. The package includes sample code for each combination, project files for each core setup, related libraries and configuration files, example folder structures, and documentation or guides for development and debugging.
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| 软件和工具 - 软件 | ZIP 17.39 MB Compiler: GNU ARM Embedded Function: Communication Interface IDE: e2 studio | |
| 软件和工具 - 评估软件 | RZ/T Multi-OS Package v3.0.0
[Software=RZ/T2 FSP|v3.0.0],[Toolchains=GNU ARM Embedded Toolchain|13.3.1.arm-13-24;IAR Embedded Workbench for ARM v9.60.3]
ZIP
273.60 MB
Compiler:
GNU ARM Embedded, ICCARM
IDE:
e2 studio, IAR EWARM
The Multi-OS package provides sample programs for operation across multiple OS environments. It supports various combinations of Linux, bare metal, and FreeRTOS, enabling developers to evaluate and develop with different core configurations. The package includes sample code for each combination, project files for each core setup, related libraries and configuration files, example folder structures, and documentation or guides for development and debugging.
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5 项目
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文档
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| 类型 | 文档标题 | 日期 |
| 应用说明 |
PDF
10.34 MB
Learn how to use the Renesas RZ Flexible Software Package (FSP) for developing applications for the RZ microprocessor series. This document explains the usage of the RZ FSP running on the Cortex-A55 (CA55) core incorporated in the RZ/A3UL and RZ/A3M devices, including the development environment, software configuration, and application development workflow.
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| 应用说明 |
PDF
9.95 MB
Learn how to develop applications for the RZ microprocessor series using the Renesas Flexible Software Package (FSP). This application note explains how to use the FSP on the Cortex®-M33 (CM33) core integrated into RZ/G2L, RZ/G2LC, RZ/G2UL, RZ/G3S, and RZ/G3E devices, providing guidance for software development and application implementation on supported RZ MPUs.
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| 应用说明 |
PDF
17.85 MB
Learn how to develop applications on the Renesas RZ MPU series using the Flexible Software Package (FSP). This application note covers FSP usage on Arm Cortex‑R52 and Arm Cortex‑A55 cores in RZ/T2 and RZ/N2 MPUs, outlining software architecture, development flow, and application implementation considerations.
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| 应用说明 |
PDF
9.54 MB
Learn how to use the Renesas Flexible Software Package (FSP) running on the Cortex-M33 (CM33) and Cortex-R8 (CR8) cores integrated in the RZ/V2L, RZ/V2H, and RZ/V2N devices. This document explains the development environment, software configuration, and usage of the FSP for these RZ/V series devices. Support for the CR8 core is available on the RZ/V2H only.
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| 应用说明 |
PDF
356 KB
Introduces practical example projects for the RZG2L-EVK kit. The example projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the RZG2L-EVK kit.
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| 应用说明 |
PDF
356 KB
Introduces practical example projects for the RZV2H-EVK kit. The example projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the RZV2H-EVK kit.
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| 应用说明 |
PDF
356 KB
Introduces practical example projects for the RZV2N-EVK kit. The example projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the RZV2N-EVK kit.
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| 应用说明 |
PDF
356 KB
Introduces practical example projects for the RZG2LC-EVK kit. The example projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the RZG2LC-EVK kit.
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| 应用说明 |
PDF
356 KB
Introduces practical example projects for the RZG2UL-EVK kit. The example projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the RZG2UL-EVK kit.
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| 应用说明 |
PDF
359 KB
Introduces practical example projects for the RZG3E-EVK kit. The example projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the RZG3E-EVK kit.
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| 应用说明 |
PDF
356 KB
Introduces practical example projects for the RZG3S-EVK kit. The example projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the RZG3S-EVK kit.
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| 应用说明 |
PDF
453 KB
Introduces practical example projects for the RZN2H-EVK kit. The example projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the RZN2H-EVK kit.
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| 应用说明 |
PDF
453 KB
Introduces practical example projects for the RZT2H-EVK kit. The example projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the RZT2H-EVK kit.
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| 应用说明 |
PDF
356 KB
Introduces practical example projects for the RZV2L-EVK kit. The example projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the RZV2L-EVK kit.
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| 应用说明 |
PDF
1.07 MB
The AWO example project that is included in the RZ/G Multi-OS package demonstrates the behavior of waiting in low-power mode with only Cortex-M33 running after a Linux shutdown and restarting Linux from Cortex-M33.
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| 应用说明 |
PDF
1.17 MB
The AWO example project that is included in the RZ/G Multi-OS package demonstrates the behavior of waiting in low-power mode with only Cortex-M33 running after a Linux shutdown and restarting Linux from Cortex-M33.
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PDF
1.05 MB
The Always On (AWO) example project that is included in the RZ/V Multi-OS Package demonstrates the behavior of waiting in low-power mode with only Cortex-M33 running after a Linux shutdown and restarting Linux from Cortex-M33.
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| 快速入门指南 |
PDF
1.03 MB
Learn the procedure for integrating the RZ/G Multi-OS Package into the RZ/G Verified Linux Package (referred to as VLP) for the RZ/G2L, G2LC, G2UL. By integrating the Multi-OS Package, users can efficiently establish a multi-OS environment wherein Linux operates on the Cortex-A55 and FreeRTOS/bare metal runs on the Cortex-M33, with support for inter-processor communication between these CPU cores.
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| 快速入门指南 |
PDF
1.97 MB
Learn the procedure for integrating the RZ/G Multi-OS Package into the RZ/G Verified Linux Package (referred to as VLP) for the G3E. By integrating the Multi-OS Package, users can efficiently establish a multi-OS environment wherein Linux operates on the Cortex-A55 and FreeRTOS/bare metal runs on the Cortex-M33, with support for inter-processor communication between these CPU cores.
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| 快速入门指南 |
PDF
1.97 MB
Learn the procedure for integrating the RZ/G Multi-OS Package into the RZ/G Verified Linux Package (referred to as VLP) for the RZ/G3S. By integrating the Multi-OS Package, users can efficiently establish a multi-OS environment wherein Linux operates on the Cortex-A55 and FreeRTOS/bare metal runs on the Cortex-M33, with support for inter-processor communication between these CPU cores.
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| 快速入门指南 |
PDF
3.39 MB
Learn sample program setup procedures for multiple-core (bare-metal/FreeRTOS/Linux running on Cortex-A55 and bare-metal/FreeRTOS running on Cortex-R52) environments and sample programs. This package consists of the RZ/N2H Cortex-R52 Flexible Software Package (RZ/N2H CR52/CA55 FSP), the inter-processor communication feature via OpenAMP for the RZ/N2H Board Support Package (RZ/N2H BSP), and the Linux BSP software package.
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| 快速入门指南 |
PDF
3.64 MB
Learn sample program setup procedures for multiple-core (bare-metal/FreeRTOS/Linux running on Cortex-A55 and bare-metal/FreeRTOS running on Cortex-R52) environments and sample programs. This package consists of the RZ/T2H Cortex-R52 Flexible Software Package (RZ/T2H CR52/CA55 FSP), the inter-processor communication feature via OpenAMP for the RZ/T2H Board Support Package (RZ/T2H BSP), and the Linux BSP software package.
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| 快速入门指南 |
PDF
2.15 MB
Learn the procedure for integrating the RZ/V Multi-OS Package into the RZ/V2H AI SDK. By integrating the Multi-OS Package, users can efficiently establish a multi-OS environment wherein Linux operates on the Cortex-A55 and FreeRTOS/bare metal runs on the Cortex-M33 and/or Cortex-R8 with support for inter-processor communication between these CPU cores.
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| 快速入门指南 |
PDF
1.27 MB
Learn the procedure for integrating the RZ/V Multi-OS Package into the RZ/V Verified Linux Package (referred to as VLP) for the RZ/V2L. By integrating the Multi-OS Package, users can efficiently establish a multi-OS environment wherein Linux operates on the Cortex-A55 and FreeRTOS/bare metal runs on the Cortex-M33, with support for inter-processor communication between these CPU cores.
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| 快速入门指南 |
PDF
2.14 MB
Learn the procedure for integrating the RZ/V Multi-OS Package into the RZ/V2N AI SDK. By integrating the Multi-OS Package, users can efficiently establish a multi-OS environment wherein Linux operates on the Cortex-A55 and FreeRTOS/bare metal runs on the Cortex-M33 with support for inter-processor communication between these CPU cores.
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| 发行说明 |
PDF
207 KB
See what’s additionally supported, improvements, and bug fixes for the RZ Multi-OS Package V4.0.0.
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| 发行说明 | PDF 236 KB | |
| 应用说明 |
PDF
2.55 MB
Learn the easy way to establish a multi-OS (i.e. CIP Linux running on Cortex-A55 and bare-metal/FreeRTOS running on Cortex-R52/A55) environment and sample program showing how to implement inter-processor communication between those CPU cores. This package consists of the RZ/N2H Cortex-R52/A55 Flexible Software Package (RZ/N2H FSP) and the inter-processor communication feature package for the RZ/N2H Board Support Package (RZ/N2H BSP).
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| 发行说明 |
PDF
240 KB
The Multi-OS package provides sample programs for operation across multiple OS environments. It supports various combinations of Linux, bare metal, and FreeRTOS, enabling developers to evaluate and develop with different core configurations. This is the release note for the multi-OS package running on the RZ/N2H.
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| 发行说明 |
PDF
151 KB
See what’s additionally supported, improvements, and bug fixes for the RZ/V Multi-OS Package.
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| 发行说明 |
PDF
241 KB
The Multi-OS package provides sample programs for operation across multiple OS environments. It supports various combinations of Linux, bare metal, and FreeRTOS, enabling developers to evaluate and develop with different core configurations. This is the release note for the multi-OS package running on the RZ/T2H.
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| 应用说明 |
PDF
3.14 MB
Learn the easy way to establish a multi-OS (i.e. CIP Linux running on Cortex-A55 and bare-metal/FreeRTOS running on Cortex-R52/A55) environment and sample program showing how to implement inter-processor communication between those CPU cores. This package consists of the RZ/T2H Cortex-R52/A55 Flexible Software Package (RZ/T2H FSP) and the inter-processor communication feature package for the RZ/T2H Board Support Package (RZ/T2H BSP).
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| 应用说明 |
PDF
259 KB
AI 生成的摘要:
The RZ/G FSP Example Project Bundle provides sample code demonstrating how to use various Renesas Flexible Software Package (FSP) modules for embedded system design. It supports multiple RZ/G evaluation boards and FSP version 3.1.0, offering lightweight, efficient drivers with uniform APIs and detailed documentation. The bundle includes examples for peripherals like ADC, CANFD, SPI, UART, FreeRTOS, and watchdog timers, with recent updates adding support for the RZ/G3E board and new examples. The license is BSD-3-Clause, enabling flexible use in open-source projects. Users should refer to the Example Project Usage Guide and Getting Started documents for setup and debugging.
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| 应用说明 |
PDF
9.69 MB
AI 生成的摘要:
The guide explains how to operate example projects using the RZ/G Flexible Software Package (FSP) on supported RZ/G series devices and evaluation kits. It details prerequisites such as tool experience and embedded system knowledge. It lists hardware and software requirements, including Windows 10, RZ/G FSP v3.1.0, e2 studio 2025-07, and SEGGER J-Link RTT Viewer v7.96j. Installation instructions for FSP and J-Link RTT Viewer are provided. The document outlines project import, running procedures, and numerous example projects covering various peripherals like CANFD, RIIC, RSPI, SCIF, GPT, FreeRTOS, and others, including hardware settings and operation steps.
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| 应用说明 |
PDF
242 KB
AI 生成的摘要:
The RZ/V FSP Example Project Bundle offers practical example projects demonstrating how to use various Renesas Flexible Software Package (FSP) modules for embedded system design. It supports RZ/V2L and RZ/V2H evaluation boards and FSP version 2.0.1, providing lightweight, efficient drivers with uniform APIs and detailed documentation. The bundle includes examples for ADC, CANFD, RIIC, SPI, UART, FreeRTOS, and more, with recent additions supporting RZ/V2H kits and enhanced DMAC transfer. The package ensures high-quality code through peer reviews and automated testing. Users can access related resources and support via Renesas websites.
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| 应用说明 | PDF 7.09 MB | |
36 项目
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设计和开发
样例程序
样例程序
筛选
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| 类型 | 文档标题 | 日期 日期 |
| 示例代码 | RZ/V2H-EVK Example Project Bundle
Demonstrates how to write code using various unified Renesas RZ Flexible Software Package (FSP) v4.x.x modules supported by the RZV2H-EVK. The unified RZ FSP consolidates all previous family‑specific FSPs into a single package and provides an optimized, easy‑to‑use, scalable, high‑quality software solution for embedded system design.
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| 示例代码 | RZ/V2N-EVK Example Project Bundle
Demonstrates how to write code using various unified Renesas RZ Flexible Software Package (FSP) v4.x.x modules supported by the RZV2N-EVK. The unified RZ FSP consolidates all previous family‑specific FSPs into a single package and provides an optimized, easy‑to‑use, scalable, high‑quality software solution for embedded system design.
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| 示例代码 | RZG2LC-EVK Example Project Bundle
Demonstrates how to write code using various unified Renesas RZ Flexible Software Package (FSP) v4.x.x modules supported by the RZG2LC-EVK. The unified RZ FSP consolidates all previous family‑specific FSPs into a single package and provides an optimized, easy‑to‑use, scalable, high‑quality software solution for embedded system design.
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| 示例代码 | RZG2UL-EVK Example Project Bundle
Demonstrates how to write code using various unified Renesas RZ Flexible Software Package (FSP) v4.x.x modules supported by the RZG2UL-EVK. The unified RZ FSP consolidates all previous family‑specific FSPs into a single package and provides an optimized, easy‑to‑use, scalable, high‑quality software solution for embedded system design.
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| 示例代码 | RZG3E-EVK Example Project Bundle
Demonstrates how to write code using various unified Renesas RZ Flexible Software Package (FSP) v4.x.x modules supported by the RZG3E-EVK. The unified RZ FSP consolidates all previous family‑specific FSPs into a single package and provides an optimized, easy‑to‑use, scalable, high‑quality software solution for embedded system design.
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| 示例代码 | RZG3S-EVK Example Project Bundle
Demonstrates how to write code using various unified Renesas RZ Flexible Software Package (FSP) v4.x.x modules supported by the RZG3S-EVK. The unified RZ FSP consolidates all previous family‑specific FSPs into a single package and provides an optimized, easy‑to‑use, scalable, high‑quality software solution for embedded system design.
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| 示例代码 | RZN2H-EVK Example Project Bundle
Demonstrates how to write code using various unified Renesas RZ Flexible Software Package (FSP) v4.x.x modules supported by the RZN2H-EVK. The unified RZ FSP consolidates all previous family‑specific FSPs into a single package and provides an optimized, easy‑to‑use, scalable, high‑quality software solution for embedded system design.
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| 示例代码 | RZT2H-EVK Example Project Bundle
Demonstrates how to write code using various unified Renesas RZ Flexible Software Package (FSP) v4.x.x modules supported by the RZT2H-EVK. The unified RZ FSP consolidates all previous family‑specific FSPs into a single package and provides an optimized, easy‑to‑use, scalable, high‑quality software solution for embedded system design.
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| 示例代码 | RZV2L-EVK Example Project Bundle
Demonstrates how to write code using various unified Renesas RZ Flexible Software Package (FSP) v4.x.x modules supported by the RZV2L-EVK. The unified RZ FSP consolidates all previous family‑specific FSPs into a single package and provides an optimized, easy‑to‑use, scalable, high‑quality software solution for embedded system design.
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| 示例代码 | ZIP 3.62 MB Function: Application Example | |
| 示例代码 | RZ/V FSP Example Project V2.00 (Deprecated)
[Software=RZ Flexible Software Package|v2.0.1],[Toolchains=GNU Arm Embedded|???]
ZIP
4.33 MB
Compiler:
GNU ARM Embedded
Function:
Driver or Library
IDE:
e2 studio
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11 项目
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相关评估板和套件
评估
RZ/G2L-EVKIT
有效
RZ/G2L MPU 评估板套件
该评估板套件适用于评估 RZ/G2L。 RZ/G2L 评估板套件由模块板（SOM）和扩展板组成。 模块板符合 SMARC v2.1 标准。
- 目录
- RZ/G2L 模块板（SMARC2.1）
- 公共载板（用于 RZ/G2L、RZ/G2LC、RZ/G2UL 和 RZ/V2L）
- USB 电缆（USB Type-A- Micro USB Type-B）
*请自行准备以下设备：
- 65W USB Type-C 充电器
- USB PD 接口
- 输出：5V3A、9V3A、15V3A、20V3.25A
- USB Type-C 转 Type-C 电缆
- 支持 USB-C 和 USB-C 3.1 Gen2 USB-PD 100W
- 微型标清... 阅读详情
远程测试该板卡
该板卡已上线云上实验室（Lab on the Cloud)，使用我们的 PC 图形界面，无需实体板卡，便可在虚拟实验室中立即开始配置和测试设计。
评估
RZ/G2LC 评估板套件
该评估板套件适用于评估 RZ/G2LC。 RZ/G2LC 评估板套件由模块板 (SOM) 和扩展板组成。 SOM 符合 SMARC v2.1 标准。
- Contents
- RZ/G2LC Module Board (SMARC2.1)
- Common Carrier Board (For RZ/G2L, RZ/G2LC, RZ/G2UL and RZ/V2L)
- USB Cable (USB Type-A- Micro USB Type-B)
*Please prepare the following by yourself:
- 65W USB Type-C Charger
- USB PD
- Output:...
评估
RZ/G3S-EVKIT
有效
RZ/G3S 评估板套件
该评估板套件适用于评估 RZ/G3S。 RZ/G3S 评估板套件由模块板 (SOM) 和扩展板组成。 模块板符合 SMARC v2.1 标准。
- 目录
- RZ/G3S SMARC 模块板 (SMARC2.1)
- RZ SMARC 系列扩展板 II
- RZ SMARC 系列 JTAG 适配器电缆
- USB Type-A 转 USB Micro B 电缆，用于串行调试
- 配件：螺丝和垫片
*请自行准备以下内容：
- 65W USB Type-C 充电器
- USB PD 支持
- 输出：5V3A，9V3A，15V3A，20V3.25A
- USB Type-C 转 Type-C 电缆
- USB-C&USB-C 3.1 Gen2 USB-PD...
评估
RZ/G3E-EVKIT
有效
RZ/G3E MPU 评测板套件
RZ/G3E 评测板套件由模块板 (SOM) 和扩展板组成，是评测 RZ/G3E MPU 功能的理想之选。 模块板符合 SMARC v2.1 标准，是基于模块板进行产品开发的良好参考。
主要配件：
- RZ/G3E SMARC 模块板 (SMARC2.1)
- RZ SMARC 系列扩展板 II（与 RZ/G3S-EVKIT 通用）
- 各种适配器板、电缆、螺钉等
*请自行准备以下设备：
- 65W USB Type-C 充电器和 USB Type-C 至 Type-C 连接线
- USB PD 支持
- 输出：5V3A、9V3A、15V3A、20V3.25A
- 微型标清 UHI 级 10 8GB 或以上
*有关更多信息，请参阅... 阅读详情
评估
RZ/V2L-EVKIT
有效
RZ/V2L 评估板套件
该评估板套件适用于评估 RZ/V2L。 RZ/V2L 评估板套件由模块板 (SOM) 和扩展板组成。 此外，产品附带 MIPI 摄像头模块 (MIPI CSI)。 扩展板通常适用于按照 SMARC v2.1 标准制备的 RZ/G2L，RZ/G2LC，RZ/G2UL，RZ/V2L模块 (SOM)。 基于这种适用性，在使用这些设备时，您可以体验到无缝且灵活的评估。
远程测试该板卡
该板卡已上线云上实验室（Lab on the Cloud)，使用我们的 PC 图形界面，无需实体板卡，便可在虚拟实验室中立即开始配置和测试设计。
评估
RZ/V2H-EVK
有效
RZ/V2H 四核视觉 AI MPU 评测套件
RZ/V2H AI MPU 评测套件 (RTK0EF0168C04000BJ) 用于评测瑞萨电子 RZ/V2H 四核视觉 AI MPU。 该套件包括 CPU 板和扩展 (EXP) 板。 支持 RZ/V2H 标准软件包，能轻松实现低功耗 AI 推理和视频流等软件开发任务。 此外，这款评测套件还支持图像信号处理器 (ISP)、3D 图形引擎 (GE3D) 和可信安全 IP 等可选功能。
远程测试该板卡
该板卡已上线云上实验室（Lab on the Cloud)，使用我们的 PC 图形界面，无需实体板卡，便可在虚拟实验室中立即开始配置和测试设计。
评估
RZ/V2N-EVK
有效
RZ/V2N 四核视觉 AI MPU 评测套件
RZ/V2N AI MPU 评测套件 (RTK0EF0186C03000BJ) 用于评测我们的 RZ/V2N 四核 视觉 AI MPU。 该套件包括一块 CPU 评测板、扩展 (EXP) 板和两块子板。 我们提供了 AI 软件开发包 (AI SDK) 作为该评测套件的软件开发环境。 它支持对低功耗 AI 推理、视频流和其他内置功能进行评测。 该套件还支持图像信号处理器 (ISP)、3D 图形引擎 (GE3D) 和可信安全 IP 等可选功能。
评估
RZ/T2H-EVKIT
有效
RZ/T2H 评估板套件
RZ/T2H 评估板套件是用于 RZ/T2H MPU 的一款评测和开发套件。 由于它具有板载仿真器，您只需将附带连线接到 PC 即可开始评测。 该评测板包含千兆以太网 PHY、非易失性存储器和 LPDDR4 存储器等功能丰富的元件，无需扩展板即可评估 RZ/T2H 的各种功能。
此外，通过扩展逆变器板，还可以实现多轴电机控制。
评估
RZ/N2H-EVKIT
有效
RZ/N2H 评估板套件
RZ/N2H 评估板套件是用于 RZ/N2H MPU 的一款评测和开发套件。 由于它具有板载仿真器，您只需将附带连线接到 PC 即可开始评测。 该评测板包含千兆以太网 PHY、非易失性存储器和 LPDDR4 存储器等功能丰富的元件，无需扩展板即可评估 RZ/N2H 的各种功能。
此外，通过扩展逆变器板，还可以实现多轴电机控制。
视频和培训
This video explains how to check for pin conflicts between the RZ FSP project and the Linux project.
新闻和博客
博客 2021年11月18日 |
更多详情
请查阅以下资料与文档，了解如何针对不同产品使用多操作系统软件包。
RZ/G 系列
| 内容 | RZ/G3E | RZ/G3S | RZ/G2L、G2LC、G2UL | |
|---|---|---|---|---|
| 多操作系统软件包 V4.0.0 | 处理器间通信（OpenAMP：Linux - FSP） | 快速入门指南 (PDF) | 快速入门指南 (PDF) | 快速入门指南 (PDF) |
| 电源管理 AWO（始终保持供电） | AWO 示例工程启动指南 (PDF) | AWO 示例工程启动指南 (PDF) | - | |
| RZ 灵活配置软件包 (FSP) | V4.0.0 | V4.0.0 | V4.0.0 | |
| Linux 软件包 | RZ/G3E Linux BSP v1.0.0 | VLP V3.0.7 | VLP V3.0.7 VLP V4.0.1 | |
RZ/V 系列
| 内容 | RZ/V2N | RZ/V2H | RZ/V2L | |
|---|---|---|---|---|
| 多操作系统软件包 V4.0.0 | 处理器间通信（OpenAMP：Linux - FSP） | 快速入门指南 (PDF) | 快速入门指南 (PDF) | 快速入门指南 (PDF) |
| 电源管理 AWO（始终保持供电） | AWO 示例工程启动指南 (PDF) | AWO 示例工程启动指南 (PDF) | - | |
| RZ 灵活配置软件包 (FSP) | V4.0.0 | V4.0.0 | V4.0.0 | |
| Linux 软件包 | - | - | VLP V3.0.7 | |
| AI 软件开发工具包 (SDK) | RZ/V2N AI-SDK V6.3.0 | RZ/V2H AI-SDK V6.00 | - | |
RZ/N 系列
| 内容 | RZ/N2H | |
|---|---|---|
| 多操作系统软件包 V4.0.0 | 处理器间通信（OpenAMP：Linux - FSP） | 应用说明 (PDF) |
| 处理器间通信（OpenAMP：FSP - FSP） | 快速入门指南 (PDF) | |
| RZ 灵活配置软件包 (FSP) | V4.0.0 | |
| 经验证的 Linux 软件包 | VLP V5.0.0 | |
RZ/T 系列
| 内容 | RZ/T2H | |
|---|---|---|
| 多操作系统软件包 V4.0.0 | 处理器间通信（OpenAMP：Linux - FSP） | 应用说明 (PDF) |
| 处理器间通信（OpenAMP：FSP - FSP） | 快速入门指南 (PDF) | |
| RZ 灵活配置软件包 (FSP) | V4.0.0 | |
| 经验证的 Linux 软件包 | VLP V5.0.0 | |
有关 RZ FSP 的更多信息，请参阅 RZ 灵活软件包 (FSP) 软件产品页面。
运行环境
支持
知识库
- RZ/G3S: OS间通信
我们准备了可使用OpenAMP（用于处理器间通信框架的标准API）的RZ/G3S多操作系统软件包。 通过使用这个软件包，可以在Cortex-M33上 ...
2024年1月16日 - RZ/T2H, RZ/N2H: 关于OS间通信
... 核间通信框架的标准化API）的多操作系统软件包。通过使用该软件包，可以为每个CPU内核创建在不同操作系统（例如Linux、FreeRTOS和 ...
- RL78 MCU: 低电压检测 （LVD）
... 进行设置，并包含一个说明整体操作的 README 文件。 RL78_G1A_LVD_I&R.zip （见本页下方的链接） 使用 LVD0, LVD1的 Reset 模式和 Interrupt 模式： 对 LVD 的多 ...
