特性
- Cortex-A55（四核或双核）
- Cortex-M33
- 3D 图形加速引擎 (Arm Mali-G52)
- 视频编解码器 (H.264/H.265)
- 摄像头接口 (MIPI-CSI)
- 显示接口（MIPI-DSI 或 LVDS Dual 或 Parallel-IF）
- PCIe Gen3 2 通道
- USB 3.2 (Gen2) 主机
- USB2.0 接口 × 2、SD 接口 × 2
- CAN接口（CAN FD)
- 千兆以太网接口 × 2
- 内存错误检测/纠正（ECC）
- LPDDR4 或 LPDDR4X 内存接口
- 安全启动
- 安全更新
- 硬件加密 IP
- 真随机数生成器 (TRNG)
- 安全调试
- Arm TrustZone
- FCBGA 封装（15mm x 15mm，21mm x 21mm）
- 探索瑞萨验证的 DRAM 兼容性列表
RZ/G3E Block Diagram
描述
RZ/G3E 是一款集成了四核 CPU 和 NPU 的微处理器 (MPU)，改善了人机界面 (HMI) 应用的能效、可靠性和安全性。 RZ/G3E 提供丰富的 HMI 功能，包括图形引擎 (GPU)、视频编解码器、多屏幕全高清输出，以及用于边缘计算功能的神经处理单元 (NPU)。 除了主频高达 1.8GHz 的 Cortex-A55 四核可同时运行 HMI 和边缘计算功能外，RZ/G3E 还采用了 Cortex-M33 内核以实现低功耗运行。 两种不同内核的组合让用户能够打造高性能和低功耗的产品。
产品参数
| 属性 | 值 |
|---|---|
| CPU Architecture | Arm |
| Main CPU | Cortex-A55 x 2 + Cortex-M33 x 1, Cortex-A55 x 4 + Cortex-M33 x 1 |
| Program Memory (KB) | 0 |
| RAM (KB) | 512 |
| Carrier Type | Bulk (Tray), Full Carton (Tray) |
| Supply Voltage (V) | 3.14 - 3.46 |
| I/O Ports | 141 |
| NPU | No, Yes |
| DRAM I/F | LPDDR4-3200, LPDDR4X-3200 (32-bit) |
| 3D GPU | Arm Mali-G52 |
| Temp. Range (°C) | Tj = -40 to +125 |
| Operating Freq (Max) (MHz) | 1800 |
| Ethernet speed | 10M/100M/1G |
| Ethernet (ch) | 2 |
| EtherCat (ch) (#) | 0 |
| USB FS (host ch/device ch) | ( 3 / 1 ) |
| USB HS (host ch/device ch) | ( 3 / 1 ) |
| USB SS (host ch/device ch) | ( 1 / 0 ) |
| PCI Express (generation and ch) | PCIe (Gen3.0 2Lane) x 1 ch |
| SCI or UART (ch) | 11 |
| SPI (ch) | 3 |
| I2C (#) | 9 |
| CAN (ch) | 6 |
| CAN-FD (ch) | 6 |
| Wireless | No |
| SDHI (ch) | 3 |
| High Resolution Output Timer | No |
| PWM Output (pin#) | 16 |
| 32-Bit Timer (ch) | 32 |
| 16-Bit Timer (ch) (#) | 0 |
| 8-Bit Timer (ch) | 0 |
| Standby operable timer | No |
| Asynchronous General Purpose Timer / Interval Timer (ch) | 0 |
| 16-Bit A/D Converter (ch) | 0 |
| 14-Bit A/D Converter (ch) | 0 |
| 12-Bit A/D Converter (ch) | 8 |
| 10-Bit A/D Converter (ch) | 0 |
| 24-Bit Sigma-Delta A/D Converter (ch) | 0 |
| 16-Bit D/A Converter (ch) | 0 |
| 12-Bit D/A Converter (ch) | 0 |
| 10-Bit D/A Converter (ch) (#) | 0 |
| 8-Bit D/A Converter (ch) | 0 |
| Capacitive Touch Sensing Unit (ch) | 0 |
| Graphics LCD Controller | No |
| MIPI Interfaces (DSI) (ch) | 1 |
| MIPI Interfaces (CSI) (ch) | 1 |
| Image Codec | H.264/H.265 |
| Segment LCD Controller | No |
| Security & Encryption | AES, RSA, ECC, SHA-1, SHA-224, SHA-256, GHASH, TRNG |
应用方框图
 | 数字耳镜 用于高分辨率内耳成像和诊断的数字耳镜系统。 |
 | 高端功能丰富的 HMI 平台 灵活的 HMI 平台，为显示分辨率、音频、扬声器等提供丰富的功能支持。 |
其他应用
- 工业 HMI
- 工业计算机
- 工业网关
- 办公打印机
- 医疗 HMI
- 智能零售
- 标牌
- 楼宇控制
- 家庭安防中枢
- 智能门铃
- 智能恒温器
- 家用患者监护仪
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Renesas Boards & Kits
RZ/G3E-EVKIT
有效
RZ/G3E MPU 评测板套件
RZ/G3E 评测板套件由模块板 (SOM) 和扩展板组成，是评测 RZ/G3E MPU 功能的理想之选。 模块板符合 SMARC v2.1 标准，是基于模块板进行产品开发的良好参考。
主要配件：
- RZ/G3E SMARC 模块板 (SMARC2.1)
- RZ SMARC 系列扩展板 II（与 RZ/G3S-EVKIT 通用）
- 各种适配器板、电缆、螺钉等
*请自行准备以下设备：
- 65W USB Type-C 充电器和 USB Type-C 至 Type-C 连接线
- USB PD 支持
- 输出：5V3A、9V3A、15V3A、20V3.25A
- 微型标清 UHI 级 10 8GB 或以上
*有关更多信息，请参阅... 阅读详情
Partner Boards & Kits
Other
1.3M Pixels MIPI Output Camera Module KBCR-S08MM
Provides validated driver software support for MIPI camera modules on Renesas RZ/V2 and RZ/G3E, enabling efficient development and seamless integration of system on module (SoM) camera systems. An integrated image signal processor supports up to four camera connections, enabling multi‑camera and advanced vision applications. The combined hardware and software solution accelerates edge artificial intelligence camera development while reducing system integration effort.
Provided By:
Shikino High-Tech Co., Ltd.
Complementary Silicon Devices
DRAM & Flash Memory Solutions
Provides a comprehensive external memory solution for Renesas RZ and R‑Car families, supporting systems that require scalable off‑chip memory. Supported memory types include Serial NAND (Quad/Octal SPI, 512Mb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), ONFI NAND (ONFI 1.0, 1Gb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), DRAM (DDR2/3/4 from 512Mb to 32Gb and LPDDR2/3/4/4x/5/5x from 1Gb to 16Gb), and HyperRAM™ (HyperBus, 64Mb to 512Mb, 1.8V and 1.2V).
Provided By:
Winbond Electronics Corp. Japan
SoM/SBC
OSM Size M System on Module (SoM) for Industrial Applications
An open standard module compliant system-in-package based on Renesas RZ/G3E family architecture, the MSRZG3E offers high-performance dual/quad Arm® Cortex®-A55 cores combined with a Cortex-M33 core. Featuring compact design and a wide range of functions, it delivers low-power consumption, thermal efficiency, and low-cost for embedded systems. Built around two or four Cortex-A55 CPU cores with a Cortex-M33 CPU core and optional Ethos-U55 NPU.
Provided By:
ARIES Embedded GmbH
SoM/SBC
RZ/G3E DX-M1 System on Module (SoM)
The RZ/G3E DX-M1 system on module (SoM) combines a powerful Renesas RZ/G3E application processor with the DEEPX DX-M1 AI Booster to deliver high-performance edge and AI computing in a compact SOM form factor. Featuring quad Cortex-A55 cores, advanced multimedia support, dual display graphics, and 25 TOPS AI acceleration, it’s ideal for industrial, vision and HMI applications requiring efficient local inference and rich connectivity like PCIe, USB3, Ethernet and high-speed camera interfaces.
Provided By:
Virtium
SoM/SBC
RZ/G3E OSM-L
The RZ/G3E OSM‑L System‑on‑Module packs the Renesas RZ/G3E application processor into a compact OSM‑L form factor, combining quad Cortex‑A55 and Cortex‑M33 cores with a Mali‑G52 GPU and on‑chip Ethos‑U55 NPU for efficient edge and HMI computing. It supports dual‑display graphics, 4K video encode/decode, MIPI/parallel interfaces, Gigabit Ethernet, PCIe Gen3 and USB3.2 connectivity. Designed for industrial and multimedia applications, it delivers responsive performance with rich I/O and industrial temperature options.
Provided By:
Virtium
SoM/SBC
RZ/G3E System on Module (SoM)
The RZ/G3E system on module (SoM) delivers robust edge computing and rich human-machine interface (HMI) capabilities in a compact SOM form factor. Powered by the Renesas RZ/G3E application processor with four Cortex-A55 cores, Mali-G52 graphics and an on-chip Ethos-U55 NPU, it supports dual displays, high-speed video codecs, and versatile I/O including PCIe Gen3, USB3.2 and dual Gigabit Ethernet. Ideal for industrial, multimedia and edge AI applications, it accelerates development with integrated memory, storage and broad connectivity.
Provided By:
Virtium
SoM/SBC
TRIA SM2S-G3E
TRIA SM2S-G3E is computer module, compliant with SMARC 2.2. Equipped with Renesas RZ/G3E processor, with up to four cores Arm® Cortex®-A55 processor, dedicated Arm® Cortex®-M33 Real-Time core, Arm Mali™ GPU and a 4K capable VPU, integrated Arm Ethos™-U55 NPU making powerful, cost-effective and energy-efficient machine learning (ML). This is built with LPDDR4 memory technology with inline ECC support, up to 256GB eMMC Flash memory and supports interfaces, Dual Gigabit Ethernet, USB 3.2 Gen 2 and PCI Express Gen 3, dual CAN-FD, dual-channel LVDS or MIPI DSI, HDMI and MIPI CSI.
Provided By:
Tria Technologies
SoM/SBC
VK-CM-RZ/G3E
This system on module leverages the Renesas RZ/G3E processor to deliver a next-generation high-performance platform for embedded and industrial applications, combining quad-core 1.8GHz Arm® Cortex®-A55 processing with scalable high-speed memory, advanced connectivity including Gigabit Ethernet and dual-band Wi-Fi® with Bluetooth® Low Energy (LE), and a design focused on enabling complex and compute-intensive system solutions.
Supported Products:
RZ/G3EProvided By:
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Partner Solutions
- 软件包中文RZ FSP 是一款增强型软件包，旨在为基于瑞萨电子 RZ 系列 Arm 微处理器的嵌入式系统设计提供用户友好、可扩展的高质量软件。
- 软件包英语This product provides the HTML5 (Chromium) Package as a GUI framework for RZ/G3E, RZ/G2L, RZ/G2LC, and RZ/V2L.
- 软件包英语Security package for RZ MPUs. This package is used in combination with the Linux package provided for each device.
- 软件包中文一款用于开发多操作系统解决方案的软件包，由 FSP 和 OpenAMP 组成，前者是用于 Cortex-M 或 Cortex-R 内核 MPU 的软件包，后者是用于处理器间通信框架的标准化 API。
- 软件包英语The RZ/G HMI SDK is an all-in-one Linux-based development environment. It includes all the software required to build HMI applications quickly and efficiently.
- IDE 和编码工具英语Eclipse-based Renesas integrated development environment (IDE).
- 解决方案工具包英语RZ Smart Configurator is a utility for combining software in ways that meet your needs. It simplifies the embedding of Renesas drivers in your systems through supports for importing middleware and drivers and configuring pins.
- 软件和工具 - 软件英语Based on the Android Open Source Project (AOSP), the software package supports evaluation of AOSP on Renesas RZ/G3E MPU for industrial HMI use cases. The zip file includes release notes, a user’s manual, prebuilt images for immediate evaluation on an EVK, proprietary binaries, and source code provided as the Renesas BSP, enabling users to evaluate system functionality and performance.
- 软件和工具 - 软件英语Please visit the RZ/G HMI Software Development Kit (GitHub) page before downloading this package.
- 软件和工具 - 评估软件英语
- 模型 - IBIS英语To support high-speed interface design for the RZ/G3E, IBIS-AMI models are provided for PCIe, USB 3.2 Gen2, and MIPI interfaces. The deliverables include IBIS models, AMI models, and sample testbenches that can be used for system-level SI analysis. For details on how to use these models, refer to the "RZ/G3E High-Speed Interface S-Parameter/IBIS-AMI Model".
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- 软件包中文RZ FSP 是一款增强型软件包，旨在为基于瑞萨电子 RZ 系列 Arm 微处理器的嵌入式系统设计提供用户友好、可扩展的高质量软件。
- 软件包英语This product provides the HTML5 (Chromium) Package as a GUI framework for RZ/G3E, RZ/G2L, RZ/G2LC, and RZ/V2L.
- 软件包英语Security package for RZ MPUs. This package is used in combination with the Linux package provided for each device.
- 软件包中文一款用于开发多操作系统解决方案的软件包，由 FSP 和 OpenAMP 组成，前者是用于 Cortex-M 或 Cortex-R 内核 MPU 的软件包，后者是用于处理器间通信框架的标准化 API。查看更多 (14)
软件与工具 (14)
- 示例代码英语Demonstrates how to write code using various unified Renesas RZ Flexible Software Package (FSP) v4.x.x modules supported by the RZG3E-EVK. The unified RZ FSP consolidates all previous family‑specific FSPs into a single package and provides an optimized, easy‑to‑use, scalable, high‑quality software solution for embedded system design.
样例程序 (1)
- 模型 - IBIS英语To support high-speed interface design for the RZ/G3E, IBIS-AMI models are provided for PCIe, USB 3.2 Gen2, and MIPI interfaces. The deliverables include IBIS models, AMI models, and sample testbenches that can be used for system-level SI analysis. For details on how to use these models, refer to the "RZ/G3E High-Speed Interface S-Parameter/IBIS-AMI Model".
- 模型 - BSDL英语
- 模型 - IBIS英语
模拟模型 (3)
Development Tool中文Supporting Arm® and RX microcontrollers, the SEGGER J-Link series is an industry-standard debugger for software development. High-speed programming algorithms reduce binary transfer time and accelerate development cycles. Broad compatibility supports Renesas e² studio, major IDEs, and RZ, RA, and RX devices. Advanced analysis with Ozone and ...提供方: EmbiTeK Co., Ltd.- Development Tool中文Provides universal device programming systems combining algorithms, process-control software, and socket modules for Renesas microcontroller production. Enables high-volume programming across the RA, RX, RL78, RH850, RZ, R8C, V850, M16C, H8, H8SX, H8S, SH, 78K and Synergy families using 9th- and 10th-generation universal site technology. Supports new socket ...提供方: BPM Microsystems
- Development Tool中文All-in-one testing tool for C and C++ developed by Parasoft that supports static analysis, unit testing, coverage measurement, and runtime memory error detection. Supports coding enforcement based on standards such as MISRA, AUTOSAR, CERT, and CWE, and enables automatic coverage collection during unit testing and application execution. Includes ...
- Development Tool中文Provides tools for developing real‑time, safety‑ and security‑critical embedded software by combining static analysis, unit testing, code coverage, requirements traceability, and compliance reporting in a unified workflow. Supports a TÜV SÜD‑certified GoogleTest‑based unit testing solution and integrates with modern development toolchains and continuous integration and continuous ...提供方: PARASOFT
- HMI中文High-performance, scalable and hardware-independent HMI software toolchain for embedded systems. Enables development of customizable 2D and 3D graphical user interfaces with a designer-centric workflow, WYSIWYG editor, no-coding methodology and AI-assisted Smart Importer. Integrated state machine and automated workflows accelerate development. Scales efficiently from low-end ...提供方: Candera GmbH查看更多 (70)
