概述
描述
Modern ovens are evolving beyond basic electronic controls to deliver richer user experiences, connectivity, and advanced cooking capabilities. As graphical interfaces, smart features, and advanced cooking functions become more common, manufacturers need scalable platforms that support everything from cost-sensitive entry-level models to premium connected appliances.
- Value design focuses on essential cooking control using a single MCU to manage heating elements, fans, lighting, capacitive touch buttons, rotary input, and an LED display. An integrated analog comparator reduces the external signal conditioning required for zero-cross detection, helping simplify the design and reduce system cost for high-volume platforms.
- Standard design adds a dedicated interface controller alongside the system MCU, supporting a graphical display, capacitive touch, haptic feedback, and optional wireless connectivity. Integrated relay and triac drivers replace discrete switching circuits, reducing component count and simplifying board layout. An optional isolated power supply separates low-voltage control and interface circuitry from the mains supply for enhanced design flexibility.
- Premium design combines isolated power with a feature-rich HMI that supports high-resolution graphics and voice interaction. Additional humidity and water-level sensing enable advanced steam cooking functions. Configurable analog front ends drive load relays while capturing current telemetry from relays and heating elements, providing the data needed for predictive maintenance based on component aging and usage patterns.
System Benefits:
- Flexible HMI architecture supports LED displays, graphical interfaces, and advanced user experiences with touch, haptic, voice, and wireless connectivity options.
- Expanded sensing capabilities enable advanced cooking functions, including steam management and enhanced control of cooking conditions.
- Integrated load telemetry monitors relay and heating-element performance, enabling predictive maintenance and long-term system health tracking.
- Integrated relay and triac drivers reduce component count and simplify load-control circuitry for heating and auxiliary functions.
- Optional isolated power architecture supports both cost-sensitive and mains-isolated oven designs.
远程测试该板卡
该板卡已上线云上实验室(Lab on the Cloud),使用我们的 PC 图形界面,无需实体板卡,便可在虚拟实验室中立即开始配置和测试设计。
Value Oven Platform
MCU
Low-power MCU with integrated capacitive touch sensing, enabling a single controller to manage the user interface, monitor operating conditions, and control cooking functions.
产品
开发板与套件
文档
AC/DC Non-Isolated
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DC/DC
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LED Driver: GreenPAK
Programmable mixed-signal IC that drives the matrix LED display and manages display timing for the user interface. Configurable in Go Configure™ Studio to implement application-specific logic.
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Standard Oven Platform
System MCU
Low-power system MCU that monitors oven sensors and safety inputs, controls relay and triac operation, and communicates with the separate HMI subsystem.
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AC/DC
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DC/DC
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Relay Driver: HVPAK
HVPAK mixed-signal ICs with integrated high-voltage outputs and flyback protection, providing two- or four-channel relay drive for heating elements and other oven loads. Configurable in Go Configure™ Studio to implement application-specific logic.
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Triac Driver: GreenPAK
GreenPAK programmable mixed-signal IC providing flexible triac control for the cooking fan, cooling fan, and oven lamp. Configurable in Go Configure™ Studio to implement application-specific logic.
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Photocoupler
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Shunt Regulator
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Medium-Graphics HMI
Scalable medium-graphics HMI design combines display, touch, and voice interaction across integrated and connected architecture variants.
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Premium Oven Platform
System MCU
Low-power system MCU that monitors oven sensors and safety inputs, manages relay operation and AC-load telemetry, and communicates with the separate HMI subsystem.
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AC/DC Non-Isolated
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AC/DC Isolated
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DC/DC
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LED Driver
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Shunt Regulator
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Photocoupler
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Photocoupler
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Relay Driver: HVPAK
HVPAK mixed-signal IC with integrated high-voltage outputs and flyback protection, providing four-channel relay drive for heating elements and other oven loads. Configurable in Go Configure™ Studio to implement application-specific logic.
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AC Loads Telemetry: AnalogPAK
AnalogPAK mixed-signal IC that monitors current across multiple oven loads to support diagnostics and predictive maintenance. Configurable in Go Configure™ Studio to implement application-specific logic.
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High-End Feature-Rich HMI
Flexible HMI platform with rich feature support for display resolutions, audio, speakers, and more.
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