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瑞萨电子 (Renesas Electronics Corporation) - June is Pride Month, a month to raise awareness of the rights and the culture of the LGBTQ+ community

特性

  • Configurable OE pin function as OE, PD#, PPS, or DFC control function
  • Configurable PLL bandwidth/minimizes jitter peaking
  • PPS: Proactive Power Saving features save power during the end device power down mode
  • PPB: Performance- Power Balancing feature allows minimum power consumption based on required performance
  • DFC: Dynamic Frequency Control feature allows up to 4 different frequencies to switch dynamically
  • Features < 65µA ultra-power-down
  • Outputs: 1MHz to 125MHz
  • Spread Spectrum clock support to lower system EMI
  • I²C interface
  • Supported by Renesas' Timing Commander™ software tool

描述

The 5L35023 is a VersaClock® programmable clock generator designed for low-power, consumer, and high-performance PCI Express applications. The 5L35023 device is a three-PLL architecture design, and each PLL is individually programmable and allows for up to five unique frequency outputs.

The 5L35023 has built-in unique features such as Proactive Power Saving (PPS), Performance-Power Balancing (PPB), Overshot Reduction Technology (ORT), and Extreme Low Power DCO. An internal OTP memory allows the user to store the configuration in the device without programming after power up, and then program the 5L35023 again through the I²C interface.

The device has programmable VCO and PLL source selection to allow the user to do power-performance optimization based on the application requirements. It also supports three single-ended outputs and two pairs of differential outputs that support LVCMOS and LPHCSL. A low-power 32.768kHz clock is supported with less than 2μA current consumption for the system RTC reference clock.

此为出厂可配置设备。
试用自定义部件配置工具

产品参数

属性
App Jitter CompliancePCIe Gen1, PCIe Gen2, PCIe Gen3
Outputs (#)7
Output TypeLVCMOS, LP-HCSL
Output Freq Range (MHz)0.032768 - 125
Input Freq (MHz)1 - 160
Inputs (#)1
Input TypeCrystal, LVCMOS, LVPECL, LVDS, HCSL
Output Banks (#)5
Core Voltage (V)1.8
Output Voltage (V)1.8
Product CategoryVersaClock 3S, General Purpose Clocks, Programmable Clocks

封装选项

Pkg. TypePkg. Dimensions (mm)Lead Count (#)Pitch (mm)
VFQFPN4.0 x 4.0 x 0.9240.5

产品对比

5L350235P350215P350235L35021
Inputs (#)1111
Output TypeLP-HCSL, LVCMOSLP-HCSL, LVCMOS, LVDS, LVPECLLP-HCSL, LVCMOS, LVDS, LVPECLLP-HCSL, LVCMOS
Core Voltage (V)1.83.33.31.8
Output Voltage (V)1.81.8, 2.5, 3.31.8, 2.5, 3.31.8
Pkg. Dimensions (mm)4.0 x 4.0 x 0.93.0 x 3.0 x 1.04.0 x 4.0 x 0.93.0 x 3.0 x 1.0

应用方框图

Interactive block diagram of the autonomous mobile robot system combines DRP-AI accelerator with Arm Cortex-R8 for real-time vision processing and system control.
自主移动机器人(AMR)
具备 AI 功能的 AMR 系统,集实时控制、可扩展电源和紧凑设计于一体。
Interactive block diagram of AI-powered service robot system features a high-end MPU and high-performance PMIC.
服务机器人
一款集成实时控制技术的 AI 驱动型服务机器人,可实现智能、安全、高效的导航。
AI dash camera interactive block diagram features a high-performance vision AI MPU with a power-efficient AI accelerator and HMI integration support.
AI 行车记录仪
采用 AI 技术的行车记录仪,具备高性能视觉处理、ADAS 和实时智能分析功能。
RZ/V2N Based Raspberry Pi Single Board Computer Block Diagram
基于 RZ/V2N 的 Raspberry Pi 单板计算机
高性能视觉 AI 系统,支持 4K 摄像头、高效的 AI 处理和紧凑的 SBC 设计。
Wireless electronic gaming table block diagram integrates an MPU main board with an optional plug-in Wi-Fi 6 module and single 3.3V supply.
无线电子游戏桌
灵活的 Wi-Fi 6 系统提供 3000Mbps、4x4 MIMO、双频支持以及无缝集成功能。
Scalable HMI SMARC SoM with AI Block Diagram
具有 AI 功能的可扩展人机界面 SMARC SoM
可扩展的 SoM,具有多核处理、高级图形和强大的连接性,适用于智能人机界面(HMI)。

其他应用

  • Embedded computing devices
  • Consumer application crystal oscillator replacements
  • SmartDevice, handheld, and consumer applications

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此为出厂可配置设备。
试用自定义部件配置工具
Part NumberStatusSamplesLongevityStockPackageBudgetary Price (USD)Lead Count (#)Carrier TypeMoisture Sensitivity Level (MSL)Qty. per Reel (#)Qty. per Carrier (#)Pb (Lead) FreePb Free CategoryTemp. Range (°C)Country of AssemblyCountry of Wafer Fabrication
5L35023B-000NLGIActiveAvailable2040 AprIn StockVFQFPN1ku | $124#Tray10490#Yese3 Sn-40 to 85°CMALAYSIATAIWAN
5L35023B-000NLGI8ActiveN/A2040 AprOut of StockVFQFPN1ku | $124#Reel12500#0Yese3 Sn-40 to 85°CMALAYSIATAIWAN
5L35023-000NLGIObsoleteN/AIn StockVFQFPN24#Tray10490#Yese3 Sn-40 to 85°C
5L35023-000NLGI8ObsoleteN/AOut of StockVFQFPN24#Reel12500#0Yese3 Sn-40 to 85°C

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Renesas Boards & Kits

Partner Boards & Kits

SoM/SBC

Banana PI BPI-AI2H System on Module (SoM)

Developed in collaboration with Renesas, the Banana Pi BPI-AI2H system on module (SoM) is an open-source hardware solution based on the high-performance RZ/V2H Vision AI MPU. Powered by the RZ/V2H chipset, it delivers powerful edge AI performance with advanced DRP-AI acceleration, multi-core Arm® Cortex®-A55 processing, and rich multimedia and high-speed I/O support—ideal for next-generation vision AI and edge computing applications.
Banana Pi
SoM/SBC

Banana Pi BPI-AI2N System on Module (SoM) & BPI-AI2N Carrier

Developed in collaboration with Renesas, the Banana Pi BPI-AI2N SoM module and carrier board provide an open-source hardware platform based on the RZ/V2N Vision AI MPU. Supporting 8GB LPDDR4x, 32GB eMMC, and QSPI flash in a compact SO-DIMM 260-pin form factor, the platform enables open-source development through a complete kit including SOM, carrier board, accessories, and SDK. Hardware and software customization for OEM/ODM is supported, along with Yocto and other open-source operating systems.
Banana Pi
SoM/SBC

E1M-X V2N System on Module (SoM)

A high-performance, cost-effective system on module (SoM) for AI-driven vision applications, the E1M-X V2N SoM is based on the Renesas RZ/V2N. It features a quad Arm® Cortex®-A55 CPU (1.8 GHz) and integrated 4K encode/decode, optimized for vision workloads. Supporting up to eight cameras via 2×4-lane MIPI CSI-2, it offers optional Wi-Fi® 6/Bluetooth® 5, flexible memory, storage, and PHY configurations for broad application development.
RZ/V2N,5L35023,DA9292
Alp Lab AB
SoM/SBC

E1M-X V2N-M1

A high-performance, cost-effective system on module (SoM) for AI vision systems, the E1M-X V2N-M1 SoM is powered by the Renesas RZ/V2N with a quad Arm® Cortex®-A55 (1.8 GHz) CPU and a DeepX-M1 AI accelerator delivering 25 TOPS plus 4K encode/decode. Optimized for vision workloads, it supports up to eight cameras via 2×4-lane MIPI CSI-2 and offers optional Wi-Fi® 6/Bluetooth® 5, flexible memory, storage, and PHY options.
RZ/V2N,5L35023,DA9292
Alp Lab AB
SoM/SBC

HummingBoard RZ/V2N AIOT

Provides advanced edge intelligence for Industrial Internet of Things (IIoT) and Artificial Intelligence of Things (AIoT) applications, powered by the DRP-AI3 Neural Processing Unit (NPU) for high-efficiency, low-latency inferencing. Enables real-time vision and sensor fusion with a quad-core Arm® Cortex®-A55 and Cortex-M33. Supports industrial connectivity including RS232, RS-485, CAN-FD, dual Gigabit Ethernet, and wireless options. Delivers optimized Linux support for secure, long-term industrial deployment.
RZ/V2N,5L35023,RAA215300
SolidRun Ltd.
SoM/SBC

OSM Size M System on Module (SoM) for Industrial Applications

An open standard module compliant system-in-package based on Renesas RZ/G3E family architecture, the MSRZG3E offers high-performance dual/quad Arm® Cortex®-A55 cores combined with a Cortex-M33 core. Featuring compact design and a wide range of functions, it delivers low-power consumption, thermal efficiency, and low-cost for embedded systems. Built around two or four Cortex-A55 CPU cores with a Cortex-M33 CPU core and optional Ethos-U55 NPU.
ARIES Embedded GmbH
SoM/SBC

RZ/G3E DX-M1 System on Module (SoM)

The RZ/G3E DX-M1 system on module (SoM) combines a powerful Renesas RZ/G3E application processor with the DEEPX DX-M1 AI Booster to deliver high-performance edge and AI computing in a compact SOM form factor. Featuring quad Cortex-A55 cores, advanced multimedia support, dual display graphics, and 25 TOPS AI acceleration, it’s ideal for industrial, vision and HMI applications requiring efficient local inference and rich connectivity like PCIe, USB3, Ethernet and high-speed camera interfaces.
Virtium
SoM/SBC

RZ/G3E OSM-L

The RZ/G3E OSM‑L System‑on‑Module packs the Renesas RZ/G3E application processor into a compact OSM‑L form factor, combining quad Cortex‑A55 and Cortex‑M33 cores with a Mali‑G52 GPU and on‑chip Ethos‑U55 NPU for efficient edge and HMI computing. It supports dual‑display graphics, 4K video encode/decode, MIPI/parallel interfaces, Gigabit Ethernet, PCIe Gen3 and USB3.2 connectivity. Designed for industrial and multimedia applications, it delivers responsive performance with rich I/O and industrial temperature options.
Virtium
SoM/SBC

RZ/G3E System on Module (SoM)

The RZ/G3E system on module (SoM) delivers robust edge computing and rich human-machine interface (HMI) capabilities in a compact SOM form factor. Powered by the Renesas RZ/G3E application processor with four Cortex-A55 cores, Mali-G52 graphics and an on-chip Ethos-U55 NPU, it supports dual displays, high-speed video codecs, and versatile I/O including PCIe Gen3, USB3.2 and dual Gigabit Ethernet. Ideal for industrial, multimedia and edge AI applications, it accelerates development with integrated memory, storage and broad connectivity.
Virtium
SoM/SBC

RZ/V2H SMARC Module

SMARC 2.1 system on module (SoM) based on RZ/V2H Renesas SoC revolutionizes industrial automation with its powerful AI-driven vision processing capabilities, enabling faster and more accurate machine vision. The module’s unique combination of real-time processing, integrated AI acceleration, and extensive interfaces empowers manufacturers to develop next-generation autonomous systems reducing development time and complexity.
Tessolve
SoM/SBC

SOMDEVICES uSMARC RZ/V2N

SMARC v2.1 system on module (SoM) based on the Renesas RZ/V2N processor, enabling high-performance image processing and dynamic control using advanced artificial intelligence with excellent power efficiency. Supports high-speed interfaces such as PCIe, USB3.2, and Gigabit Ethernet. Introduces µSMARC®, a smaller form factor that remains fully functionally compatible with the SMARC standard.
SomDevices
SoM/SBC

TIA RZ/V2H

The new Engicam system on module (SoM) is designed for a wide range of applications, including machine vision, autonomous robotics, and factory automation. It is built on the Renesas RZ/V2H processor, which integrates a DRP-AI accelerator delivering 8 TOPS (dense) and up to 80 TOPS (sparse), along with a GE3D 3D GPU. The module also features 1x GbE and 1x RGMII connectivity, as well as quad 4-lane MIPI-CSI interfaces, enabling advanced vision capabilities and efficient data acquisition.
Engicam Srl
SoM/SBC

V2H 4X SBC

A compact single‑board computer (SBC) featuring high‑bandwidth 4‑lane PCIe Gen3 for real‑time edge AI and vision applications. It supports seamless connectivity to FPGAs, NPUs, and storage devices to offload compute‑intensive workloads and reduce latency. With four independent MIPI CSI interfaces, rich I/O, efficient power design, and a developer‑friendly layout, the V2H 4X SBC supports robotics, industrial automation, and autonomous systems, accelerating prototyping and deployment of advanced embedded solutions.
IMDT
SoM/SBC

V2H Single Board Computer (SBC)

Provides a carrier board that converts the system on module (SoM) into a compact, high‑performance single board computer (SBC). The cost‑effective small form factor design supports diverse applications including robotics, drones, and smart city systems. It supports flexible assembly options tailored to specific requirements, along with comprehensive onboard connectivity. The platform delivers an energy‑efficient solution with a minimal footprint, enabling powerful computing in space‑constrained environments.
IMDT
SoM/SBC

V2H System on Module (SoM)

Provides a cost‑effective embedded module powered by the Renesas RZ/V2H processor for AI‑driven vision applications. It supports four four‑lane MIPI CSI‑2 connections, enabling parallel attachment of up to four cameras. Customization options include onboard Wi‑Fi® and Bluetooth®, selectable memory and storage capacities, and flexible physical layer configurations. The module delivers a compact form factor and a complete hardware and software solution, supporting scalable and modular system design.
IMDT
SoM/SBC

V2N SMARC Module

SMARC 2.2 system on module (SoM) based on RZ/V2N Renesas SoC. The RZ/V2N is a high-performance vision AI MPU powered by Renesas’ DRP-AI3 accelerator, delivering up to 15 TOPS of AI performance. It features quad Arm® Cortex®-A55 CPUs with an Arm Cortex- M33, integrated ISP, and dual-channel MIPI® CSI-2® interfaces for efficient dual-camera processing. It is ideal for applications such as driver monitoring systems, surveillance cameras, and mobile robotics.
Tessolve