概述
描述
瑞萨电子灵活配置软件包 (FSP) 是用于嵌入式系统设计的高质量增强型软件包，支持瑞萨电子 RA 产品家族 Arm 微控制器，提供用户友好的界面且可灵活扩展，确保从入门级到高性能的整个 RA 微控制器的软件兼容性。 在全新 Arm® TrustZone® 和其他高级安全功能的支持下，FSP 提供一种快速、通用的方式，使用量产级驱动程序、Azure RTOS、FreeRTOS™ 和其他中间件协议栈来构建安全、互联的物联网设备。
download 下载最新FSP (v6.5.0)：
FSP 平台安装程序（包含 e² studio 集成开发环境、工具链和 FSP 软件包）：
RA 智能配置（RASC）安装程序（FSP 软件包，可与 IAR Embedded Workbench、Arm Keil MDK 这些第三方集成开发环境一起使用）：
FSP 独立安装程序（FSP 软件包，适用于只更新 FSP 而不更新 e² studio 的用户）：
- 可从 GitHub 的 Assets 模块下载
安装说明可在此处找到。所有 FSP 发行版和补丁均可在 GitHub 上找到。
FSP 包括高性能、低内存占用的业界一流的 HAL 驱动程序。 还包含集成了 Azure RTOS 和 FreeRTOS 的中间件协议栈，能够简化通信和安全等复杂模块的实现。 e² studio IDE 提供了对图形化配置工具和智能代码生成器的支持，从而使编程和调试变得更加轻松快捷。
FSP 使用开放式软件生态系统，并且也为裸机编程提供了灵活性，客户可以选择使用 Azure RTOS 或 FreeRTOS、其他自选 RTOS、现有代码和第三方生态系统解决方案。 FSP和e² studio可以在任何瑞萨的设备上免费使用。
特性
- 支持基于 Arm® Cortex®-M 架构的 RA 系列微控制器的多核与单核方案
- HAL 驱动程序只占用少量内存
- 图形化配置工具和代码生成器
- 行业标准工具的静态和动态分析工具
- 支持使用 RTOS 和 非 RTOS 环境的应用程序
- Azure RTOS 及其配备了 Flexible Software Package 的中间件堆栈
- Azure RTOS ThreadX、NetX Duo & Add-ons、USBX、GUIX & GUIX Studio、FileX、TraceX、exFAT、LevelX、NetX Duo Secure & NetX Crypto（硬件加速）
- 支持 FreeRTOS – 包括 Kernel 和一组软件库
- FreeRTOS Kernel、FreeRTOS Plus TCP、核心 MQTT、核心 HTTP/HTTPS、任务池、安全套接、蜂窝接口
- 可使用工具配置的 RTOS 资源（Thread、mutexex 等）
- 来自瑞萨电子和第三方的中间件协议栈
- 针对基于 CM85 的微控制器，支持 Ethos-U55 以实现高效的 AI/ML 集成
- 包含 MQTT 的 TCP/IP 及其他连接协议栈
- USB 中间件，支持 CDC、HID 和 MSC
- 通过蜂窝（Cat-M1）、Wi-Fi 和 BLE 5.0（BLE 网络）进行无线连接
- 支持 FreeRTOS+FAT 和 LittleFS 文件系统
- 支持 SDMMC 和 USB 存储（块媒体）
- 闪存虚拟 EEPROM
- 电容式触摸中间件，用来实现触摸按键，滑条和转盘
- 电机控制算法
- 通过 MCUboot 保护引导加载程序
- 传感器模块 API
- TrustZone 支持（适用于基于 CM33 的 MCU ）
- 支持 TrustZone 的驱动程序和中间件
- 简单易用的 TrustZone 配置工具
- 通过 PSA Level2 认证
- AWS 验证合格的 FreeRTOS
- 可以连接到主要的云提供商
- 通过 NetX Duo Secure 和 Mbed TLS 保护连接
- Cryptographic API，支持集成硬件加速
- Arm PSA Cryptographic APIs
- Azure RTOS NetX Crypto APIs
- FSP Crypto API 提供终极安全性（SCE9 保护模式）
- Oberon Ocrypto 支持面向低端 RA2E1 器件的安全加密应用
- 适用于资源受限器件的 TinyCrypt
- 图形界面支持和工具
- 提供 RA 器件的 LVGL 图形库集成支持
- Segger emWin（RA 客户可以从下面的下载中免费获取 Segger emWin 图形工具和图形库）
- Azure RTOS GUIX 和GUIX Studio（在微软应用商店中免费提供）
- 安全调试功能
- 由瑞萨电子及其他领先的第三方解决方案提供完善的工具支持s
- 包含所有必要组件的集成式开发软件包，能够快速配置并启动开发（带有 e2 studio 的安装程序、CMSIS 包、工具链和 Segger J-Link 驱动程序）
- 可在 GitHub 上找到完整的源代码
发布信息
For additional information and links, go to GitHub.
v6.5.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.5.0.
Minimum e2 studio version for FSP 6.5.0 is e2 studio 2026-04.2
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v6_5_0_e2s_v2026-04.2.exe, from here.
Download the FSP with e2 studio Linux installer for this release, setup_fsp_v6_5_0_e2s_v2026-04.2.xz.run, from here. Refer to installation steps for information on installing e2 studio and related software components in a Linux PC.
Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v6_5_0_e2s_v2026-04.2.pkg, from here. Refer to installation steps for information on installing e2 studio and related software components in a macOS PC.
If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.
- For Windows download: FSP RASC Windows Installer
- For Linux download: FSP RASC Linux Installer
- For Mac OS (Apple Silicon) download: FSP RASC macOS Installer
Post - FSP v6.5.0 changes to toolchain support
Future releases of FSP will no longer ship with the GCC toolchain integrated within the combined e2 studio/FSP platform installer. The use of the GCC toolchain with FSP will still be supported, and an option in the platform installer will allow GCC to be downloaded from the internet and installed as part of the overall install process. Alternatively, it is possible to link e2 studio to an installation of the GCC toolchain already on the user's computer.
Note: The LLVM toolchain/Arm Toolchain for Embedded (ATfE) will continue to be integrated within the e2 studio/FSP platform installer.
With FSP 6.3.0 and later, when using the LLVM toolchain the compiler optimization level is set to -Os by default for RA4/RA6/RA8 MCUs, whereas previous FSP's would use -O2. This has been done as with LLVM, -Os causes a balance of optimizations similar to GCC's -O2 option.
Note that for RA0/RA2 MCUs, where keeping memory size to a minimum is typically of primary importance, the -Oz optimization level is selected by default.
All installers are available in the Assets section of this release.
Refer to the https://github.com/renesas/fsp/blob/master/README.md "README.md" in the FSP root folder for setup instructions, hardware details, and related links.
New Features
- MCUboot Solution Template Enhancements:
- Single‑Image MCUboot Templates:
- Added MCUboot single image solution template for RA6 CM4 devices (RA6M1, RA6T1, RA6M2, RA6M3) using mbedtls
- Added MCUboot single image solution template for cm33 devices (RA6M4, RA6M5, RA4M2, RA4M3) using mbedtls with crypto accelerator
- Added MCUboot single image solution template for cm33 devices (RA6M4, RA6M5, RA6E1, RA4M2, RA4M3, RA4E1) using mbedtls with crypto accelerator
- Added MCUboot single image solution template for CM85 devices using mbedtls with crypto accelerator
- MCUboot with MMF (Mirrored Memory Flash) Support:
- Added MCUboot single image solution template in MMF mode for RA6 CM4 devices (RA6M1, RA6T1, RA6M2, RA6M3) using mbedtls
- Added MCUboot single image solution template in MMF mode for RA2A2 using mbedtls
- Multi‑Image MCUboot Templates:
- Added MCUboot multi-image image solution template in Overwrite mode for CM85 devices (RA8P1, RA8D2, RA8M2, RA8T2) using mbedtls
- Single‑Image MCUboot Templates:
- Middleware and Feature Additions:
- Added support for Host USB Video Class (HUVC) driver
- Updated LVGL graphic library to version v9.5.0
- Added support for LwIP SNMP application
- Added link detection support for all RMAC port from r_layer3_switch
- New Board and Package Support:
- Added support for EK-RA8P1, EK-RA8M2, EK-RA8D2 V2 board
- Updated FSP pin configuration support for:
- RA8M1, RA8M2 and RA8T1 (169‑BGA package)
- RA4L1 (72-WLCSP package)
- RA0E1 (20-TSSOP package):
- Removed the sub-clock and its pins from FSP clock configuration and pin configuration
- Initialized the sub-clock related registers per TU
- Cryptography and Security Updates:
- Added HMAC-SHA3 224/256/384/512 feature for RSIP-E50D
- Added xDLMS InitiateRequest message decryption feature for RSIP-E11A
- Updated to MbedTLS version 3.6.6
Fixes and Improvements
- Added support to disable the TAU_PWM master-channel interrupt
- OFS register ZHUK is placed after PBPS
- Fixed the issue where the IPV settings are not applied to the VLAN and Layer 3 entries
- Support MAC table searches by source MAC address, destination MAC address, or both
- Added support of lwIP PPP configuration
- Updated the CCD setting description in r_ioport to notify users to enable CCD support when using CCD pins
- Improved CTSU2 diagnosis feature in r_ctsu
- Fixed issues in CTSU2 CCO correction for devices with certain characteristics (announced in R20TS1229EJ0100), and CTSU1 CCO correction for RA4M2 and RA4M3
- Fixed MPU region size check to avoid configuring zero size regions when D-Cache is enabled for RA8 devices
- RSIP Protected Mode driver improvements:
- Reduced code size for RSIP-E51A and RSIP-E50D PM drivers
- Updated control procedures for RSIP-E11A PM driver to code size reduction version
- Updated CAVP certified module for RSIP-E31A PM driver due to re-acquisition of CAVP certification
- Bugs fixed:
- Buffer size of cert info and wrapped secret was not defined correctly when using brainpool curve
- Buffer size of input message was not defined correctly when using KDF-SHA 512
- Updated PQC-Lib V2.00 with stack overflow bug fix
- Fixed incorrect bit length for SCE9 PSA Crypto wrapped keys
- Updated description for RAMP in MDF
- Fixed link bug r_ether with ICS1894 PHY
- Updated IAR toolchain to v9.70.4
- Fixed build error when user custom PHY function is used on ESWM
- Fixed rm_motor_control callback issue when 2 motors are enabled
- rm_motor_pm_foc module:
- Fixed a unit typo where degree values were assigned to variables intended to be in radians
- Optimized the sine and cosine calculations in the transform function within the current control loop of rm_motor_pm_foc_inner
- Fixed typos in rm_motor_pm_foc.h:
- Renamed p_to_outer_active to p_to_inner_active in the outer module
- Renamed p_to_outer_copy to p_to_inner_copy in the outer module
- rm_motor_sensor module:
- Fixed a unit typo where degree values were stored in variables intended for radians
- Fixed an issue where the sign of e_q inverted during deceleration, causing a loss of value continuity and resulting in incorrect angle integration
- Added D-Cache enabled support for RA8 devices for below modules:
- DTC: Review DTC documentation for details
- SPI_B: Review SPI_B documentation for details
- SCI_B_SPI: Review SCI_B_SPI documentation for details
- SCI_B_UART: Review SCI_B_UART documentation for details
- Corrected the copyright notice errors in the CAVP module source files for RSIP-E31A
- Improved rm_psa_crypto SHA-256 code to handle message lengths that are multiples of 128 bytes
- Updated workaround document for e2 studio 2026-04 pin configuration tooling
- Updated the BSP usage notes and Cortex-M85 cache document with information relevant to DTC driver D-Cache support
- Fixed an error in the macro definitions that specify the sizes of the key buffer for SCE9 Key Injection
- Fixed pin output support enable when using the compare match feature
- LVGL updates:
- Enabled runtime control of the GPU (enable/disable)
- Fixed the screen lock issue when using Dave2D
- Set LV_USE_OBJ_NAME to enabled by default
- Fixed D-Cache enable and warmstart post-initialization call sequence in SystemInit()
- Corrected maximum configurable bitrate for R_SPI_B
- Updated procedures for RSIP-E51A
- ThreadX projects no longer globally disable GCC sign conversion warnings
- Fixed WDT security attribution not set in secure project in RA8x2
Known Issues
- Solution Projects (TrustZone, Multicore):
- There are issues related to pin configuration in e2 studio 2026-04.2. Refer to this document for workarounds
- RA0x devices:
- HS400x and ZMOD4xxx sensors cannot be used on RA0E1
- FS3000 sensor does not support SAU-I2C driver
- Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
- PMSC may not work properly when USBX Composite Device (PCDC+PMSC) is connected to a specific Linux OS (USB Host).
- EWARM version 9.70.4 does not contain support for RA0E3. To develop with IAR for these devices, it is necessary to install a support patch file, which can be downloaded by EWARM v9.70.4 users from the IAR MyPages system
- RA0E3 (arm_Renesas_RA0E3_20260106_1.zip)
- When importing projects in e2 studio that were created using a previous toolchain version, be sure that the version specified in the project is integrated (Window->Preferences->Renesas->Renesas Toolchain Integration) or select the appropriate toolchain version if upgrading the project to a later FSP version.
- When upgrading RA6T2 projects to FSP 6.4.0, the GTETRGx pin assignments might be lost. Please re-assign the pins manually.
- When upgrading RA0E1/E2/L1 projects to FSP 6.4.0, the SAU_SPI00 pin group might be changed; please restore the pin group manually.
- For known issues in the tools, please refer to the respective tool's release notes e2 studio RN.
- Updated rm_psa_cryto header to allow using the functions in a CPP project
目标设备
下载
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PDF
666 KB
The EK-RA8E2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8E2 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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736 KB
The EK-RA8M1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8M1 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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693 KB
The EK-RA8M2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8M2 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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719 KB
The EK-RA8P1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8P1 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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575 KB
The EK-RA8T2 example project shows how to write code using various Flexible Software Package (FSP) modules supported by the EK-RA8T2 kit. The FSP provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design. This is the application note for the EK-RA8T2 example project.
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552 KB
Outlines the contents of the example project bundle for the FPB-RA0E3 kit. These example projects demonstrate how to develop code using the Renesas Flexible Software Package (FSP) modules supported by the kit.
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632 KB
The FPB-RA8E1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA8E1 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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700 KB
The MCK-RA8T1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA8T1 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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669 KB
The MCK-RA8T2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA8T2 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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834 KB
The S Cache on the system bus can significantly improve data access performance in Renesas RA Family Arm Cortex‑M33 MCUs when CPU speed exceeds SRAM performance. This application note explains S Cache architecture, configuration, coherency handling, and performance considerations, with example projects demonstrating cache control and optimization using the Renesas Flexible Software Package (FSP).
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2.30 MB
Learn more about the guidelines for implementing vision AI applications using Renesas RA8P1 MCUs with Ethos-U NPU support. It can be used as a reference for developing other vision AI applications.
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3.85 MB
Learn how Renesas MCU security is built around integrated security engines. The RA family includes various types, which can be identified in each MCU’s hardware manual. These engines operate in two modes: Compatibility and Protected. This application note defines both and outlines their use cases.
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| 应用说明 | Reference System Design for Vision AI on EK-RA8D1
Learn how the Renesas RA8 Series MCUs integrate Helium technology which boosts performance when running an Artificial Intelligence (AI) model. There are other supporting hardware features that can be used in an AI application project.
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4.55 MB
日本語
Learn how to implement environmental sensor monitoring on the EK‑RA2L2 as a migration example of the RA2L2 MCU USB Type‑C reference design. This application note explains USB Type‑C CC detection and sensor data logging, and describes how to display date and time, temperature, humidity, illuminance, and USB connection status on a Pmod OLED.
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| 快速入门指南 | VK-RA8M1 Voice Application Combo (VAS, VCR) Quick Start Guide
The quick start guide and project file for VK‑RA8M1 guides developers to evaluate the voice AI application example combo of Voice Anti-Spoofing (VAS) and Voice Command Recognition (VCR).
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| 快速入门指南 | VK-RA8M1 Voice Application Combo (VAS, VCR, SID) Quick Start Guide
The quick start guide and project file for VK‑RA8M1 guides developers to evaluate the voice AI application example combo of Voice Anti-Spoofing (VAS), Voice Command Recognition (VCR), and Speaker ID (SID).
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| 快速入门指南 | VK-RA8M1 Voice Application Combo (APF, NLU, VAS, CNSV) Quick Start Guide
The quick start guide and project file for the VK‑RA8M1 guides developers to evaluate the voice AI application example combo of Audio Processing Front (APF), Natural Language Understanding (NLU), Voice Anti-Spoofing (VAS), and Speaker Verification (CNSV).
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| 快速入门指南 | Voice Kit RA6E1 Voice Application Combo (VAS, VCR) Quick Start Guide
The quick start guide and project file for the Voice Kit RA6E1 guides developers to evaluate the voice AI application example combo of Voice Anti-Spoofing (VAS) and Voice Command Recognition (VCR).
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| 快速入门指南 | Voice Kit RA6E1 Voice Application Combo (VAS, VCR, SID) Quick Start Guide
The quick start guide and project file for the Voice Kit RA6E1 guides developers to evaluate the voice AI application example combo of Voice Anti-Spoofing (VAS), Voice Command Recognition (VCR), and Speaker ID (SID).
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2.60 MB
Learn how to implement an embedded webcam solution in the Renesas RA8 MCU, featuring an integrated Camera Engine Unit (CEU) and advanced networking capabilities.
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2.83 MB
Learn multicore application project creation using the MCUboot module on the Renesas EK-RA8P1 kit using FSP v6.4.0, and recreate the bootloader and link the application projects to work with the bootloader using the FSP solution project. Understand the procedures for configuring an application to work with the bootloader, and for downloading and updating a new application image.
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725 KB
Guides you in integrating the RA Family SCE7 module with the FSP Mbed Crypto middleware in your design. Explains how to add, configure, and use these components effectively, providing example code as a practical reference and starting point for secure application development.
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| 手册 - 软件 | PDF 51.09 MB | |
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2.70 MB
Provides the fundamental knowledge needed to port example projects from one RA kit to another. It then demonstrates these principles by explaining how to port three example projects of varying levels of complexity from the MCK-RA4T1 to the FPB-RA4T1.
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3.49 MB
This application project then walks the user through the updates to the bootloader to add encryption for the QSPI based secondary image storage. The application examples implemented image downloading to the QSPI secondary slot over USB PCDC. MCUboot with encryption also supports internal flash encryption.
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4.16 MB
日本語
Featuring a 1GHz Arm Cortex-M85 and 250MHz Arm Cortex-M33, the RA8 dual-core MCU delivers high performance through asymmetric processing. The document explains the architecture, illustrates effective task partitioning, and provides practical use cases, demonstrating how developers can leverage both cores to optimize application throughput and responsiveness.
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2.97 MB
Describes the operation of the Analog-to-Digital Converter (ADC) on the RA6T2, with a focus on the conversion methods that enable 16-bit depth resolution. This application note provides a background on oversampling techniques to increase A/D resolution, then dives into the specifics of the oversampling features built into the ADC on the RA6T2, covers the key configurations for capturing data in 16-bit depth mode, and details the important functions for ensuring proper operation.
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3.23 MB
This application note walks the user through application project creation using the MCUboot module on Renesas EK-RA4M3 with external QSPI flash as the secondary image storage area. The application examples implemented image downloading to the QSPI secondary slot over USB PCDC. MCUboot with encryption also supports internal flash encryption.
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3.87 MB
Presents the development of a graphics application for the RA8D1 MCU using the MIPI display on the EK-RA8D1 evaluation kit. This application note explains GUI design with SEGGER AppWizard and integration with e² studio using RA FSP, emWin, and FreeRTOS. The note also covers touch panel interfacing and discusses key design tradeoffs for optimizing graphics performance on the RA8D1 architecture.
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810 KB
Provides an introduction to Virtual EEPROM (VEEPROM) technology, its intended use, and what is required to work through the example project as written.
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6.16 MB
Clear, step‑by‑step instructions guide developers in building a secure bootloader using the MCUboot module with TinyCrypt, enhancing security for applications targeting Renesas RA0 and RA2 series MCUs. This application note also outlines project configuration requirements and system startup procedures.
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4.46 MB
This thermostat application provides a reference for developing complex dual-core, multi-threaded applications with a touch screen graphical Human Machine Interface (HMI) by using Renesas FSP and Azure RTOS GUIX. It describes steps to create a basic GUIX for FSP, integrates touch driver, handles multiple hardware accesses across cores, manages system updates, and performs event handling.
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2.35 MB
Learn how to inject plaintext keys into RA MCUs using various security engines operating in Compatibility Mode. This application note details the protection of the Root of Trust, emphasizing secure key storage through hardware unique keys (HUK) and isolated cryptographic operations within the security engine. The security engines support multiple cryptographic algorithms and key handling methods, enabling secure and efficient key management.
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2.98 MB
MCUboot is a secure bootloader for 32-bit MCUs. It defines a common infrastructure for the bootloader, defines system flash layout on microcontroller systems, and provides a secure bootloader that enables easy software update. MCUboot is operating system and hardware independent and relies on hardware porting layers from the operating system it works with. This application note demonstrates secure bootloader design using this dual-bank feature for a non-TrustZone environment based on RA2A2.
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5.17 MB
Explore the development of a graphics application built for the RA8D2 MCU, running on a MIPI graphics expansion board with the RA8D2 evaluation kit. This application note provides a comprehensive overview of key concepts and implementation techniques for building high-performance HMI applications using the RA8D2 MCU.
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| 手册 - 开发工具 |
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2.92 MB
日本語
The Renesas EK-RA8M1 Evaluation Kit empowers developers to unlock the full potential of the RA8M1 MCU with a 480 MHz Arm Cortex-M85 core, advanced connectivity options, and rich ecosystem support. Featuring Ethernet, USB High-Speed, CAN FD, and Octo-SPI Flash, this versatile platform accelerates prototyping and innovation for high-performance embedded applications.
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| 手册 - 软件 | PDF 48.07 MB | |
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402 KB
AI 生成的摘要:
The document explains the two operational modes, highlighting their advantages and disadvantages, and provides practical guidance for selecting and using each mode. It also includes reference links to Renesas RA Family Application Projects that demonstrate these modes with detailed examples of the related FSP module usage.
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6.72 MB
日本語
The following Renesas RA8 Series MCUs make available a First Stage Bootloader (FSBL), which is masked in ROM and can execute after reset to verify the OEM firmware programmed in the on-chip flash in the single-chip operating mode.
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2.35 MB
AI 生成的摘要:
This guide details the implementation of AWS IoT Core connectivity and OTA firmware updates on Renesas RA MCUs using the CK-RA6M5 v2 kit with Ethernet. It covers bootloader creation with MCUboot, MQTT/TLS setup, integration of AWS IoT Device SDK components, and secure authentication with X.509 certificates leveraging RA MCU hardware security. It also includes prerequisites, tools, and step-by-step instructions for building secure, cloud-connected applications with OTA updates.
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8.33 MB
This guide details the objectives, architecture, and scope of OTA updates using AWS IoT OTA, and provides step-by-step instructions for preparing, executing, and validating firmware updates on the CK-RA6M5 v2 board. The project integrates three core components: a secure bootloader, a cloud connectivity application with downloader functionality, and AWS OTA cloud-side configurations for image storage and update initiation.
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4.90 MB
The RA8 MCU has the Octal Serial Peripheral Interface (OSPI). This is the OSPI_B version of the OSPI peripheral module on the RA8 MCUs. The Decryption On-The-Fly (DOTF) peripheral on the RA8 MCUs enables secure external storage of application code or data on the OSPI memory.
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| 手册 - 软件 | PDF 62.26 MB | |
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2.32 MB
IoT security relies on a cryptographic unique identity as a Root of Trust. This document introduces Renesas RA Family MCU security features, including the Renesas Secure IP (RSIP) engine, which can generate and securely store a private and public key pair for use with Public Key Infrastructure (PKI), ensuring the private key remains protected and never exists in plaintext outside the MCU.
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1.50 MB
AI 生成的摘要:
Low Power Modes (LPMs) reduce power consumption in RA2L1/RA2E1 microcontrollers by stopping the CPU while allowing selective peripheral operation. Four LPM types include Sleep, Software Standby, Snooze, and Deep Software Standby modes, each with different power-saving levels and peripheral availability. The document covers configuring LPMs, clock source changes at runtime, peripheral operation during LPM, and user interface control for mode transitions. It also explains power control modes, timer configurations, and debugging techniques to optimize battery life in embedded applications.
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2.87 MB
AI 生成的摘要:
Low Power Modes (LPM) reduce the effective power consumption of RA microcontrollers by stopping the CPU and selectively operating peripherals and oscillators. Four LPM types are supported: Sleep, Software Standby, Snooze, and Deep Software Standby modes, each offering different power savings and peripheral availability. The document details configuring LPMs, clock source changes at run-time, peripheral operations during LPM, and transitioning between modes. It includes example projects demonstrating LPM usage, FSP configuration steps, and debugging methods across various RA kits, enabling efficient low power application development.
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189 KB
AI 生成的摘要:
The Low Power Applications Package provides multiple application projects for Renesas RA family microcontrollers, including EK-RA2L1, EK-RA6M3, FPB-RA6E1, and FPB-RA4E1. It includes code and documentation for clock switching and operable long timer functions in low power modes. Users can access detailed application notes and example projects organized by device group. The package supports efficient low power management and offers links to product information, support forums, and software packages. It emphasizes reading included documents before use and outlines revision history and legal disclaimers related to product use and intellectual property.
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1.51 MB
AI 生成的摘要:
The document explains how to establish and protect unique device identities in IoT environments using RA Family MCUs with Arm TrustZone and Secure Crypto Engine 9 (SCE9). It details generating ECC key pairs, storing private keys securely, and creating device certificates to enable trusted authentication. The RA Family MCUs provide hardware security features such as TrustZone memory protection, flash block locking, and cryptographic support. The example implementation uses the EK-RA6M4 board and software tools like e2 studio IDE, RA Flexible Software Package, and SEGGER J-Link. The guide targets developers familiar with Renesas tools and cryptography, enabling secure device identity management in IoT applications.
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1.38 MB
AI 生成的摘要:
ADC interleaved mode doubles the data sampling rate by alternating conversions between two ADC units on the same input pin, synchronized via a General-Purpose Timer (GPT). Precise 180° phase alignment between ADC cores is critical to avoid spurious signals. Gain and offset mismatches between ADC cores can introduce errors but can be compensated digitally. The method enhances signal processing speed by combining outputs from two ADCs using DMA for efficient data transfer. The setup involves configuring ADC, GPT, and DMAC modules on Renesas RA MCUs, demonstrated with the EK-RA6M5 evaluation kit.
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900 KB
AI 生成的摘要:
Digital filters modify input signals by enhancing or attenuating specific frequency components. Infinite Impulse Response (IIR) filters use feedback to achieve filtering with fewer computations and shorter delays compared to Finite Impulse Response (FIR) filters. IIR filters are often implemented as cascaded biquad sections to maintain stability and achieve sharper frequency roll-offs. Various analog filter designs such as Butterworth, Chebyshev I & II, and Elliptical influence IIR filter characteristics. MATLAB tools assist in designing and extracting coefficients for these filters. The document details configuring and operating the IIR Filter Accelerator on the RA6T2 MCU to implement digital filtering efficiently.
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976 KB
AI 生成的摘要:
The document explains how to generate and precisely adjust PWM outputs with sub-nanosecond delay using the General PWM Timer Enhanced High-Resolution channels on RA6M3 MCUs. It details configuring the GPT timers, setting up the PWM Output Delay circuit to achieve timing accuracy of 260 picoseconds, and controlling rising and falling edges of PWM signals. The guide covers hardware setup with the EK-RA6M3 kit, software configuration via Renesas Flexible Software Package, and user interaction through push-button interrupts. Typical applications include power supply, motor control, and digital lighting.
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4.21 MB
AI 生成的摘要:
The document explains how to develop complex multi-threaded graphical applications with touchscreen Human Machine Interfaces (HMI) using the Renesas RA Flexible Software Package (FSP) and SEGGER AppWizard on the EK-RA6M3G kit. It covers setting up the board, integrating AppWizard projects, configuring peripherals like PWM backlight control, and leveraging FreeRTOS features such as threads and semaphores. The development environment is Renesas e2 studio, and the document details step-by-step procedures for building, importing, and running the graphics application. It also lists required software versions and hardware components, including the RA6M3 MCU and a 4.3-inch TFT LCD with capacitive touch.
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3.64 MB
AI 生成的摘要:
This document guides the development of a multi-threaded thermostat application featuring a touch screen graphical Human Machine Interface (HMI) using Renesas RA Flexible Software Package (FSP) and Azure RTOS GUIX. It covers creating GUIX projects, integrating touch drivers, managing hardware access, system updates, and event handling. It details tool installation, project creation, hardware setup, and controlling LCD backlight via PWM. The development environment includes e2 studio IDE, FSP, and Azure RTOS GUIX Studio. The document assumes familiarity with RTOS concepts and multi-threaded programming.
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| 手册 - 软件 | PDF 46.60 MB | |
| 手册 - 软件 | PDF 43.56 MB | |
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4.03 MB
AI 生成的摘要:
Custom drivers for Renesas RA MCUs enable direct hardware register access, offering flexibility beyond the standard Flexible Software Package (FSP) drivers. This guide explains a three-step workflow: creating an FSP reference project, developing custom driver code, and integrating these drivers into a minimal Board Support Package (BSP) project. It focuses on low-level register programming, especially for RA0 and RA2 MCUs, using the FPB-RA0E1 device as an example. The guide covers project setup, peripheral configuration, clock and interrupt management, and debugging techniques to help advanced embedded developers design tailored, efficient applications.
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| 手册 - 软件 | PDF 42.64 MB | |
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1.75 MB
AI 生成的摘要:
Instructions guide the creation and integration of custom Flexible Software Package (FSP) modules into e2 studio. Key steps include establishing the module file structure, editing the .pdsc path description file, configuring tooling support, and modifying module description files before packaging into a .pack file. The FSP supports scalable embedded system development with modular components such as HAL drivers, middleware, RTOS, and BSPs. The document emphasizes maintaining Renesas programming standards and middleware hierarchy to ensure compatibility and smooth integration.
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| 手册 - 软件 | PDF 41.78 MB | |
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6.28 MB
AI 生成的摘要:
MCUboot provides a secure bootloader framework for 32-bit MCUs, enabling secure booting and fail-safe firmware updates. The RA8 MCU family supports a dual bank code flash feature that simplifies firmware updates by allowing bank swapping. This design leverages MCUboot integrated in Renesas Flexible Software Package (FSP) to create a Root of Trust and manage secure bootloading and application updates. Example projects for RA8M1 demonstrate secure bootloader creation, application signing, debugging, and firmware update processes using dual bank mode. The document also details development tools, hardware requirements, and step-by-step instructions for implementing and evaluating secure bootloaders with MCUboot and dual bank flash.
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6.08 MB
AI 生成的摘要:
The document details the implementation of Arm TrustZone technology on Renesas RA8 MCUs with Cortex-M85 cores, focusing on hardware and software security features. It guides secure system design using TrustZone, including IP protection use cases and device lifecycle management. It covers development tools like e2 studio, IAR EWARM, and Keil MDK, and provides step-by-step instructions for secure and non-secure project development. The document also explains security attribution units, memory and peripheral security, and best practices for TrustZone-enabled software development.
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| 手册 - 软件 | PDF 41.42 MB | |
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2.85 MB
AI 生成的摘要:
MCUboot provides a secure bootloader infrastructure for 32-bit MCUs, enabling secure booting and fail-safe application updates. It supports multiple update strategies—Overwrite, Swap, and Direct Execute-In-Place (DXIP)—each with distinct advantages and memory requirements. The bootloader authenticates firmware images using RSA or ECDSA signatures and SHA-256 hashing. Integration with Renesas Flexible Software Package (FSP) allows easy MCUboot deployment across RA Family MCUs, supporting TrustZone-based security. Example projects demonstrate multi-image and single-image configurations on EK-RA6M4 and EK-RA6M3 kits. The document guides hardware setup, software configuration, project creation, signing, and debugging to implement secure bootloader solutions.
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5.25 MB
AI 生成的摘要:
The document guides the development of a multi-threaded thermostat application with a touch screen GUI using Renesas RA MCUs, Azure RTOS GUIX, and the Flexible Software Package (FSP). It covers setting up the parallel LCD display, integrating touch drivers, managing hardware access, and implementing system updates and event handling. The guide includes steps for project creation, enabling SDRAM for GUIX storage, configuring timers for backlight control, and debugging. It supports rapid development of connected IoT devices with secure, production-ready drivers and middleware stacks such as Ethernet and USB. The package includes PCB design files like BOM, schematics, and Gerber files for hardware integration.
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2.49 MB
AI 生成的摘要:
Steps to add support for new UART-based Wi-Fi modules on Renesas RA MCUs using the Flexible Software Package (FSP) are detailed. It covers Wi-Fi driver architecture, APIs for TCP/IP communication, UART drivers, and FreeRTOS stream buffers. The document explains FSP components including Board Support Package, HAL drivers, libraries, RTOS, and middleware. It guides creating custom FSP user packs and modifying XML files for new modules. Development and testing procedures use Sierra Wireless BX310x and EK-RA6M3 kits as references.
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163 KB
AI 生成的摘要:
The FPB-RA4T1 Example Project Bundle provides sample code demonstrating the use of Renesas Flexible Software Package (FSP) modules for embedded system design. It supports multiple toolchains including e2studio with GCC ARM, Keil MDK, and IAR EWARM. The FSP offers scalable, efficient drivers with uniform APIs and detailed documentation, enabling optimized application development across RA family MCUs. The bundle includes example projects compatible with various toolchains and guides for usage and porting. Support resources and product information are accessible via Renesas websites. The document also outlines product quality grades, usage restrictions, and legal disclaimers.
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163 KB
AI 生成的摘要:
The FPB-RA6T3 Example Project Bundle provides example code for developing applications using Renesas Flexible Software Package (FSP) modules compatible with the FPB-RA6T3 kit. It supports multiple toolchains including e2studio with GCC ARM, Keil MDK, and IAR EWARM. The FSP offers scalable, efficient drivers with uniform APIs and detailed documentation, enabling optimized embedded system designs across RA family MCUs. The bundle includes QuickStart projects and guidance for usage and porting. Support resources and product information are available through Renesas websites. The document also outlines product quality classifications, usage restrictions, and legal disclaimers.
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3.78 MB
AI 生成的摘要:
The RA2E1 and RA2E2 MCUs enable low-power data logging by using ADC, DTC, ELC, and low-power modes such as Snooze and Software Standby. Sensor data is acquired periodically, compared against thresholds, and stored. If data exceeds thresholds, the MCU exits low-power mode to transmit data via UART. The system minimizes CPU activity to reduce power consumption, making it suitable for applications like fitness trackers and fleet devices. Hardware and software resources include Renesas RA kits, Grove sensors, e2 studio IDE, and FSP. The document details mode transitions, peripheral usage, and data handling for efficient low-power operation.
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1.19 MB
日本語
AI 生成的摘要:
The document explains how to connect Renesas RA MCUs to AWS IoT Core using MQTT over TLS via cellular networks. It covers configuring AWS IoT Core, using MQTT/TLS modules, and integrating AWS Core MQTT, Mbed TLS, and cellular socket wrappers. The guide includes hardware and software requirements, cloud dashboard monitoring, device management, and security features like X.509 certificates and encryption. It targets developers building secure IoT applications with cellular connectivity on RA6M5 MCUs.
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3.28 MB
AI 生成的摘要:
The document explains how to calibrate the high-speed on-chip oscillator (HOCO) frequency using the clock frequency accuracy measurement circuit (CAC) on the RA2E3 MCU. It details adjusting the HOCO trimming register (HOCOUTRM[7:0]) to compensate for frequency deviations caused by environmental factors. The calibration process uses CAC's compare-match interrupt to measure HOCO frequency and update the trimming register to maintain accuracy within ±0.1%. The document also covers hardware and software requirements, operation conditions, peripheral functions, and sample code structure for implementing the calibration.
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| 手册 - 软件 | PDF 40.84 MB | |
| 手册 - 软件 | PDF 40.88 MB | |
| 快速入门指南 | PDF 1.01 MB | |
| 工具新闻 - 注意事项 | PDF 146 KB 日本語 | |
| 应用说明 | PDF 797 KB | |
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PDF
2.60 MB
AI 生成的摘要:
MCUboot provides a secure bootloader framework for 32-bit MCUs, enabling firmware integrity verification and secure updates. It supports multiple image upgrade methods—Overwrite, Swap, Direct execute-in-place (XIP), and RAM loading—each with distinct advantages and limitations. The RA2 MCU series uses MCUboot integrated with TinyCrypt for optimized cryptographic support, addressing limited memory constraints. The document guides creating and configuring bootloader projects, handling application updates, and running example projects on the EK-RA2E1 evaluation kit. It details development tools, hardware requirements, and best practices for secure bootloader deployment on Renesas RA2 MCUs.
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| 手册 - 软件 | PDF 40.43 MB | |
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PDF
993 KB
AI 生成的摘要:
Power management techniques optimize energy consumption and extend battery life in embedded systems using RA8 MCUs. Key methods include low power and CPU sleep modes, power gating, frequency and clock gating, multiple voltage and power domains, and voltage/frequency scaling. Efficient hardware PCB design and firmware optimization further reduce power usage. RA8 peripherals like DMAC, DTC, and ELC support power-saving operations. The document details these features, design considerations, and practical techniques for minimizing power consumption in RA8-based applications.
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3.90 MB
AI 生成的摘要:
MCUboot provides a secure bootloader framework for 32-bit MCUs, enabling secure booting and fail-safe firmware updates using internal code flash. It supports multiple update strategies including Overwrite, Swap, and Direct Execute-in-Place (DXIP), each with distinct advantages and trade-offs. The bootloader authenticates firmware images using RSA or ECDSA signatures and SHA-256 hashing. Integration with Renesas Flexible Software Package (FSP) simplifies creating a Root of Trust and supports TrustZone-based designs. Example projects demonstrate usage on EK-RA4M3 kits with FSP v5.2.0, covering multi-image and single-image configurations. Development requires e2 studio IDE, FSP, SEGGER J-Link, and Python. The document guides through project setup, bootloader creation, application signing, and update modes, providing a comprehensive framework for secure firmware management on Renesas RA MCUs.
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| 应用说明 |
PDF
1.37 MB
AI 生成的摘要:
The Renesas RA8 MCU with Arm® Cortex®-M85 core and Helium™ technology delivers enhanced performance for DSP and machine learning applications. It leverages Single Instruction Multiple Data (SIMD) via Helium™ vector extensions, supporting both integer and floating-point operations. The MCU runs up to 480 MHz, featuring up to 2 MB flash, 1 MB SRAM with Tightly Coupled Memory (TCM), and advanced peripherals like Ethernet, USB, and security functions. Performance improvements utilize TCM, data caches, and optimized toolchains including LLVM and Renesas Flexible Software Package. The document includes application examples demonstrating vector multiply-accumulate instructions and benchmarking results to highlight performance gains.
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| 应用说明 |
PDF
1.22 MB
AI 生成的摘要:
CAN FD extends the original CAN protocol to support higher data rates (up to 8 MHz) and larger payloads (up to 64 bytes), enabling efficient real-time communication between multiple processors in automotive, industrial, and consumer applications. It maintains compatibility with CAN by performing arbitration at 1 MHz, then switching to higher speeds for data transmission. This example uses Renesas RA4E2 and RA6E2 MCUs with CAN FD peripherals, demonstrating project setup, communication, and enhancements using Renesas' Flexible Software Package (FSP) and e2 studio IDE. The document covers CAN FD fundamentals, example projects, testing, modifications, and API details.
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| 应用说明 |
PDF
2.54 MB
AI 生成的摘要:
Secure Data at Rest protection focuses on safeguarding inactive data stored within embedded systems using RA MCUs. It employs Data Encryption and Data Access Control to protect sensitive information in volatile and non-volatile memory, including internal flash and SRAM. The Security MPU and Flash Access Window (FAW) features enable read, write, read/write, write-once, and combined write-once/read protections. These mechanisms reduce attack surfaces by controlling access permissions and preventing unauthorized modifications. The document details configuration methods, operational flows, and example projects to implement these protections effectively in embedded applications.
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| 手册 - 软件 | PDF 37.97 MB | |
| 应用说明 |
PDF
3.07 MB
English
, 日本語
本应用说明基于瑞萨 e² studio 工程，介绍在 IAR Embedded Workbench for Arm、Keil Microcontroller Development Kit‑Arm 等 IDE 中创建工程的方法，适用于瑞萨官网上大多数样例工程和应用程序。为具备 e² studio、FSP、IAR 或 Keil 使用经验、并希望将样例工程扩展至其他 IDE 的用户提供参考。
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| 传单 | PDF 412 KB | |
| 应用说明 |
PDF
35.58 MB
日本語
AI 生成的摘要:
The document guides users through creating a two-screen GUI application using Azure RTOS GUIX Studio on the EK-RA8D1 kit. It covers setting up the MIPI display controller, touch screen driver, and semaphores for task communication. The guide includes project creation, driver configuration, GUI design, and basic debugging using Renesas Flexible Software Package (FSP) with Azure RTOS ThreadX and GUIX libraries. Required tools include e2 studio IDE, FSP v5.1.0+, and GUIX Studio v6.3.0.1+. The bundled software files include source code for touch drivers and system threads. The document supports rapid embedded GUI development with touch interaction on Renesas RA MCUs.
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| 应用说明 |
PDF
5.76 MB
AI 生成的摘要:
Instructions guide users to run an AWS cloud connectivity project on the CK-RA6M5 board using a Cellular interface. It covers importing, building, and loading the MQTT/TLS application with the Renesas e2 studio IDE and Flexible Software Package v5.0.0. Detailed steps include hardware setup, SIM activation, serial console connection, and AWS IoT configuration. The document emphasizes prerequisites like familiarity with MQTT/TLS, cellular modems, and Renesas development tools. It also explains programming methods, connection settings, and debugging tips to enable seamless cloud communication via LTE Cat-M1 cellular modules.
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| 应用说明 | PDF 5.24 MB | |
| 快速入门指南 | PDF 2.98 MB | |
| 应用说明 |
PDF
20.47 MB
日本語
AI 生成的摘要:
Create a simple two-screen GUI using Azure RTOS GUIX Studio for the EK-RA8D1 kit. Configure the Renesas Flexible Software Package (FSP), which integrates Azure RTOS ThreadX, GUIX library, and hardware drivers, to enable rapid embedded application development. Set up GLCD controller, touch screen driver, and semaphores for task communication. Develop the project in e2 studio with FSP v5.1.0 and GUIX Studio v6.2.1.0. The application responds to touch inputs, demonstrating basic GUI functionality. The package includes source code files and instructions for hardware setup, project creation, and debugging. Download tools and install required software versions before starting development.
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| 手册 - 软件 | PDF 37.70 MB | |
| 手册 - 软件 | PDF 37.12 MB | |
| 应用说明 |
PDF
10.24 MB
AI 生成的摘要:
The document explains how to update the RYZ012 Bluetooth LE module firmware via BLE radio OTA using an EK-RA4M2 board as the host MCU. It details hardware and software requirements, including the EK-RA4M2 kit, PMOD Expansion Board, e2 studio IDE, and TelinkBleOTA app. The firmware update process uses Serial Port Profile (SPP) communication between the host MCU and RYZ012 module. It covers assembly instructions, software setup, and troubleshooting tips for a successful OTA firmware update. The document also provides guidance on project import, build, execution, and BLE initialization.
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| 应用说明 |
PDF
9.01 MB
AI 生成的摘要:
The firmware update process enables the host MCU to program the RYZ012 Bluetooth LE module via a Serial Port Profile (SPP) communication interface. Using the EK-RA4M2 board connected to the RYZ012 PMOD Expansion Board, the host MCU transfers and installs firmware updates to adapt to evolving system requirements. The update requires specific hardware, including the EK-RA4M2 kit, RYZ012 PMOD board with firmware v5.4 or later, and a Windows 10 PC. Software tools include e2 studio IDE, Renesas Flexible Software Package, QE for BLE, SEGGER J-Link RTT Viewer, Tera Term, and GATT Browser. Assembly involves connecting the RYZ012 PMOD to the EK-RA4M2 via PMOD connectors and configuring jumpers for USB communication. The document details the update procedure, project setup, software architecture, and troubleshooting tips for reliable firmware programming.
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| 手册 - 软件 | PDF 35.80 MB | |
| 应用说明 |
PDF
1.86 MB
日本語
AI 生成的摘要:
Firmware upgrade for the RYZ024A module occurs via a host MCU using the RA6M5 on the EK-RA6M5 board. The RYZ024A connects through a PMOD Expansion Board, and firmware files reside on a USB flash drive linked to the EK-RA6M5's USB FS connector. The host MCU transfers the firmware from the USB drive to the RYZ024A, enabling upgrade. The process involves UART communication, USB file access, and specific microcontroller peripherals and FSP modules. The document details hardware/software requirements, peripheral functions, FSP module usage, directory structure, and API commands for executing the upgrade.
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| 应用说明 |
PDF
1.93 MB
日本語
AI 生成的摘要:
The document details a self-test library designed for Renesas RA Family MCUs with Arm Cortex-M33 cores, supporting IEC60730 Class-C safety standards. It covers software routines for CPU instruction decoding, CPU registers, internal memory (ROM and RAM), system clock, and watchdog timer tests. The library operates within Arm TrustZone's secure area to ensure reliable and safe operation by performing tests at startup and periodically during runtime. It includes APIs for anomaly monitoring and separates secure and non-secure code areas. The package includes sample code and a VDE certification certificate, facilitating compliance with household appliance safety requirements.
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| 手册 - 软件 | PDF 35.71 MB | |
| 手册 - 软件 | PDF 35.50 MB | |
| 手册 - 软件 | PDF 35.19 MB | |
| 手册 - 软件 | PDF 34.41 MB | |
| 手册 - 软件 | PDF 34.12 MB | |
| 应用说明 |
PDF
3.82 MB
AI 生成的摘要:
The RA4W1 Group BLE sample application demonstrates Bluetooth Low Energy communication using the RA4W1 device. It covers BLE features, software architecture, protocol stack, and detailed demo project usage including building, debugging, and behavior of GATT Server and Client projects. The document provides implementation examples for various environments such as BareMetal, FreeRTOS, and Azure RTOS, detailing task management, event handling, and API usage. It also includes instructions for creating new projects, configuring BLE modules, managing device-specific and security data, and offers comprehensive support for BLE development with RA4W1.
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| 应用说明 |
PDF
1.61 MB
AI 生成的摘要:
The RA2E2 microcontroller interfaces with the ZMOD4410 sensor module to measure indoor air quality by detecting total volatile organic compounds (TVOC) and estimating carbon dioxide levels. The ZMOD4410 integrates a gas sensing element with a CMOS signal conditioning IC, communicating via I2C. The RA2E2 Fast Prototyping Board supports rapid development with built-in debugging, Arduino Uno and Pmod™ interfaces, and extensive pin access. The RA2E2 MCU features an Arm Cortex-M23 core at up to 48 MHz, multiple communication interfaces including SCI, SPI, and I3C, 64 KB flash memory, and various safety and security functions. Applications include HVAC, air purifiers, thermostats, and smart building controls. The document details hardware schematics, software environment, sensor middleware integration, and operational instructions.
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| 手册 - 软件 | PDF 34.05 MB | |
| 应用说明 | PDF 793 KB | |
| 手册 - 软件 | PDF 33.42 MB | |
| 应用说明 |
PDF
1.64 MB
AI 生成的摘要:
The document explains how to connect Renesas RA MCUs (RA6M3/RA6M4/RA6M5) to Microsoft Azure IoT Cloud using MQTT over TLS. It details the integration of RA Flexible Software Package (FSP) MQTT/TLS modules with the Azure IoT SDK for Embedded C, enabling secure device provisioning, registration, and data exchange via Azure IoT Hub and Device Provisioning Service (DPS). It outlines required development tools, hardware, and prerequisites, and provides step-by-step guidance for building, running, and validating the application on the EK-RA6M5 kit. The document also covers IoT Cloud architecture, MQTT/TLS protocols, and security considerations, serving as a practical reference for embedded developers targeting Azure IoT connectivity.
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| 手册 - 软件 | PDF 33.13 MB | |
| 应用说明 |
PDF
1.82 MB
AI 生成的摘要:
The document explains how to connect Renesas RA MCUs to AWS IoT Core using MQTT and TLS protocols for secure cloud communication. It covers configuring the Flexible Software Package (FSP) modules, including Core MQTT, Mbed TLS, and secure sockets, to enable encrypted data exchange over Ethernet. The guide details setting up AWS IoT Core, generating device certificates, and running an example application on the EK-RA6M3 development kit. It emphasizes MQTT’s lightweight publish/subscribe model and TLS’s role in ensuring data privacy and integrity. Developers learn to integrate secure cloud connectivity into IoT devices using RA MCUs and AWS services.
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| 手册 - 软件 | PDF 32.29 MB | |
| 手册 - 软件 | PDF 28.84 MB | |
| 应用说明 |
PDF
5.08 MB
AI 生成的摘要:
The document guides users through creating a two-screen GUI application using Azure RTOS GUIX Studio on the EK-RA6M3G kit. It covers setting up the Renesas Flexible Software Package (FSP), including ThreadX RTOS, GUIX library, and hardware drivers. Users learn to configure the GLCD controller, touch screen driver, and semaphores for task communication. The guide details installing required tools, creating projects, enabling backlight, and integrating pre-written source code. It also explains basic debugging and GUI creation steps, enabling touchscreen interaction with a simple graphical interface. The zip download includes source files: touch_ft5x06 folder, hal_entry.c, system_thread_entry.c, touch_thread_entry.c, and windows_handler.c.
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| 手册 - 软件 | PDF 27.16 MB | |
| 手册 - 软件 | PDF 26.47 MB | |
| 手册 - 软件 | PDF 24.72 MB | |
| 手册 - 开发工具 | PDF 7.24 MB 日本語 | |
| 手册 - 软件 | PDF 24.57 MB | |
| 应用说明 | PDF 3.27 MB English | |
| 应用说明 | PDF 3.03 MB English | |
| 手册 - 软件 | PDF 23.77 MB | |
| 手册 - 软件 | PDF 21.96 MB | |
| 应用说明 |
PDF
2.78 MB
AI 生成的摘要:
The document explains a motor failure detection system using TensorFlow on the RA6T1 MCU. It integrates motor control and AI-based fault detection by analyzing three-phase motor current via a trained neural network. The system uses FFT preprocessing and a fully connected neural network to identify abnormal motor load conditions. The demo kit includes hardware and software tools for data collection, model training, and motor control. The AI inference runs alongside motor control on a single MCU, improving maintenance efficiency and operational reliability.
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| 应用说明 |
PDF
1.64 MB
AI 生成的摘要:
Trusted Firmware-M (TF-M) integrates with Renesas Flexible Software Package (FSP) v2.0.3 to implement Arm Platform Security Architecture (PSA) specifications on Renesas RA Family MCUs. It supports PSA Certified Level 2 security, providing a secure execution environment using Arm TrustZone technology for Cortex-M33 devices. The package includes tools and hardware requirements for development and demonstrates secure firmware updates. TF-M offers a reference implementation of PSA Functional APIs, enabling secure IoT device design, reducing development complexity, and increasing security confidence through certification.
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| 手册 - 软件 | PDF 21.60 MB | |
| 手册 - 软件 | PDF 21.64 MB | |
| 手册 - 软件 | PDF 21.26 MB | |
| 白皮书 | PDF 907 KB English , 日本語 | |
| 应用说明 |
PDF
1.78 MB
AI 生成的摘要:
The solution demonstrates how to connect Renesas RA MCUs to Microsoft Azure IoT Central using MQTT/TLS over Wi-Fi or Ethernet. It reads on-chip temperature sensor data and publishes it to Azure IoT Core, while also subscribing to LED control commands to toggle LEDs remotely. The project uses Renesas Flexible Software Package (FSP) with embedded Azure C SDK, supporting secure device provisioning and communication. Hardware includes EK-RA6M3 evaluation kit, Wi-Fi PMOD or Ethernet, and a Windows PC. Software requirements cover e2 studio IDE, FSP, GCC toolchain, SEGGER J-Link, and terminal software. Users should have basic knowledge of MQTT/TLS and Renesas development tools.
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| 白皮书 |
PDF
1.98 MB
Automation in homes, buildings, and industries increasingly relies on electric motors. Renesas addresses design challenges with the RA6T1 microcontroller, offering high-precision motor control, reduced costs, and faster development. Paired with evaluation boards and the Motor Workbench 2.0, this solution simplifies motor control implementation, enabling efficient, secure, and innovative designs.
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| 应用说明 |
PDF
1.11 MB
AI 生成的摘要:
Arm® TrustZone® technology divides RA Family microcontrollers into Secure and Non-Secure partitions, enabling secure application development by isolating memory and resources. Secure code accesses both partitions, while Non-Secure code accesses Secure resources only through Non-Secure Callable (NSC) gateways. Development involves creating separate Secure and Non-Secure projects or a Flat project without TrustZone. The RA Project Generator simplifies project setup, managing security attributes, peripheral access, and debugging configurations. Secure code initializes critical functions and controls access, while Non-Secure code interacts via guarded NSC drivers. The document details workflows, memory partitioning, calling conventions, and tooling support for efficient TrustZone implementation.
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| 手册 - 软件 | PDF 20.22 MB | |
| 应用说明 |
PDF
645 KB
AI 生成的摘要:
Steps to migrate existing RA projects to newer FSP versions include installing the latest FSP packs, importing projects into e2 studio, Keil µVision, or IAR EWARM, and configuring projects to use updated software components. The process covers downloading and installing updated software packages, importing project files, selecting appropriate FSP versions, and building and running projects. Detailed instructions guide users through workspace setup, project import, configuration updates, and tool integration for seamless migration across supported RA devices and evaluation kits.
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| 手册 - 软件 | PDF 18.60 MB | |
| 手册 - 软件 | PDF 18.36 MB | |
| 手册 - 软件 | PDF 17.26 MB | |
| 手册 - 软件 | PDF 16.30 MB | |
| 白皮书 | PDF 359 KB English , 日本語 | |
| 白皮书 | PDF 275 KB English , 日本語 | |
| 手册 - 软件 | PDF 9.72 MB | |
| 白皮书 | PDF 341 KB English , 日本語 | |
| 手册 - 软件 | ZIP 265 KB | |
| 白皮书 |
PDF
1.38 MB
日本語
Ensuring security for embedded IoT designs can be challenging and time-consuming, even for experienced developers. Explore six common security challenges and discover how Renesas offers a platform-based approach that leverages the latest advances in both hardware and software to deliver comprehensive, multilayered protection.
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178 项目
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设计和开发
样例程序
样例程序
筛选
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| 类型 | 文档标题 | 日期 日期 |
| 示例代码 | EK-RA2A1 Example Project Bundle
[Software=RA FSP],[Board=EK-RA2A1]
ZIP
8.82 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA2A1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2A1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA2A2 Example Project Bundle
The EK-RA2A2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2A2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA2E1 Example Project Bundle
[Software=RA FSP],[Board=EK-RA2E1]
ZIP
6.16 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA2E1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2E1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA2E2 Example Project Bundle
[Software=RA FSP],[Board=EK-RA2E2]
ZIP
6.12 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA2E2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2E2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA2L1 Example Project Bundle
[Software=RA FSP],[Board=EK-RA2L1]
ZIP
9.65 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA2L1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2L1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA2L2 Example Project Bundle
The EK-RA2L2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2L2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA4E2 Example Project Bundle
[Software=RA FSP],[Board=EK-RA4E2]
ZIP
14.41 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA4E2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4E2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA4M2 Example Project Bundle
[Software=RA FSP],[Board=EK-RA4M2]
ZIP
33.11 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA4M2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4M2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA4M3 Example Project Bundle
[Software=RA FSP],[Board=EK-RA4M3]
ZIP
33.04 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA4M3 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4M3 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA4W1 Example Project Bundle
[Software=RA FSP],[Board=EK-RA4W1]
ZIP
9.07 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA4W1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4W1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA6E2 Example Project Bundle
[Software=RA FSP],[Board=EK-RA6E2]
ZIP
15.58 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA6E2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6E2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA6M1 Example Project Bundle
[Software=RA FSP],[Board=EK-RA6M1]
ZIP
18.64 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA6M1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA6M2 Example Project Bundle
[Software=RA FSP],[Board=EK-RA6M2]
ZIP
18.93 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA6M2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA6M3 Example Project Bundle
[Software=RA FSP],[Board=EK-RA6M3]
ZIP
53.99 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA6M3 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M3 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA6M3G Example Project Bundle
[Software=RA FSP],[Board=EK-RA6M3G]
ZIP
30.04 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA6M3G example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M3G kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA6M4 Example Project Bundle
[Software=RA FSP],[Board=EK-RA6M4]
ZIP
51.43 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
Demonstrates some of the capabilities of the EK and FSP by using multiple peripherals. The example project initializes the Ethernet, USB, ADC, and GPIO modules to create a simple web server and a web client with control via a USB Comm Device class Terminal. Once programmed, the user can control the board by simulating button presses on a web browser and see a regularly updated board configuration on the screen.
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| 示例代码 | EK-RA6M5 Example Project Bundle
[Software=RA FSP],[Board=EK-RA6M5]
ZIP
62.19 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
Demonstrates the typical use of the ADC HAL module APIs. The example project initializes the ADC in single scan or continuous scan mode based on the user selection in the RA configurator. Once initialized, the user can initiate the ADC scan and also stop the scan (in the case of continuous scan mode) using JLinkRTTViewer by sending commands.
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| 示例代码 | FPB-RA0E1 Example Project Bundle
The FPB-RA0E1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA0E1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | FPB-RA0E2 Example Project Bundle
The FPB-RA0E2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA0E2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | FPB-RA0L1 Example Project Bundle
The FPB-RA0L1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA0L1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | FPB-RA2E3 Example Project Bundle
The FPB-RA2E3 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA2E3 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | FPB-RA2T1 Example Project Bundle
The FPB-RA2T1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA2T1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | FPB-RA4E1 Example Project Bundle
[Software=RA FSP],[Board=FPB-RA4E1]
ZIP
10.57 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The FPB-RA4E1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA4E1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | FPB-RA6E1 Example Project Bundle
[Software=RA FSP],[Board=FPB-RA6E1]
ZIP
13.50 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The FPB-RA6E1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA6E1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | MCK-RA4T1 Example Project Bundle
[Software=RA FSP],[Board=MCK-RA4T1]
ZIP
11.87 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The MCK-RA4T1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA4T1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | MCK-RA6T2 Example Project Bundle
[Software=RA FSP],[Board=MCK-RA6T2]
ZIP
7.61 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The MCK-RA6T2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA6T2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | MCK-RA6T3 Example Project Bundle
[Software=RA FSP],[Board=MCK-RA6T3]
ZIP
11.56 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The MCK-RA6T3 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA6T3 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | Quick-Start Example Project for EK-RA2L2
Demonstrates some of the capabilities of the EK-RA2L2 kit and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the USB, ADC, and GPIO modules with control via a USB Comm Device class terminal. Once programmed, the user can control the board using the board buttons and view the regularly updated board configuration on the kit’s information screen.
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| 示例代码 | Quick-Start Example Project for EK-RA4C1
Demonstrates some of the capabilities of the EK-RA4C1 kit and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the QSPI, LPM, SLCD, and GPIO modules to create an interactive user demo.
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| 示例代码 | Quick-Start Example Project for EK-RA8M2
Demonstrates some of the capabilities of the EK-RA8M2 kit and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the OSPI, UART, various timers, and GPIO modules along with various supporting stacks to create an interactive user demo.
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| 示例代码 | Quick-Start Example Project for EK-RA8P1
Demonstrates some of the capabilities of the EK-RA8P1 and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the QSPI, MIPI CSI, GLCD, and GPIO modules along with various supporting stacks to create an interactive user demo.
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| 示例代码 | Quick-Start Example Project for FPB-RA2T1
Demonstrates the capability of the Flexible Software Package (FSP) and FPB-RA2T1 by using multiple peripherals. The example project initializes the NMI and GPIO modules and uses switch (S1) to control the flashing frequency of the user LEDs. Once programmed, the user can control the board by pressing buttons on the device.
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| 示例代码 | Quick-Start Example Project for MCK-RA8T2
Users can modify the operation of MOONS’ permanent magnet synchronous motor R42BLD30L3, including rotation start/stop and speed adjustments, by combining it with the inverter board provided in the MCK‑RA8T2 kit.
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| 示例代码 | RSSK-RA6T1 Example Project Bundle
[Software=RA FSP],[Board=RSSK-RA6T1]
ZIP
6.91 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The RSSK-RA6T1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the RSSK-RA6T1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | EK-RA4C1 Example Project Bundle
The EK-RA4C1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4C1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| 示例代码 | EK-RA4L1 Example Project Bundle
The EK-RA4L1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4L1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| 示例代码 | EK-RA4M1 Example Project Bundle
[Software=RA FSP],[Board=EK-RA4M1]
ZIP
10.16 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA4M1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4M1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| 示例代码 | EK-RA8D1 Example Project Bundle
The EK-RA8D1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8D1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| 示例代码 | EK-RA8D2 Example Project Bundle
The EK-RA8D2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8D2 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| 示例代码 | EK-RA8E2 Example Project Bundle
The EK-RA8E2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8E2 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| 示例代码 | EK-RA8M1 Example Project Bundle
The EK-RA8M1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8M1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| 示例代码 | EK-RA8M2 Example Project Bundle
The EK-RA8M2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8M2 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| 示例代码 | EK-RA8P1 Example Project Bundle
The EK-RA8P1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8P1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| 示例代码 | EK-RA8T2 Example Project Bundle
The EK-RA8T2 example project shows how to write code using various Flexible Software Package (FSP) modules supported by the EK-RA8T2 kit. The FSP provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | FPB-RA0E3 Example Project Bundle
The FPB-RA0E3 example project shows how to write code using various Flexible Software Package (FSP) modules supported by the FPB-RA0E3 kit. The FSP provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| 示例代码 | FPB-RA8E1 Example Project Bundle
The FPB-RA8E1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA8E1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| 示例代码 | MCK-RA8T1 Example Project Bundle
The MCK-RA8T1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA8T1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| 示例代码 | MCK-RA8T2 Example Project Bundle
The MCK-RA8T2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA8T2 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| 示例代码 | Quick-Start Example Project for EK-RA4L1
Demonstrates some of the capabilities of the EK-RA4L1 kit and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the QSPI, LPM, SLCD, and GPIO modules to create an interactive user demo.
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| 示例代码 | Quick-Start Example Project for EK-RA8D2
Demonstrates some of the capabilities of the EK-RA8D2 kit and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the OSPI, MIPI CSI, GLCD, and GPIO modules along with various supporting stacks to create an interactive user demo.
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| 示例代码 | Quick-Start Example Project for EK-RA8T2
Demonstrates some of the capabilities of the EK-RA8T2 and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the OSPI, UART, various timers, and GPIO modules along with various supporting stacks to create an interactive user demo.
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| 示例代码 | Quick-Start Example Project for FPB-RA0E3
Demonstrates the capability of the Flexible Software Package (FSP) and FPB-RA0E3 by using multiple peripherals. The example project initializes the IRQ and GPIO modules and uses SW to control the flashing frequency of the user LEDs. Once programmed, the user can control the board by pressing buttons on the device.
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| 示例代码 | Building a Vision AI Application using the RA8P1 MCU with Ethos-U55 NPU
This application project is designed to provide guidelines for implementing vision AI applications using Renesas RA8P1 MCUs with Ethos-U NPU support.
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| 示例代码 | Injecting and Updating Secure User Keys - Sample Code
Learn how Renesas MCU security revolves around integrated security engines. There are different types of security engines across the RA MCU. Users can find the specific engine used in a particular MCU from its hardware user’s manual. The security engines can operate in two different modes, called Compatibility Mode and Protected Mode. The application note “Renesas Security Engine Operational Modes” explains the definition of the two modes and their use cases.
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| 示例代码 | Reference System Design for Vision AI on EK-RA8D1
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| 示例代码 |
[Software=RA Flexible Software Package|v]
ZIP
2.61 MB
应用:
人工智能, 人机界面（HMI）, 工业, 汽车, 消费电子产品, 通信基础结构
Compiler:
ARMCC
Function:
Application Example
IDE:
e2 studio
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| 示例代码 | VK-RA8M1 Voice Application Combo (VAS, VCR) Project
[Software=RA Flexible Software Package|v]
ZIP
13.99 MB
应用:
人工智能, 人机界面（HMI）, 工业, 汽车, 消费电子产品, 通信基础结构
Compiler:
ARMCC
Function:
Application Example
IDE:
e2 studio
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| 示例代码 | VK-RA8M1 Voice Application Combo (VAS, VCR, SID) Project
[Software=RA Flexible Software Package|v]
ZIP
14.60 MB
应用:
人工智能, 人机界面（HMI）, 工业, 汽车, 消费电子产品, 通信基础结构
Compiler:
ARMCC
Function:
Application Example
IDE:
e2 studio
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| 示例代码 | Voice Kit RA6E1 Voice Application Combo (VAS, VCR) Project
[Software=RA Flexible Software Package|v]
ZIP
13.75 MB
应用:
人工智能, 人机界面（HMI）, 工业, 汽车, 消费电子产品, 通信基础结构
Compiler:
ARMCC
Function:
Application Example
IDE:
e2 studio
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| 示例代码 | Voice Kit RA6E1 Voice Application Combo (VAS, VCR, SID) Project
[Software=RA Flexible Software Package|v]
ZIP
13.62 MB
应用:
人工智能, 人机界面（HMI）, 工业, 汽车, 消费电子产品, 通信基础结构
Compiler:
ARMCC
Function:
Application Example
IDE:
e2 studio
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| 示例代码 | Monitoring of Environment Sensors with the EK-RA2L2 - Sample Code
[Software=RA Flexible Software Package|v6.3.0],[Toolchains=GNU Arm Embedded|13.2.1.arm-13-7]
ZIP
100.52 MB
日本語
Learn how to implement environmental sensor monitoring on the EK‑RA2L2 using a USB Type‑C reference design for RA2L2 MCUs. The sample code demonstrates USB Type‑C CC detection, intermittent environmental sensor measurements using an RTC, and sensor data logging. It also supports real-time display of date and time, sensor data, and USB connection status on a Pmod OLED, as well as transmission of log data to a PC. This makes the sample code ideal for evaluation and demonstration purposes.
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| 示例代码 | RA8 CEU Webcam Getting Started Guide
Learn how to implement an embedded webcam solution in the Renesas RA8 MCU, featuring an integrated Camera Engine Unit (CEU) and advanced networking capabilities.
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| 示例代码 | Using MCUboot with Dual-core RA8 MCUs
Learn multicore application project creation using the MCUboot module on the Renesas EK-RA8P1 kit using FSP v6.4.0, and recreate the bootloader and link the application projects to work with the bootloader using the FSP solution project. Understand the procedures for configuring an application to work with the bootloader, and for downloading and updating a new application image.
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| 示例代码 | Renesas RA Family Establishing and Protecting Device Identity using SCE7 and FAW
The application example provided in this package uses the Secure Crypto Engine (SCE) module based on RA6M3 to generate a device identity unique to each device which is securely stored in the internal flash using the Security Memory Protection Unit (MPU) and the Flash Access Window (FAW) hardware features of the MCU.
ZIP
8.62 MB
Compiler:
ARMCC
IDE:
e2 studio
Guides you in integrating the RA Family SCE7 module with the FSP Mbed Crypto middleware in your design. Explains how to add, configure, and use these components effectively, providing example code as a practical reference and starting point for secure application development.
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| 示例代码 | Quick-Start Example Project for EK-RA8E2
The EK-RA8E2 Example Project demonstrates specific capabilities of the EK and FSP by using multiple peripherals. The project initializes the QSPI, MIPI CSI, GLCD, and GPIO modules along with various supporting stacks to create an interactive user demo.
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| 示例代码 | RA FSP Example Project Porting Guide
Provides the fundamental knowledge needed to port example projects from one RA kit to another. It then demonstrates these principles by explaining how to port three example projects of varying levels of complexity from the MCK-RA4T1 to the FPB-RA4T1.
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| 示例代码 | RA6 Booting Encrypted Image using MCUboot and QSPI
This application project then walks the user through the updates to the bootloader to add encryption for the QSPI based secondary image storage. The application examples implemented image downloading to the QSPI secondary slot over USB PCDC. MCUboot with encryption also supports internal flash encryption.
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| 示例代码 |
ZIP
4.41 MB
Featuring a 1GHz Arm Cortex-M85 and 250MHz Arm Cortex-M33, the RA8 dual-core MCU delivers high performance through asymmetric processing. This sample package provides practical use cases showing how both cores can be leveraged to maximize throughput and responsiveness.
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| 示例代码 | 16-Bit Analog-to-Digital Converter Operation for RA6T2
[Software=RA FSP]
ZIP
2.51 MB
Compiler:
ARMCC
IDE:
e2 studio
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| 示例代码 | Booting Encrypted Image on RA4 using MCUboot and QSPI
This application note walks the user through application project creation using the MCUboot module on Renesas EK-RA4M3 with external QSPI flash as the secondary image storage area. The application examples implemented image downloading to the QSPI secondary slot over USB PCDC. MCUboot with encryption also supports internal flash encryption.
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| 示例代码 | Develop Graphics Applications Using the MIPI DSI Interface on the RA8D1
Provides sample code for the development of a graphics application for the RA8D1 MCU using the MIPI display on the EK-RA8D1 evaluation kit.
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| 示例代码 | Virtual EEPROM Example Using RA4E2
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| 示例代码 |
ZIP
6.56 MB
Learn how to build a secure bootloader for Renesas RA0 and RA2 MCUs using MCUboot with TinyCrypt. This sample package includes bootloader and example application projects to help you implement secure boot functionality.
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| 示例代码 | Getting Started with GUIX Thermostat Application for EK-RA8D2
This thermostat application provides a reference for developing complex dual-core, multi-threaded applications with a touch screen graphical Human Machine Interface (HMI) by using Renesas FSP and Azure RTOS GUIX. It describes steps to create a basic GUIX for FSP, integrates touch driver, handles multiple hardware accesses across cores, manages system updates, and performs event handling.
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| 示例代码 | Injecting Plaintext User Keys
Learn how to inject plaintext keys into RA MCUs using security engines operating in Compatibility Mode. Example projects for various MCUs and security engines demonstrate plaintext key injection with Renesas Flexible Software Package (FSP) APIs and PSA Certified Crypto APIs.
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| 示例代码 | RA2 Secure Firmware Update using MCUboot and Flash Dual Bank
MCUboot is a secure bootloader for 32-bit MCUs. It defines a common infrastructure for the bootloader, defines system flash layout on microcontroller systems, and provides a secure bootloader that enables easy software update. MCUboot is operating system and hardware independent and relies on hardware porting layers from the operating system it works with.
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| 示例代码 |
ZIP
8.34 MB
Explore the development of a graphics application built for the RA8D2 MCU, running on a MIPI graphics expansion board with the RA8D2 evaluation kit. Developers can use this sample code as a reference for integrating graphics functionality and accelerating development on RA8D2-based platforms.
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| 示例代码 | Application Design using RA8 Single Core First Stage Bootloader
Establish the credentials used by the factory boot firmware and the FSBL to verify the OEM firmware. The application project then demonstrates the verification of the firmware using either technique available: Cyclic Redundancy Check 32 (CRC32) integrity verification or Elliptic Curve Cryptography (ECC) NIST P-256 signature authentication combined with HMACSHA256 authentication.
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| 示例代码 | RA AWS Cloud Connectivity and Firmware Update OTA on CK-RA6M5 v2 with Ethernet - Sample Code
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| 示例代码 | Application Design using RA8 Series MCU Decryption On the Fly for OSPI
Use Decryption On-The-Fly (DOTF) with the RA8 MCU Renesas Secure IP (RSIP) in compatibility mode and protected mode. For the Renesas Secure IP (RSIP) compatibility mode, runtime-encrypted data is stored and decrypted using DOTF. For the RSIP protected mode, a securely injected DOTF key is used. This application project also demonstrates how the DOTF feature operates in a dual-core environment using the RA8P1 MCU.
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| 示例代码 | Quick-Start Example Project for FPB-RA0L1
The quick-start example project for FPB-RA0L1 demonstrates some of the capabilities of the Fast Prototyping Board (FPB) and Flexible Software Package (FSP) by using multiple peripherals. The project initializes the IRQ and GPIO modules and uses a switch (SW1) to control the flashing frequency of the user LEDs. Once programmed the user can control the board by using button presses on the device.
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| 示例代码 |
ZIP
248.66 MB
Understanding how to generate cryptographic keys is an important part of leveraging security features offered by RA Family MCUs. This sample code demonstrates how to use the RSIP security engine to generate and securely store a private and public key pair for use with Public Key Infrastructure (PKI)—as well as Certificate Authority (CA) interaction to obtain a device certificate using the public key.
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| 示例代码 | LPM Application Package
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| 示例代码 | Establishing and Protecting Device Identity using SCE9 and Arm® TrustZone® - Sample Code
The application example provided in this package uses the Secure Crypto Engine 9 (SCE9) module based on RA6M4 to generate a pair of ECC keys and uses a local CA to generate the device certificate based on the ECC public key.
ZIP
9.17 MB
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| 示例代码 | Getting Started with ADC Interleaved Mode Application
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| 示例代码 | Digital Filtering using the IIR Filter Accelerator
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| 示例代码 |
Some typical applications for PWM with nanosecond delays are power supply control, motor control, inverter
control, battery charging, digital lightning control, and power factor correction (PFC).
ZIP
924 KB
IDE:
e2 studio
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| 示例代码 | Getting Started with the Graphics Application
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| 示例代码 | Getting Started with GUIX Thermostat Application
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| 示例代码 | Quick-Start Example Project for FPB-RA4E2
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| 示例代码 | Quick-Start Example Project for FPB-RA6E2
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| 示例代码 | ZIP 4.18 MB | |
| 示例代码 | RA8 MCU Advanced Secure Bootloader Design using MCUboot and Code Flash Dualbank Mode
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| 示例代码 | Security Design using Arm TrustZone - Cortex M85
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| 示例代码 | "GUIX Thermostat" for EK-RA8D1 Parallel GLCD Display
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| 示例代码 | Getting Started with Wi-Fi Modules on FSP
The driver for the new module is developed while referencing the existing Wi-Fi driver provided by FSP as a starting point.
ZIP
2.55 MB
IDE:
e2 studio
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| 示例代码 | Security Design with Arm® TrustZone® using Cortex-M33
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| 示例代码 | FPB-RA4T1 Example Project Bundle
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| 示例代码 | FPB-RA6T3 Example Project Bundle
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| 示例代码 | RA AWS MQTT/TLS Cloud Connectivity Solution – Cellular Application Project
[Software=RA FSP|v4.2.0]
ZIP
7.74 MB
Compiler:
GNUARM-None
IDE:
e2 studio
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| 示例代码 | Renesas RA Family HOCO Calibration Using the CAC
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| 示例代码 | Renesas RA Securing Data at Rest Using the Arm® TrustZone® - Sample Code
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| 示例代码 | RA4 Secure Bootloader Using MCUboot and Internal Code Flash - Sample Code
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| 示例代码 | High Performance with RA8 MCU using Arm® Cortex®-M85 core with Helium™
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| 示例代码 | CAN FD Example Using RA4E2 and RA6E2 - Application Project
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| 示例代码 | Securing Data at Rest Utilizing the Renesas Security MPU
This application project discusses the considerations for securing Data at Rest in an embedded system and provides guidelines on how to use the Security MPU hardware feature of the RA Family MCUs to implement a secure Data at Rest solution.
ZIP
2.66 MB
Compiler:
ARMCC
IDE:
e2 studio
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| 示例代码 | GUIX Hello World for EK-RA8D1 MIPI LCD Display
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| 示例代码 | Renesas RA Family Exception Handling
The application project uses the Flexible Software Package (FSP) of
the RA family|| the GNU GCC compiler|| and the integrated development environment e2 studio IDE to
demonstrate an exception handling flow for multiple possible faults.
ZIP
5.66 MB
Compiler:
GNU ARM Embedded
IDE:
e2 studio, Keil
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| 示例代码 | RYZ024A PMOD LTE Connectivity with EK-RA4M2 MCU Quick Start Guide
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| 示例代码 | GUIX "Hello World" for EK-RA8D1 - Sample Code
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| 示例代码 | RYZ012 and RA MCU Firmware Update from BLE Radio OTA
[Software=FSP],[Toolchain=GCC ARM Embedded Toolchain version 10.3.1]
ZIP
10.24 MB
Compiler:
GCC ARM Embedded
IDE:
e2 studio
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| 示例代码 | RYZ012 and RA MCU Firmware Update from Host MCU
[Software=FSP | v4.2.0],[Toolchain=GCC ARM Embedded Toolchain version 10.3.1]
ZIP
10.29 MB
IDE:
e2 studio IDE v2022-10
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| 示例代码 | RYZ024A and RA MCU Firmware Upgrade from Host MCU - Sample Code
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| 示例代码 | IEC 60730/60335 Self Test Library for RA MCU (CM33 Class-C)
[Software=FSP|v3.5.0],[Toolchains=GNU Arm Embedded|10.3.1.20210824]
ZIP
5.84 MB
日本語
应用:
消费电子产品
IDE:
e2 studio
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| 示例代码 | RA2E2 ZMOD4410 Sensor Device Example – Application Project
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| 示例代码 | RA2E2 HS3001 Sensor Device Example – Application Project
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116 项目
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相关评估板和套件
评估
EK-RA2A1
有效
RA2A1 MCU 群组评估套件
EK-RA2A1 评估套件可通过瑞萨电子的灵活软件包 (FSP) 和各种 IDE，帮助用户对 RA2A1 MCU 群组的特性轻松进行评估，并对嵌入系统应用程序进行开发。
入门指南
运行快速入门示例项目
- EK-RA2A1 板具有预先编程过的快速入门示例项目（包含在示例项目包中）。
- 用户可使用连接至 5V 电源的 micro USB 设备电缆，通过 USB 调试端口 (J11) 启动 EK-RA2A1 板。 绿色电源 LED 灯将会亮起。
- 快速入门示例项目将开始运行，红色用户 LED 灯将开始闪烁。
- 请参见 EK-RA2A1 快速入门指南，了解快速入门示例项目的其他功能... 阅读详情
评估
RSSK-RA2L1
有效
RA2L1 电容式触摸评估系统
RA2L1 电容式触摸评估系统使用户能够轻松评估瑞萨电子提供的触摸解决方案。 您可以使用套件中的板和软件即刻开始评估，开箱即用。
产品配置
- RA2L1 CPU 板
- 触摸应用板
- 内置电容式触摸的自电容式评估板基础知识：开关、滑块和滚轮
技术支持
可下载以下项目。
- e2 工作室集成开发环境
- 电容式触摸的 QE
- 快速入门指南
- 说明手册
- 电路图、模式图
评估
EK-RA2L1
有效
RA2L1 MCU 产品组评估套件
EK‑RA2L1 评估套件使用户能够轻松评估 RA2L1 MCU 产品组的各项特性，并借助瑞萨的 Flexible Software Package（FSP） 和 e2 studio IDE 开发嵌入式系统应用。 用户可利用丰富的板载功能，以及选择热门生态系统插件来将丰富创意变为现实。
该套件包含 EK‑RA2L1 v1 板卡以及 micro-USB 设备线缆（Type-A 公头转 micro-B 公头）。
入门指南
运行快速入门示例项目
- EK‑RA2L1 板卡已预先烧录一个快速入门示例项目（源代码包含在 EK‑RA2L1 示例项目包中）。
- 用户可使用连接至 5V 电源的 micro USB... 阅读详情
评估
EK-RA2E1
有效
RA2E1 MCU 群组评估套件
EK-RA2E1 评估套件可通过通过瑞萨电子的灵活软件包 (FSP) 和 e2 studio IDE，帮助用户轻松评估 RA2E1 MCU 产品组的特性，并开发嵌入式系统应用程序。 用户可利用丰富的板载功能以及自选的热门生态系统插件来将丰富创意变为现实。
入门
运行快速入门示例项目
- EK-RA2E1 板具有预先编程过的快速入门示例项目（EK-RA2E1 示例项目包中提供源代码）。
- 用户可使用连接至 5V 电源的 micro USB 设备电缆，通过 USB 调试端口 (J10) 启动 EK-RA2E1 板。 白色电源 LED 指示灯将会亮起... 阅读详情
评估
FPB-RA2E1
有效
RA2E1 快速原型开发板
RA2E1 快速原型开发板搭载 RA2E1 MCU，是专门用于 RA2E1 MCU 各种应用原型开发的评估板。 内置 E2 Lite 仿真器同级别的仿真器电路，无需增设工具即可实现程序的写入/调试。 此外，标配 Arduino Uno™ 和 Pmod™ 接口，并可通过通孔连接微控制器的所有引脚，具有很高的可扩展性。
示例软件可用于演示 RA2E1 MCU 的功能，并促进 RA2E1 快速原型板与各种无线或传感器模块之间的连接。
使用时，请根据各国家/地区的无线电法规使用蓝牙™、LoRa® 和 Wi-Fi。
远程测试该板卡
该板卡已上线云上实验室（Lab on the Cloud)，使用我们的 PC 图形界面，无需实体板卡，便可在虚拟实验室中立即开始配置和测试设计。
评估
EK-RA2E2
有效
RA2E2 MCU 群组评估套件
EK-RA2E2 评估套件可通过通过瑞萨电子的灵活软件包 (FSP) 和 e2 studio IDE，帮助用户轻松评估 RA2E2 MCU 产品组的特性，并开发嵌入式系统应用程序。 用户可利用丰富的板载功能以及自选的热门生态系统插件来将丰富创意变为现实。
入门
运行快速入门示例项目
- EK-RA2E2 板具有预先编程过的快速入门示例项目（EK-RA2E2 示例项目包中提供源代码）。
- 用户可使用连接至 5V 电源的 micro USB 设备电缆，通过 USB 调试端口 (J10) 启动 EK-RA2E2 板。 白色电源 LED 指示灯将会亮起... 阅读详情
评估
EK-RA4M1
有效
RA4M1 MCU 组评估套件
EK-RA4M1 评估套件可通过瑞萨电子的灵活软件包 (FSP) 和各种 IDE，帮助用户对 RA4M1 MCU 群组的特性轻松进行评估，并对嵌入系统应用程序进行开发。
入门指南
运行快速入门示例项目
- EK-RA4M1 板具有预先编程过的快速入门示例项目（包含在示例项目包中）。
- 用户可使用连接至 5V 电源的 micro USB 设备电缆，通过 USB 调试端口 (J11) 启动 EK-RA4M1 板。 绿色电源 LED 灯将会亮起。
- 快速入门示例项目将开始运行，红色用户 LED 灯将开始闪烁。
- 请参阅 EK-RA4M1 – Quick Start Guide (PDF)，了解快速入门示例项目的其他功能... 阅读详情
评估
EK-RA4M2
有效
RA4M2 MCU 群组评估套件
EK-RA4M2 评估套件可通过瑞萨电子的灵活软件包 (FSP) 和 e2 studio IDE，帮助用户轻松评估 RA4M2 MCU 产品组的特性，并开发嵌入式系统应用程序。 用户可利用丰富的板载功能以及自选的热门生态系统插件来将丰富创意变为现实。
入门
运行快速入门示例项目
- EK-RA4M2 板具有预先编程过的快速入门示例项目（EK-RA4M2 示例项目包中提供源代码）。
- 用户可使用连接至 5V 电源的 micro USB 设备电缆，通过 USB 调试端口 (J10) 启动 EK-RA4M2 板。 白色电源 LED 指示灯将会亮起... 阅读详情
评估
EK-RA4M3
有效
RA4M3 MCU 群组评估套件
EK-RA4M3 评估套件可通过瑞萨电子的灵活软件包 (FSP) 和 e2 studio IDE，帮助用户轻松评估 RA4M3 MCU 产品组的特性，并开发嵌入式系统应用程序。 用户可利用丰富的板载功能以及自选的热门生态系统插件来将丰富创意变为现实。
入门
运行快速入门示例项目
- EK-RA4M3 板具有预先编程过的快速入门示例项目（EK-RA4M3 示例项目包中提供源代码）。
- 用户可使用连接至 5V 电源的 micro USB 设备电缆，通过 USB 调试端口 (J10) 启动 EK-RA4M3 板。 白色电源 LED 指示灯将会亮起... 阅读详情
评估
EK-RA4W1
有效
RA4W1 MCU 群组评估套件
EK-RA4W1 评估套件可通过瑞萨电子的灵活配置软件包 (FSP) 和各种 IDE，帮助用户对 RA4W1 MCU 群组的特性轻松进行评估，并对嵌入系统应用程序进行开发。
入门
运行快速入门示例项目
- 用户可使用连接至 5V 电源的 micro USB 设备电缆，通过 USB 调试端口 (J11) 启动 EK-RA4W1 板。绿色电源 LED 灯将会亮起。
- 快速入门示例项目将开始运行，红色用户 LED 灯将开始闪烁。
- 请参见 EK-RA4W1 – Quick Start Guide (ZIP)，了解快速入门示例项目的其他功能... 阅读详情
评估
FPB-RA4E1
有效
RA4E1 MCU 群组快速原型板
RA4E1 快速原型板配备了 R7FA4E10D2CFM 微控制器，是一块专门用于各种应用原型开发的评估板。 板载 SEGGER J-Link™ 仿真器电路，无需额外工具即可以烧写/调试程序。 此外，标配 Arduino Uno 和 Pmod™ 接口，并可通过通孔连接微控制器的所有引脚，具有很高的可扩展性。
样例代码可用于演示 RA4E1 MCU 的功能以及连接 RA4E1 快速原型板和各种无线模块或传感器模块。
使用时，请根据各国家/地区的无线电法规使用 蓝牙™、LoRa® 和 Wi-Fi。
评估
EK-RA6M1
有效
RA6M1 MCU 组评估套件
EK-RA6M1 评估套件可通过瑞萨电子的灵活软件包 (FSP) 和各种 IDE，帮助用户对 RA6M1 MCU 群组的特性轻松进行评估，并对嵌入系统应用程序进行开发。
入门指南
运行快速入门示例项目
- EK-RA6M1 板具有预先编程过的快速入门示例项目（包含在示例项目包中）。
- 用户可使用连接至 5V 电源的 micro USB 设备电缆，通过 USB 调试端口 (J11) 启动 EK-RA6M1 板。 绿色电源 LED 灯将会亮起。
- 快速入门示例项目将开始运行，红色用户 LED 灯将开始闪烁。
- 请参阅 EK-RA6M1 – Quick Start Guide (PDF)，了解快速入门示例项目的其他功能... 阅读详情
评估
EK-RA6M2
有效
RA6M2 MCU 组评估套件
EK-RA6M2 评估套件可通过灵活软件包 (FSP) 和各种 IDE，帮助用户对 RA6M2 MCU 群组的特性轻松进行评估，并对嵌入系统应用程序进行开发。
入门指南
运行快速入门示例项目
- EK-RA6M2 板具有预先编程过的快速入门示例项目（包含在示例项目包中）。
- 用户可使用连接至 5V 电源的 micro USB 设备电缆，通过 USB 调试端口 (J11) 启动 EK-RA6M2 板。 绿色电源 LED 灯将会亮起。
- 快速入门示例项目将开始运行，红色用户 LED 灯将开始闪烁。
- 请参阅 EK-RA6M2 – Quick Start Guide (PDF | English, 日本語)，了解快速入门示例项目的其他功能... 阅读详情
评估
评估
EK-RA6M3
有效
RA6M3 MCU 组评估套件
EK-RA6M3 评估套件可通过 Flexible Software Packaeg（FSP） 和 e2 studio IDE，帮助用户对 RA6M3 MCU 群组的特性进行无缝评估，并对嵌入系统应用程序进行开发。 用户可利用丰富的板载功能，以及选择热门生态系统插件来将丰富创意变为现实。
入门指南
运行快速入门示例项目
- EK-RA6M3 板具有预先编程过的快速入门示例项目（包含在示例项目包中）。
- 用户可使用连接至 5V 电源的 micro USB 设备电缆，通过调试 USB 端口 (J10) 启动 EK-RA6M3 板。 白色电源 LED 指示灯将会亮起。
- 快速入门示例项目将开始运行，红色... 阅读详情
评估
EK-RA6M3G
有效
具备图形扩展板的 RA6M3 MCU 群组评估套件
EK-RA6M3G 评估套件可通过瑞萨电子的灵活软件包（FSP） 和 e2 studio IDE，帮助用户轻松评估 RA6M3 MCU 产品组的特性，并开发嵌入式系统应用程序。 您可利用丰富的板载功能，以及选择热门生态系统插件将丰富创意变为现实。
EK-RA6M3G 套件由两块板组成：EK-RA6M3 板采用 RA6M3 MCU 和片上图形 LCD 控制器，图形扩展板采用 4.3 英寸 TFT 彩色 LCD，带电容式触摸覆盖层。
入门指南
运行快速入门示例项目
- EK-RA6M3 板具有预先编程过的快速入门示例项目（包含在示例项目包中）。
- 将图形扩展板连接至 EK-RA6M3... 阅读详情
评估
EK-RA6M4
有效
RA6M4 MCU 群组评估套件
EK-RA6M4 评估套件可通过灵活配置软件包 (FSP) 和 e2 studio IDE，帮助用户对RA6M4 MCU 群组的特性进行无缝评估，并对嵌入系统应用程序进行开发。用户可利用丰富的板载功能以及自选的热门生态系统插件来将丰富创意变为现实。
入门
运行快速入门示例项目
- EK-RA6M4 已经预先烧录了快速入门示例项目。 (在 EK-RA6M4 Example Project Bundle (ZIP)中提供源代码)
- 用户可使用连接至 5V 电源的 micro USB 设备电缆，通过调试 USB 端口 (J10) 启动 EK-RA6M4 板。白色电源 LED 指示灯将会亮起... 阅读详情
远程测试该板卡
该板卡已上线云上实验室（Lab on the Cloud)，使用我们的 PC 图形界面，无需实体板卡，便可在虚拟实验室中立即开始配置和测试设计。
评估
EK-RA6M5
有效
RA6M5 MCU 群组评估套件
EK-RA6M5 评估套件可通过灵活配置软件包 (FSP) 和 e2 studio IDE，帮助用户对RA6M5 MCU 群组的特性进行无缝评估，并对嵌入系统应用程序进行开发。用户可利用丰富的板载功能以及自选的热门生态系统插件来将丰富创意变为现实。
入门
运行快速入门示例项目
- EK-RA6M5 已经预先烧录了快速入门示例项目。 (在 EK-RA6M5 示例项目包中提供源代码)
- 用户可使用连接至 5V 电源的 micro USB 设备电缆，通过调试 USB 端口 (J10) 启动 EK-RA6M5 板。白色电源 LED 指示灯将会亮起... 阅读详情
开发
Motor Control Evaluation System for RA Family - RA6T1 Group
适用于RA家族RA6T1系列的电机控制评估系统是一款低电压永磁同步电机（无刷直流电机）解决方案，使得任何人轻松进行电机控制评估。 使用可从瑞萨电子网站上下载的硬件和软件套件，立刻进行电机控制评估。
评估
FPB-RA6E1
有效
RA6E1 MCU 群组快速原型板
RA6E1 快速原型板配备了 R7FA6E10F2CFP 微控制器，是一块专门用于各种应用原型开发的评估板。 板载 SEGGER J-Link™ 仿真器电路，无需额外工具即可以烧写/调试程序。 此外，标配 Arduino Uno 和 Pmod™ 接口，并可通过通孔连接微控制器的所有引脚，具有很高的可扩展性。
样例代码可用于演示 RA6E1 MCU 的功能以及连接 RA6E1 快速原型板和各种无线模块或传感器模块。
使用时，请根据各国家/地区的无线电法规使用 蓝牙™、LoRa® 和 Wi-Fi。
开发
MCK-RA6T2
有效
Renesas Flexible Motor Control Kit for RA6T2 MCU Group
MCK-RA6T2 是一款便于评估使用永磁同步电机（无刷直流电机）的电机控制的开发套件。 通过使用本产品以及可从网站下载的样例程序和QE for Motor，即刻开始使用 RA6T2 进行电机控制评估。
视频和培训
学习如何在 e² studio 中使用 RZ/A3UL 评估板套件导入并运行灵活软件包(FSP)示例项目。同样的工作流程也适用于 RZ 和 RA 两个器件系列。本视频将通过三个演示介绍模数转换器(ADC)配置、USB 外设通信设备类(PCDC)以及 LCD 显示控制器(LCDC)。
新闻和博客
额外细节
组件
- CMSIS 兼容包文件适用于 e2 studio 集成开发环境
- BSP 适用于 RA MCU 及板
- HAL 驱动程序可访问外围设备
- 中间件堆栈及协议
- 模块配置器和代码生成器
- 源文件可以与任何开发环境及第三方工具集成
支持的工具链
FSP 中的软件组件支持以下工具链。
- e2 studio集成开发环境，支持GCC Arm Embedded 和 LLVM Embedded Toolchain for Arm 工具链。
- IAR Embedded Workbench
- Arm Keil MDK
软件安装说明
请参考 FSP GitHub 页面上的安装和使用说明：FSP GitHub 说明
e2 studio 集成开发环境
FSP 提供了众多可提高效率的工具，用于开发针对瑞萨电子RA 系列 MCU 设备的项目。 e2 studio 集成系统开发环境提供一个熟悉的开发控制台，从该控制台中，可以管理项目创建、模块选择和配置、代码开发、代码生成以及调试等关键步骤。FSP 使用图形用户界面 (GUI) 来简化高级模块及其关联应用程序接口 (API) 的选择、配置、代码生成和代码开发，从而显著加速开发过程。
e2 studio IDE 配备了一组选项，用于配置应用程序项目的各个方面。其中一些选项包括：
BSP 配置
从初始项目选择中配置或更改 MCU 和板的特定参数
时钟配置
为您的项目配置 MCU 时钟设置。时钟配置显示 MCU 时钟树的图形视图，允许修改各种时钟分频器和时钟脉冲源。
引脚配置
引脚配置提供 MCU 引脚的灵活配置。这样可以配置每个端口引脚的电气特性和功能。由于许多引脚能够提供多种功能，引脚配置器使您可以轻松地在外围设备上配置引脚。引脚配置工具通过突出显示错误并为每个引脚或每个外围设备提供选项，简化了带有高度复用引脚的大型封装的配置。
模块配置
模块配置为基于 RTOS 和非基于 RTOS 的应用程序添加 FSP 模块（HAL 驱动程序、中间件堆栈和 RTOS）提供了选项，并配置了模块的各种参数。对于每个所选的模块，属性窗口提供对配置参数、中断优先权、引脚选择等的访问。
中断配置
中断配置允许添加新的用户中断或事件，并设置中断优先权。它还将允许用户绕过外围设备中断，并为外围设备中断提供用户定义的 ISR。
组件配置
组件配置允许选择或删除应用程序所需的单个模块。针对添加到应用程序中的模块，会自动选择所有必要的模块。您可以勾选所需组件旁的方框，轻松选择或删除其他模块。
QE 工具
电容式触摸 QE是一款在e2 studio集成开发环境下运行应用程序的辅助工具。对于使用电容式触控传感器的嵌入式系统的开发，此工具简化了触摸用户界面的初始设置和灵敏度的调整，从而缩短了开发时间。
"QE for BLE" 是用于在支持低功耗蓝⽛协议栈的系统中，开发嵌入式软件的专用工具。 该解工具可以在e2 studio集成开发环境中运行。e2和“QE for BLE”结合可以轻松地测试低功耗蓝⽛的通信功能。
其他工具功能
- 上下文有关的自动完成功能，能够为完成编程元素提供智能选项
- 开发人员协助工具，用于直接在应用程序代码中选择和拖放 API 函数的位置
- 智能手册，在代码中以正确的工具提示形式提供驱动程序和设备文档
- 编辑悬停功能，在编辑时显示代码元素的详细说明
- 欢迎窗口，显示示例项目、应用程序说明和各种其他自助支持资源的链接
- 信息图标，图形配置查看器提供每个模型的信息图标，该查看器在用户手册中可链接到该模块的特定设计资源。
第三方工具支持
除了瑞萨电子 e2 studio, FSP 还支持第三方工具和 IDE。这些支持工具支持均通过 RA 智能配置器 (RASC) 应用程序提供。瑞萨电子 RA 智能配置器是一个桌面应用程序，让您能够在使用第三方 IDE 和工具链时为瑞萨电子 RA 微控制器配置软件系统（BSP、驱动程序、RTOS 和中间件）。RA 智能配置器目前可与 IAR Embedded Workbench、Keil MDK 和 Arm 编译器 6 工具链一起使用。
